Abstract: A visible light communication method transmits a signal by visible light communication. The visible light communication method includes modulating the signal into a predetermined blinking pattern, and transmitting the signal by causing visible light to blink according to the predetermined blinking pattern and toward a wall, from a projector disposed in an indoor space surrounded by the wall. The visible light communication method also includes projecting video from the projector toward the wall, wherein the visible light is reflected by the wall to prevent the signal from being received outside of the indoor space, and the signal is used to transmit data related to the video projected to a terminal in the indoor space.

Abstract: An optical device with improved device orientation identifiability is provided without increasing manufacturing cost. An optical device (100) includes an optical element (10), a first lead frame portion (21) with opening hole (23), a second lead frame portion (22), wires (40), and a sealing material (70). A light-receiving or light-emitting surface of the optical element that is disposed in the opening hole and the second lead frame portion are each exposed at least partially from a first surface. On the first surface viewed from the front, the first lead frame portion has a rotation axis extending perpendicular to the first surface that is 180° rotationally symmetrical. The second lead frame portion exposed on the first surface has a shape that is 180° rotationally asymmetric with respect to the rotation axis. The optical element and the first lead frame portion overlap at least partially in a side view.

Abstract: Provided is a photodetection apparatus which includes a mounting board, and an optical sensor device that includes a first surface on the mounting board side and a second surface on a side opposite to the mounting board, and is mounted on the mounting board. The optical sensor device includes an optical sensor that includes a light receiving surface on the second surface side, a signal processing circuit that is electrically connected to the optical sensor, and a lead frame that is provided on the second surface side with respect to the signal processing circuit, and shields a surface of the signal processing circuit on the second surface side. The mounting board has a conductive pattern that faces the signal processing circuit and shields a surface of the signal processing circuit on the first surface side.

Abstract: A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.

Abstract: Provided is a photodetection apparatus which includes a mounting board, and an optical sensor device that includes a first surface on the mounting board side and a second surface on a side opposite to the mounting board, and is mounted on the mounting board. The optical sensor device includes an optical sensor that includes a light receiving surface on the second surface side, a signal processing circuit that is electrically connected to the optical sensor, and a lead frame that is provided on the second surface side with respect to the signal processing circuit, and shields a surface of the signal processing circuit on the second surface side. The mounting board has a conductive pattern that faces the signal processing circuit and shields a surface of the signal processing circuit on the first surface side.

Abstract: A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.

Abstract: An electronic device that includes a base member made of a material containing metal atoms, the base member having a bonding surface, and the bonding surface contains oxides of the metal atoms; an electronic element is mounted on the base member; an organic structure on the bonding surface of the base member; and a cover member bonded to the bonding surface of the base member via the organic structure so as to encapsulate the electronic element in a space between the base member and the cover member.

Abstract: A vehicle-body structure comprises a pair of right-and-left crash cans provided at an end portion of a vehicle body, being spaced apart from each other in a vehicle width direction, a bumper reinforcement extending in the vehicle width direction and connecting respective tip portions of the crash cans, set plates interposed between each of the crash cans and a vehicle-body side frame, wherein each of the crash cans is fixed to the vehicle-body side frame via the set plates, and a brace extending obliquely, in a plan view, from an inward side, in the vehicle width direction, of the crash can or the set plate to the bumper reinforcement such that a space is formed, in the vehicle with direction, between the brace and the crash can. The brace is fixedly joined to a lower face of the bumper reinforcement.

Abstract: A recessed portion is formed at a frame member provided at a rear portion of a vehicle body and having a closed cross section extending in a vehicle longitudinal direction such that a part of a lower face of the frame member is recessed upwardly, where a damper of a rear suspension is inserted and fixed. A front portion of the frame member is joined to a side sill extending in the vehicle longitudinal direction at a position offset outwardly in a vehicle width direction from the frame member. Branch-shaped closed cross sections branching off from the closed cross section inwardly and outwardly relative to the damper are formed at a position corresponding to the recessed portion of the frame member. A portion of the frame member located at the above-described position is wide outwardly.

Abstract: The optical device includes a photoelectric conversion block including a photoelectric conversion chip configured to include photoelectric conversion elements arranged in a matrix and a first sealing member configured to cover side faces of the photoelectric conversion chip to expose the photoelectric conversion chip and a lens block including a lens and a second sealing member configured to cover side faces of the lens to expose one surface and an other surface of the lens. In the lens block, the one surface of the lens and the second sealing member forms a recessed portion, at least a part of a bottom surface of the recessed portion being formed by the one surface of the lens, a sidewall of the recessed portion being formed by the second sealing member, and the recessed portion being arranged such that the photoelectric conversion chip exposed from the first sealing member is covered.

Abstract: A recessed portion is formed at a frame member provided at a rear portion of a vehicle body and having a closed cross section extending in a vehicle longitudinal direction such that a part of a lower face of the frame member is recessed upwardly, where a damper of a rear suspension is inserted and fixed. Closed cross sections are formed at a position corresponding to the recessed portion, in a longitudinal direction, of the frame member. The closed cross sections are configured to branch off from the closed cross section inwardly and outwardly in the vehicle width direction relative to the damper. A ridgeline extending in the vehicle longitudinal direction is formed at least at a portion of the frame member which is positioned in front of the recessed portion.

Abstract: A lighting-up device includes: a power supply circuit which supplies power to a light source; a wireless communication circuit including an antenna; and a metallic casing which includes metal, and houses the power supply circuit and the wireless communication circuit. The metallic casing has a first side face and a second side face which share a side, the first side face is provided with a first slit which extends in a first direction intersecting with the side, from a first portion of the side other than both ends of the side, the second side face is provided with a second slit which extends in a second direction intersecting with the side, from a second portion of the side other than the both ends of the side, and each of the first slit and the second slit is electromagnetically coupled to the antenna and functions as a slot antenna.

Abstract: The optical device includes a photoelectric conversion block including a photoelectric conversion chip configured to include photoelectric conversion elements arranged in a matrix and a first sealing member configured to cover side faces of the photoelectric conversion chip to expose the photoelectric conversion chip and a lens block including a lens and a second sealing member configured to cover side faces of the lens to expose one surface and an other surface of the lens. In the lens block, the one surface of the lens and the second sealing member forms a recessed portion, at least a part of a bottom surface of the recessed portion being formed by the one surface of the lens, a sidewall of the recessed portion being formed by the second sealing member, and the recessed portion being arranged such that the photoelectric conversion chip exposed from the first sealing member is covered.

Abstract: A vehicle-body structure comprises a pair of right-and-left crash cans provided at an end portion of a vehicle body, being spaced apart from each other in a vehicle width direction, a bumper reinforcement extending in the vehicle width direction and connecting respective tip portions of the crash cans, set plates interposed between each of the crash cans and a vehicle-body side frame, wherein each of the crash cans is fixed to the vehicle-body side frame via the set plates, and a brace extending obliquely, in a plan view, from an inward side, in the vehicle width direction, of the crash can or the set plate to the bumper reinforcement such that a space is formed, in the vehicle with direction, between the brace and the crash can. The brace is fixedly joined to a lower face of the bumper reinforcement.

Abstract: A multilayer ceramic electronic component includes a first organic layer located on both principal surfaces and both side surfaces in contact with a first external electrode, and a second organic layer located on the both principal surfaces and the both side surfaces in contact with a second external electrode. The first organic layer includes an organic silicon compound and covers an end of a first base electrode layer of the first external electrode, and the second organic layer includes an organic silicon compound and covers an end of a second base electrode layer of the second external electrode. A first plating layer of the first external electrode includes an end in contact with the surface of the first organic layer, and a second plating layer of the second external electrode includes an end in contact with the surface of the second organic layer.

Abstract: A recessed portion is formed at a frame member provided at a rear portion of a vehicle body and having a closed cross section extending in a vehicle longitudinal direction such that a part of a lower face of the frame member is recessed upwardly, where a damper of a rear suspension is inserted and fixed. Closed cross sections are formed at a position corresponding to the recessed portion, in a longitudinal direction, of the frame member. The closed cross sections are configured to branch off from the closed cross section inwardly and outwardly in the vehicle width direction relative to the damper. A ridgeline extending in the vehicle longitudinal direction is formed at least at a portion of the frame member which is positioned in front of the recessed portion.

Abstract: A recessed portion is formed at a frame member provided at a rear portion of a vehicle body and having a closed cross section extending in a vehicle longitudinal direction such that a part of a lower face of the frame member is recessed upwardly, where a damper of a rear suspension is inserted and fixed. A front portion of the frame member is joined to a side sill extending in the vehicle longitudinal direction at a position offset outwardly in a vehicle width direction from the frame member. Branch-shaped closed cross sections branching off from the closed cross section inwardly and outwardly relative to the damper are formed at a position corresponding to the recessed portion of the frame member. A portion of the frame member located at the above-described position is wide outwardly.

Abstract: A lighting fixture for attaching to an attachment component is provided. A lamp includes a light source that emits illumination light. A power supply includes a power supply circuit that generates power for causing the light source to emit the illumination light and a power supply housing that houses the power supply circuit. An arm couples the lamp and the power supply and rotatably supports the lamp. The power supply housing houses an infrared communication receiver that receives an infrared signal for controlling the lighting fixture and a radio communication circuit that receives a radio signal for controlling the lighting fixture. The power supply housing includes a first opening through which the infrared communication receiver receives the infrared signal.

Abstract: A multilayer ceramic electronic component includes a first organic layer that covers from a first base electrode layer to at least a portion of a surface of a laminated body, a second organic layer that covers from a second base electrode layer to at least a portion of the surface of the laminated body, a first plating layer that includes a leading end in contact with the first organic layer and that has an atomic concentration ratio of Si to Cu of about 1% or more and about 5% or less between a Cu concentration and an Si concentration at the surface of the first organic layer, and a second plating layer that includes a leading end in contact with the second organic layer and that has an atomic concentration ratio of Si to Cu being about 1% or more and about 5% or less between a Cu concentration and an Si concentration at the surface of the second organic layer.

Abstract: A multilayer ceramic electronic component includes a first plating layer in contact with a first organic layer and a second plating layer in contact with a second organic layer. When the first organic layer disposed on a first base electrode layer located on a first principal surface or a second principal surface, or the second organic layer disposed on a second base electrode layer located thereon, is referred to as an organic layer principal surface portion, and when the first organic layer disposed on the first base electrode layer located on a first end surface or a second end surface, or the second organic layer disposed on the second base electrode layer located thereon, is referred to as an organic layer end surface portion, the surface roughness of the organic layer end surface portion is larger than the surface roughness of the organic layer principal surface portion.