Abstract: A fiber laminate includes a first fiber sheet containing first fibers, a second fiber sheet laminated on the first fiber sheet and containing second fibers, and an adhesive interposed between the first fiber sheet and the second fiber sheet. The adhesive is disposed to form a linear first region in the fiber laminate when viewed from a normal direction of a principal surface of the fiber laminate. The first fiber sheet and the second fiber sheet are adhered to each other via the first region. A gap is formed between the first fiber sheet and the second fiber sheet in a second region other than the first region.

Abstract: Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

Abstract: A laminate includes a first sheet containing first fibers, a second sheet laminated on the first sheet and containing second fibers, and an adhesive disposed between the first sheet and the second sheet. At least a part of the adhesive is disposed in an end portion along the edge side of the laminate so as to form a linear first region, and the first sheet is adhered to the second sheet via the first region. Alternatively, a mass per unit area of the adhesive present in an end portion along an edge side of the laminate is larger than a mass per unit area of the adhesive present in a portion near a central part of the laminate rather than the end portion.

Abstract: A laminated nonwoven fabric includes first to third nonwoven fabrics and an adhesive sandwiched between at least the second nonwoven fabric and the third nonwoven fabric. The second nonwoven fabric contains second fibers and is laminated on the first nonwoven fabric containing first fibers, and the third nonwoven fabric contains third fibers and is laminated on the second nonwoven fabric on an opposite side to the first nonwoven fabric. An average fiber diameter of the first fibers is larger than that of the second fibers. The second nonwoven fabric has first and second regions which exist mixedly with each other, and a density of the second fibers in the second region is lower than that in the first region. A part of the adhesive is present between a portion of the first nonwoven and a portion of the third nonwoven fabric which face the second region.

Abstract: A laminated nonwoven fabric includes a first nonwoven fabric containing first fibers, a second nonwoven fabric laminated on the first nonwoven fabric and containing second fibers, a third nonwoven fabric laminated on the second nonwoven fabric on an opposite side to the first nonwoven fabric and containing third fibers, and an adhesive containing a plurality of particles. Some of the plurality of particles of the adhesive is attached to the second nonwoven fabric. At least one of the first nonwoven fabric and the third nonwoven fabric is adhered to the second nonwoven fabric via the some of the plurality of particles of the adhesive. An average fiber diameter of the first fibers is larger than the average fiber diameter of the second fibers, and an average particle diameter of the plurality of particles of the adhesive is smaller than the average fiber diameter of the first fibers.

Abstract: An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon.

Abstract: A laminated nonwoven fabric includes a first nonwoven fabric containing first fibers, a second nonwoven fabric containing second fibers, a third nonwoven fabric containing third fibers, and an adhesive. The second nonwoven fabric is laminated on the first nonwoven fabric, and the third nonwoven fabric is laminated on the second nonwoven fabric on an opposite side with respect to the first nonwoven fabric. The adhesive is disposed between the first nonwoven fabric and the third nonwoven fabric. An average fiber diameter of the second fibers is equal to or less than 3 ?m, and is smaller than an average fiber diameter of the first fibers. The third nonwoven fabric has a protrusion including a part of the third fibers entangled with each other on a surface facing the second nonwoven fabric. At least a part of the adhesive is disposed between the protrusion and the first nonwoven fabric.

Abstract: A laminated nonwoven fabric includes a first nonwoven fabric and a second nonwoven fabric. The first nonwoven fabric contains charged first fibers. The second nonwoven fabric contains second fibers, and is laminated on the first nonwoven fabric. A fiber diameter of the first fibers is larger than a fiber diameter of the second fibers.

Abstract: Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern.

Abstract: A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.

Abstract: A nonwoven fabric includes a nanofiber. The nanofiber includes a core portion and a sheath portion covering at least a part of a surface of the core portion. The core portion includes a first polymer. The sheath portion includes a second polymer. The second polymer is smaller in polarity than the first polymer.

Abstract: A laminated nonwoven fabric includes a first nonwoven fabric that comprises first fibers, and a second nonwoven fabric that comprises second fibers. The second nonwoven fabric is laminated on the first nonwoven fabric. An average fiber diameter D1 of the first fibers and an average fiber diameter D2 of the second fibers satisfy a relation of D1>D2. In viewed from a side of a principal surface of the second nonwoven fabric being not opposed to the first nonwoven fabric, a total area of first portions of the second fibers superimposed on the first fibers and existing on the nearer side than the first fibers is larger than a total area of second portions of the second fibers existing and superimposed on voids S of the first nonwoven fabric formed of the first fibers.

Abstract: A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.

Abstract: Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

Abstract: Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern.

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

Abstract: The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.

Abstract: Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.

Abstract: Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.

Abstract: A substrate backing device places and holds a rigid substrate thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate thereto. The substrate backing device includes a plate-shaped backing plate provided with a backing support surface adapted to come into contact with the lower surface of the rigid substrate for supporting it. The backing support surface is provided with an opening portion having a planar opening shape encompassing the area of the rigid substrate to be compressively bonded to the flexible substrate. The backing support surface is provided, within the opening portion, a receiving member which, during the thermocompression bonding operations, come into contact with the lower surface of the rigid substrate and with an already-mounted component having been preliminarily mounted on this lower surface in the compression-bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force.