Abstract: A ZnO based oxide semiconductor layer is grown on a sapphire substrate 1 by supplying, for example, raw materials made of Zn and O constituting ZnO and a p-type dopant material made of N without supplying an n-type dopant material (a-step). By stopping the supply of the material of O and further supplying an n-type dopant material made of Ga, the semiconductor layer is doped with the p-type dopant and the n-type dopant, thereby forming a p-type ZnO layer (2a) (b-step). By repeating the steps (a) and (b) plural times, a p-type ZnO based oxide semiconductor layer is grown. As a result, N to be the p-type dopant can be doped in a stable carrier concentration also during high temperature growth in which a residual carrier concentration can be reduced, and the carrier concentration of the p-type layer made of the ZnO based oxide semiconductor can be increased sufficiently.

Abstract: A differential with a differential action limiting mechanism includes a differential mechanism D for distributing the drive force of an internal combustion engine inputted into a differential case 28 to a left-hand axle shaft 13 and a half shaft 11 which continuously connects to a right-hand axle shaft for output therefrom and friction clutches 44L, 44R for limiting differential rotations of the left-hand axle shaft 13 and the half shaft 11 relative to the differential case 28. An actuator A for generating an engagement force for bringing the friction clutches 44L, 44R into engagement is provided outside a housing 14 for accommodating therein the differential case 28, whereby an engagement force generated by the actuator A is transmitted to the friction clutches 44L, 44R via the half shaft 11.

Abstract: A substrate such as a sapphire substrate or the like is set to a molecular beam epitaxy (MBE) apparatus. Next, the temperature of the substrate is elevated to the temperature which is lower than the temperature at which a predetermined ZnO based oxide semiconductor layer (i.e. function layer) is grown (S1). Then, raw materials containing oxygen radical is irradiated to the substrate to grow a buffer layer made of ZnO based oxide semiconductor (S2). Subsequently, the irradiation of oxygen radical is stopped so as to eliminate the influence of oxygen onto the buffer layer (S3). Then, the temperature of the substrate is elevated to the temperature at which the predetermined ZnO based oxide semiconductor layer is grown (S4). After that, raw materials containing oxygen radical is irradiated so as to sequentially grow a ZnO based oxide semiconductor layer as a function layer (S5).

Abstract: A light-emitting device includes a silicon substrate, a ZnOSSe layer provided on the silicon substrate that is lattice-matched to the silicon substrate, and a separate confinement heterostructure light-emitting layer that is provided on the ZnOSSe layer and includes an active layer and upper and lower clad layers.

Abstract: Two sensors are provided on a clutch core. Sensor coils are driven at a high frequency by a high-frequency driving circuit. As the sensors sense a magnetic flux of a magnetic circuit including the clutch core and an armature, the impedance of the sensor coils changes. In accordance with the outputs from the sensor coils at this point, an impedance detecting circuit detects the impedance of the sensor coils. Then, an impedance combining circuit combines the impedance of the sensor coils. On the basis of the combined impedance, a current control circuit controls a current supplied to an exciting coil. Thus, the attracting force of the armature to the core excited by the exciting coil is controlled.

Abstract: The closing plates (61b), (61c) are provided on the both end portions of the cylindrical insulator body (61a), the gas introduction tube for introducing a gaseous substance is inserted into one plate (61b) of the closing plates of the plasma chamber (61) for making the gaseous substance plasmatic within it, and on the other plate (61c), the plasma radiation outlet (61d) is provided. Then, nearby the plasma jet (63) outgoing from the radiation outlet, the electrode (64) for applying a high electric field of an ion trapper is provided so as to be opposed to the grounded electrode (65) interposed the plasma jet between them. This electrode for applying a high electric field is fixed on the grounded metal plate (61e) provided on the other plate (61c) via the insulation porcelain (66) made of MgO or quartz.

Abstract: In the case in which a ZnO based oxide semiconductor layer is to be hetero-epitaxially grown on a substrate formed of a material which is different from that of a ZnO based oxide semiconductor, the ZnO based oxide semiconductor layer is grown at a high temperature of 500° C. or more, and supply of oxygen is stopped and gradual cooling is carried out until a substrate temperature is lowered to 350° C. or less after the growth of the ZnO based oxide semiconductor layer is completed. As a result, it is possible to suppress the generation of dislocations or crystal defects over an epitaxial grown layer based on the atmosphere while the substrate temperature is lowered after the growth of the semiconductor layer and a difference in a coefficient of thermal expansion, thereby obtaining a semiconductor device having a high quality ZnO based oxide semiconductor layer which has an excellent crystalline property and a semiconductor light emitting device having the high characteristics.

Abstract: A piezoelectric ceramic is provided which has a very low loss and superior workability in micro-fabrication. The piezoelectric ceramic contains at least Pb, Mn, Nb, Ti and Zr as primary metal components, in which, when the composition of the piezoelectric ceramic is represented by the formula Pbx{(MnaNbb)yTizZr(1−Y−z)}O3, the x, y, z, a, and b are, on a molar basis, such that 0.95≦x≦0.995, 0.055≦y≦0.10, 0.40≦z≦0.55, 2.01≦b/a≦2.40, and a+b=1. In addition, the average grain diameter of the sintered piezoelectric ceramic is about 2 &mgr;m or less.

Abstract: A ZnO based oxide semiconductor layer is grown on a sapphire substrate 1 by supplying, for example, raw materials made of Zn and O constituting ZnO and a p-type dopant material made of N without supplying an n-type dopant material (a-step). By stopping the supply of the material of O and further supplying an n-type dopant material made of Ga, the semiconductor layer is doped with the p-type dopant and the n-type dopant, thereby forming a p-type ZnO layer (2a) (b-step). By repeating the steps (a) and (b) plural times, a p-type ZnO based oxide semiconductor layer is grown. As a result, N to be the p-type dopant can be doped in a stable carrier concentration also during high temperature growth in which a residual carrier concentration can be reduced, and the carrier concentration of the p-type layer made of the ZnO based oxide semiconductor can be increased sufficiently.

Abstract: In an LED, for example, a light emitting layer forming portion (10) composed of a ZnO based oxide semiconductor is provided on a substrate (11), which includes at least an n-type layer (14) and a p-type layer (16) to form a light emitting layer. The p-type layer (16) contains phosphorus as a dopant. In order to dope such phosphorus, for example, a material having a bond of Zn and P such as Zn3P2 is used when growing a ZnO based oxide semiconductor. As a result, it is possible to obtain a semiconductor device including a p-type ZnO based oxide semiconductor layer having a stable and high carrier concentration and a method of manufacturing the semiconductor device.

Abstract: A substrate such as a sapphire substrate or the like is set to a molecular beam epitaxy (MBE) apparatus. Next, the temperature of the substrate is elevated to the temperature which is lower than the temperature at which a predetermined ZnO based oxide semiconductor layer (i.e. function layer) is grown (S1). Then, raw materials containing oxygen radical is irradiated to the substrate to grow a buffer layer made of ZnO based oxide semiconductor (S2). Subsequently, the irradiation of oxygen radical is stopped so as to eliminate the influence of oxygen onto the buffer layer (S3). Then, the temperature of the substrate is elevated to the temperature at which the predetermined ZnO based oxide semiconductor layer is grown (S4). After that, raw materials containing oxygen radical is irradiated so as to sequentially grow a ZnO based oxide semiconductor layer as a function layer (S5).

Abstract: The closing plates (61b), (61c) are provided on the both end portions of the cylindrical insulator body (61a), the gas introduction tube for introducing a gaseous substance is inserted into one plate (61b) of the closing plates of the plasma chamber (61) for making the gaseous substance plasmatic within it, and on the other plate (61c), the plasma radiation outlet (61d) is provided. Then, nearby the plasma jet (63) outgoing from the radiation outlet, the electrode (64) for applying a high electric field of an ion trapper is provided so as to be opposed to the grounded electrode (65) interposed the plasma jet between them. This electrode for applying a high electric field is fixed on the grounded metal plate (61e) provided on the other plate (61c) via the insulation porcelain (66) made of MgO or quartz.

Abstract: In such a construction that an active layer (5) for emitting light when a current is injected thereto is sandwiched between an n-type clad layer (4) and a p-type clad layer (6) which are made of a material having a larger band gap than that of the active layer, the above-mentioned active layer (5) is made of a compound semiconductor containing Zn, o, and a group VI type element other than O. As a result, it is possible to obtain such a semiconductor light emitting device as a blue type LED or LD, which is made of the harmless material and does not include Cd specifically, while using a ZnO-based compound semiconductor of narrow band gap with fewer crystal defects and excellent in crystallinity as a material of its active layer sandwiched between clad layers, and also improving its light emitting properties.