Abstract: A refrigeration cycle apparatus includes a main circuit and a bypass circuit. The main circuit includes: a compressor; a first condenser; a first refrigerant-to-refrigerant heat exchanger; a first expansion device; a first branching portion; a first evaporator; a third branching; and a fourth branching portion. The bypass includes: a second expansion device; the first refrigerant-to-refrigerant heat exchanger; and a second branching portion. The second branching portion includes a liquid outflow pipe and a gas outflow pipe. The liquid outflow pipe defines one outlet for the refrigerant and is located below the gas outflow pipe. The gas outflow pipe defines another outlet for the refrigerant and is located above the liquid outflow pipe. The one outlet of the second branching portion communicates with the third branching portion. The other outlet of the second branching portion communicates with the fourth branching portion.

Abstract: A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less.

Abstract: The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.

Abstract: There is provided a filter which includes a fiber layer and an adsorbent. The fiber layer includes fiber. The adsorbent is held in the fiber and adsorbs a chemical substance. The filter is divided into a plurality of sections by a fold. Each of the plurality of sections includes a first end portion positioned along the fold, a center portion adjacent to the first end portion, and a second end portion which counterposes the first end portion with the center portion interposed. The density of the adsorbent at the center portion is greater than the density of the adsorbent at the first end portion and at the second end portion.

Abstract: A laminated nonwoven fabric includes first to third nonwoven fabrics and an adhesive sandwiched between at least the second nonwoven fabric and the third nonwoven fabric. The second nonwoven fabric contains second fibers and is laminated on the first nonwoven fabric containing first fibers, and the third nonwoven fabric contains third fibers and is laminated on the second nonwoven fabric on an opposite side to the first nonwoven fabric. An average fiber diameter of the first fibers is larger than that of the second fibers. The second nonwoven fabric has first and second regions which exist mixedly with each other, and a density of the second fibers in the second region is lower than that in the first region. A part of the adhesive is present between a portion of the first nonwoven and a portion of the third nonwoven fabric which face the second region.

Abstract: A laminate includes a first sheet containing first fibers, a second sheet laminated on the first sheet and containing second fibers, and an adhesive disposed between the first sheet and the second sheet. At least a part of the adhesive is disposed in an end portion along the edge side of the laminate so as to form a linear first region, and the first sheet is adhered to the second sheet via the first region. Alternatively, a mass per unit area of the adhesive present in an end portion along an edge side of the laminate is larger than a mass per unit area of the adhesive present in a portion near a central part of the laminate rather than the end portion.

Abstract: There is provided a stacked body which includes a porous base layer, a porous charged layer, a very fine-fiber layer, and an adsorbent. The base layer is configured with base fiber. The charged layer is configured with charged fiber. The very fine-fiber layer is interposed between the base layer and the charged layer and includes very fine fiber. The adsorbent is held in the very fine fiber and adsorbs a chemical substance. An average fiber diameter of the charged fiber is greater than an average fiber diameter of the very fine fiber.

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

Abstract: A fiber laminate includes a first fiber sheet containing first fibers, a second fiber sheet laminated on the first fiber sheet and containing second fibers, and an adhesive interposed between the first fiber sheet and the second fiber sheet. The adhesive is disposed to form a linear first region in the fiber laminate when viewed from a normal direction of a principal surface of the fiber laminate. The first fiber sheet and the second fiber sheet are adhered to each other via the first region. A gap is formed between the first fiber sheet and the second fiber sheet in a second region other than the first region.

Abstract: A laminated nonwoven fabric includes a first nonwoven fabric that comprises first fibers, and a second nonwoven fabric that comprises second fibers. The second nonwoven fabric is laminated on the first nonwoven fabric. An average fiber diameter D1 of the first fibers and an average fiber diameter D2 of the second fibers satisfy a relation of D1>D2. In viewed from a side of a principal surface of the second nonwoven fabric being not opposed to the first nonwoven fabric, a total area of first portions of the second fibers superimposed on the first fibers and existing on the nearer side than the first fibers is larger than a total area of second portions of the second fibers existing and superimposed on voids S of the first nonwoven fabric formed of the first fibers.

Abstract: A laminated nonwoven fabric includes a first nonwoven fabric containing first fibers, a second nonwoven fabric containing second fibers, a third nonwoven fabric containing third fibers, and an adhesive. The second nonwoven fabric is laminated on the first nonwoven fabric, and the third nonwoven fabric is laminated on the second nonwoven fabric on an opposite side with respect to the first nonwoven fabric. The adhesive is disposed between the first nonwoven fabric and the third nonwoven fabric. An average fiber diameter of the second fibers is equal to or less than 3 ?m, and is smaller than an average fiber diameter of the first fibers. The third nonwoven fabric has a protrusion including a part of the third fibers entangled with each other on a surface facing the second nonwoven fabric. At least a part of the adhesive is disposed between the protrusion and the first nonwoven fabric.

Abstract: A laminated nonwoven fabric includes a first nonwoven fabric and a second nonwoven fabric. The first nonwoven fabric contains charged first fibers. The second nonwoven fabric contains second fibers, and is laminated on the first nonwoven fabric. A fiber diameter of the first fibers is larger than a fiber diameter of the second fibers.

Abstract: Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.

Abstract: The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.

Abstract: There is provided a filter which includes a fiber layer and an adsorbent. The fiber layer includes fiber. The adsorbent is held in the fiber and adsorbs a chemical substance. The filter is divided into a plurality of sections by a fold. Each of the plurality of sections includes a first end portion positioned along the fold, a center portion adjacent to the first end portion, and a second end portion which counterposes the first end portion with the center portion interposed. The density of the adsorbent at the center portion is greater than the density of the adsorbent at the first end portion and at the second end portion.

Abstract: There is provided a stacked body which includes a porous base layer, a porous charged layer, a very fine-fiber layer, and an adsorbent. The base layer is configured with base fiber. The charged layer is configured with charged fiber. The very fine-fiber layer is interposed between the base layer and the charged layer and includes very fine fiber. The adsorbent is held in the very fine fiber and adsorbs a chemical substance. An average fiber diameter of the charged fiber is greater than an average fiber diameter of the very fine fiber.

Abstract: A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

Abstract: Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.