Abstract: A method of manufacturing a piezoelectric component includes forming an unhardened first elastic material partially on at least a pair of end portions of a piezoelectric element, the pair of end portions including an edge portion of the piezoelectric element, hardening the first elastic material, forming an unhardened second elastic material on the entire circumference of the piezoelectric element and the first elastic material, hardening the second elastic material, forming an unhardened outer-cladding resin on the entire circumference of the second elastic material covering the piezoelectric element and the first elastic material, and hardening the outer-cladding resin.

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract: An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.

Abstract: An elongation amount of electronic parts to be bonded onto a substrate by thermocompression is accurately controlled, and thereby poor connection of the electronic parts is prevented. An electronic part compression bonding apparatus according to the present invention includes a compression bonding unit (41) which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit (48), a pressure control unit (83) which controls pressure, a heating unit (43) which heats the compression bonding unit (41), a temperature control unit (85), and a thermocompression bonding control unit (80) which controls the pressure control unit (83) and the heating unit (43) based on thermocompression bonding condition data in which at least one of pressure and heating temperature is variably set during a process from start until completion of a thermocompression bonding operation of the electronic parts.

Abstract: With regard to a stabilization control which is executed while compression stroke injection is executed in an engine warming-up process, an execution period of the stabilization control is limited to a period until when an elapsed time since an engine is started reaches a predetermined time. Accordingly, after the elapsed time reaches a predetermined time, it is possible to suppress an unnecessary increase in a fuel injection amount or unnecessary advance of ignition timing by the stabilization control. Also, when an increase in the temperature of a catalyst is completed in the engine warming-up process, and a fuel injection mode is switched from the compression stroke injection to intake stroke injection, the stabilization control is restarted.

Abstract: A fuel cell system including a fuel cell, an air compressor for supplying compressed air to the fuel cell, an expander for recovering energy from the air discharged from the fuel cell, and a heat exchanger for exchanging heat between the air discharged from the compressor and the air discharged from the fuel cell. The air discharged from the fuel cell is supplied to the expander after flowing through the heat exchanger.

Abstract: A semiconductor device for power control includes a substrate made of aluminum. Lands of copper are formed on the substrate. Semiconductor chips, such as FETs, are mounted on the lands. The semiconductor chips are joined with the lands only through solder layers. A synthetic resin, which includes epoxide, covers the lands, the solder layers and the semiconductor chips on the substrate. Preferably, a coefficient of expansion of the synthetic resin is generally less than a coefficient of expansion of the substrate or a coefficient of expansion of the lands. Each semiconductor chip defines at least two corners positioned generally opposite to each other. Each land defines at least two corners disposed in proximity to the corners of the semiconductor chip. The corners of the land generally confine the corners of the semiconductor chip therein.

Abstract: Provided is a hair cosmetic composition containing (A) an amphipathic amide lipid, (B) a cationic surfactant or a tertiary amine type compound represented by the following formula (N): 1

Abstract: Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.

Abstract: With regard to a stabilization control which is executed while compression stroke injection is executed in an engine warming-up process, an execution period of the stabilization control is limited to a period until when an elapsed time since an engine is started reaches a predetermined time. Accordingly, after the elapsed time reaches a predetermined time, it is possible to suppress an unnecessary increase in a fuel injection amount or unnecessary advance of ignition timing by the stabilization control. Also, when an increase in the temperature of a catalyst is completed in the engine warming-up process, and a fuel injection mode is switched from the compression stroke injection to intake stroke injection, the stabilization control is restarted.

Abstract: A compound of the formula (1): 1

Abstract: A four-degree-of-freedom parallel robot capable of displacing a traveling plate with four degrees of freedom at a high speed and a high acceleration and positioning the traveling plate with high rigidity and high precision. The four-degree-of-freedom parallel robot has four actuators fixed to a base, four parallel linkages each of which is coupled at its upper end to a tip end of an arm of each of the actuators through a kinematic element such as a universal joint, and a traveling plate whose four corners are coupled to lower ends of the parallel linkages through kinematic elements. By controlling the actuators, a main member of the traveling plate is displaced with four degrees of freedom, i.e., translated in all directions and rotated around a predetermined axis. Only axial forces are applied to rods constituting the parallel linkages. Thus, the traveling plate can be positioned at a high speed and with high rigidity as well as high precision.

Abstract: An anisotropically electroconductive adhesive comprising a thermosetting insulating adhesive mixed with electroconductive particles, the thermosetting insulating adhesive having an intrinsic acoustic impedance of about 1.4 MPa·s/m or less is provided. Piezoelectric resonators are bonded to lands on an insulating substrate using this anisotropically electroconductive adhesive. The piezoelectric resonators are connected in a ladder type to form a ladder filter by pattern electrodes on the insulating substrate. When a filter is prepared using piezoelectric resonators, this anisotropically electroconductive adhesive can provide good filter characteristics without propagating the vibration of the piezoelectric resonators to the insulating substrate.

Abstract: A compound of the formula (1): 1

Abstract: A piezoelectric component includes a substantially rectangular shaped piezoelectric element, a first elastic material covering at least a pair of end portions of the piezoelectric element, the pair of end portions including edge parts of the piezoelectric element, a second elastic material covering the entire piezoelectric element and the first elastic material, and an outer-cladding resin covering the whole circumference of the piezoelectric element which is covered with the second elastic material.

Abstract: A semiconductor device for power control includes a substrate made of aluminum. Lands of copper are formed on the substrate. Semiconductor chips, such as FETs, are mounted on the lands. The semiconductor chips are joined with the lands only through solder layers. A synthetic resin, which includes epoxide, covers the lands, the solder layers and the semiconductor chips on the substrate. Preferably, a coefficient of expansion of the synthetic resin is generally less than a coefficient of expansion of the substrate or a coefficient of expansion of the lands. Each semiconductor chip defines at least two corners positioned generally opposite to each other. Each land defines at least two corners disposed in proximity to the corners of the semiconductor chip. The corners of the land generally confine the corners of the semiconductor chip therein.

Abstract: A piezoelectric component includes a substantially rectangular shaped piezoelectric element, a first elastic material covering at least a pair of end portions of the piezoelectric element, the pair of end portions including edge parts of the piezoelectric element, a second elastic material covering the entire piezoelectric element and the first elastic material, and an outer-cladding resin covering the whole circumference of the piezoelectric element which is covered with the second elastic material.

Abstract: An anisotropically electroconductive adhesive comprising a thermosetting insulating adhesive mixed with electroconductive particles, the thermosetting insulating adhesive having an intrinsic acoustic impedance of about 1.4 MPa·s/m or less is provided. Piezoelectric resonators are bonded to lands on an insulating substrate using this anisotropically electroconductive adhesive. The piezoelectric resonators are connected in a ladder type to form a ladder filter by pattern electrodes on the insulating substrate. When a filter is prepared using piezoelectric resonators, this anisotropically electroconductive adhesive can provide good filter characteristics without propagating the vibration of the piezoelectric resonators to the insulating substrate.

Abstract: An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

Abstract: A polishing pad for pressing a work to be polished to a surface thereof, includes a structure obtained by being compressed under a temperature which is higher than an operating temperature for polishing the work and/or under a pressure which is equal or higher than an operating pressure for polishing the work. A method for polishing a includes the step of polishing the work by using the polishing pad.