Patents by Inventor Koji Nakanishi

Koji Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220375831
    Abstract: A lead frame includes a first frame member including a die pad; a second frame member that is layered on the first frame member and that includes a lead; and a resin with which a space around the die pad and the lead is filled, wherein the die pad includes a rising portion and a buried portion, the rising portion rises from the resin, the buried portion is buried in the resin and has a mount surface on which a semiconductor element is to be mounted and a side surface that is continuous to the mount surface, and the side surface is covered with the resin and has a constriction that is depressed in a direction parallel to the mount surface.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 24, 2022
    Inventors: Tetsuichiro Kasahara, Tsukasa Nakanishi, Koji Watanabe, Jun Izuoka
  • Patent number: 11499093
    Abstract: A rare earth complex including a rare earth ion and a ligand coordinated with the rare earth ion and having a condensed polycyclic aromatic group.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: November 15, 2022
    Assignee: NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY
    Inventors: Yuichi Kitagawa, Fumiya Suzue, Takayuki Nakanishi, Koji Fushimi, Yasuchika Hasegawa
  • Patent number: 11491892
    Abstract: A selection apparatus includes an acquirer configured to acquire information of a usage state of at least one reuse component before being reused and a purpose of use of the at least one reused component; and a selector configured to select a reused component suitable for the purpose of use based on the usage state.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: November 8, 2022
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Koji Nakanishi
  • Patent number: 11490025
    Abstract: A method includes setting an exposure time of an image sensor included in a terminal device so that, in an image obtained by capturing a subject by the image sensor, a bright line corresponding to each of a plurality of exposure lines included in the image sensor appears according to a change in luminance of the subject. The method also includes obtaining a bright line image including a plurality of bright lines, by capturing the subject that changes in luminance by the image sensor with the set exposure time. The method further includes estimating a plurality of center areas each of which is in each of the plurality of bright lines, and obtaining identification information of the subject, by demodulating data specified by a pattern of the plurality of center areas.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: November 1, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Mitsuaki Oshima, Koji Nakanishi, Hideki Aoyama, Ikuo Fuchigami, Hidehiko Shin, Tsutomu Mukai, Yosuke Matsushita, Shigehiro Iida, Kazunori Yamada
  • Patent number: 11471613
    Abstract: The injection needle removal device has: a cylindrical outer cylinder on an upper opening of an injection needle case; a helical track on an inner peripheral surface of the outer cylinder in a helical shape from an upper locking point to a lower locking point; a syringe holding cylinder helically advances in the outer cylinder along the helical track; an injection needle tightening ring on a lower end portion of the syringe holding cylinder, the injection needle tightening ring holds an injection needle base portion of a syringe in the syringe holding cylinder to clamp the injection needle base portion; and a locking mechanism that stops the syringe holding cylinder where the injection needle tightening ring is exposed from a lower side of the outer cylinder at the lower locking point.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: October 18, 2022
    Assignees: THREE DYNE CO., LTD., NATIONAL UNIVERSITY CORP. KUMAMOTO UNIVERSITY
    Inventors: Koji Hagihira, Yoshitaka Nakanishi, Kazuma Shibata
  • Publication number: 20220297665
    Abstract: A motor control system includes an MG, a battery, an SMR, and an MG-ECU. The MG-ECU is configured to control the MG in accordance with an instruction provided through communication. The MG-ECU is configured to execute autonomous power generation control of the MG in an event of a fault in the communication. The autonomous power generation control is control in which the MG-ECU causes the MG to generate a predetermined voltage not in accordance with the instruction. The MG-ECU is configured to, when a fault is detected in the communication, start the autonomous power generation control after the SMR has finished switching from an off state to an on state.
    Type: Application
    Filed: March 3, 2022
    Publication date: September 22, 2022
    Inventors: Koji MURAKAMI, Tatsuya YAMAGUCHI, Kensuke NAKANISHI
  • Patent number: 11332614
    Abstract: The present invention provides a reinforced polycarbonate resin composition having all of excellent strength, impact resistance, heat resistance, flame retardancy and thermal stability. A reinforced polycarbonate resin composition which contains 100 parts by weight of a resin composition composed of (A) 50 to 95 parts by weight of a polycarbonate resin (component A) and (B) 5 to 50 parts by weight of a fibrous filler (component B) and (C) 2 to 45 parts by weight of a fluororesin (component C-I) or 2 to 45 parts by weight of a fluororesin (component C-II), wherein (I) the fluororesin (component C-I) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2] and has a melting point of 200 to 280° C., and (II) the fluororesin (component C-II) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2], has a melting point of 240 to 300° C., and has a 5% weight loss temperature of 470° C.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: May 17, 2022
    Assignees: TEIJIN LIMITED, DAIKIN INDUSTRIES, LTD.
    Inventors: Shunsuke Okuzawa, Toshiyuki Miyake, Koji Nakanishi, Masaji Komori, Hideki Kono
  • Publication number: 20220132015
    Abstract: A method includes setting an exposure time of an image sensor included in a terminal device so that, in an image obtained by capturing a subject by the image sensor, a bright line corresponding to each of a plurality of exposure lines included in the image sensor appears according to a change in luminance of the subject. The method also includes obtaining a bright line image including a plurality of bright lines, by capturing the subject that changes in luminance by the image sensor with the set exposure time. The method further includes estimating a plurality of center areas each of which is in each of the plurality of bright lines, and obtaining identification information of the subject, by demodulating data specified by a pattern of the plurality of center areas.
    Type: Application
    Filed: September 30, 2021
    Publication date: April 28, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Mitsuaki OSHIMA, Koji NAKANISHI, Hideki AOYAMA, Ikuo FUCHIGAMI, Hidehiko SHIN, Tsutomu MUKAI, Yosuke MATSUSHITA, Shigehiro IIDA, Kazunori YAMADA
  • Patent number: 11261324
    Abstract: A resin composition containing a polycarbonate resin and a fluorine-containing copolymer. The fluorine-containing copolymer is a copolymer containing a polymerized unit based on tetrafluoroethylene in an amount of 75% by mass or more of all polymerized units and at least one selected from a polymerized unit based on hexafluoropropylene and a polymerized unit based on a perfluoro(alkyl vinyl ether) in an amount of 2% by mass or more. Also disclosed is a molded article formed from the resin composition, the polycarbonate resin constituting a continuous phase and the fluorine-containing copolymer constituting a dispersed phase having an average particle size of 0.01 to 2.5 ?m.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: March 1, 2022
    Assignees: DAIKIN INDUSTRIES, LTD., TEIJIN LIMITED
    Inventors: Koji Nakanishi, Masaji Komori, Hideki Kono, Shunsuke Okuzawa, Toshiyuki Miyake
  • Publication number: 20220010131
    Abstract: A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238. Also disclosed is a pellet obtained by molding the resin composition and a molded article formed from the resin composition or the pellet.
    Type: Application
    Filed: September 23, 2021
    Publication date: January 13, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Koji NAKANISHI, Toyomitsu SEKI, Hideki KONO
  • Patent number: 11177144
    Abstract: Embodiments of the present disclosure provide a thermal process chamber that includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate alters temperature profile. The shape of the beam spot produced by the spot heating module can be modified without making changes to the optics of the spot heating module.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: November 16, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shu-Kwan Lau, Zhiyuan Ye, Zuoming Zhu, Koji Nakanishi, Toshiyuki Nakagawa, Nyi O. Myo, Schubert S. Chu
  • Patent number: 11165967
    Abstract: A method includes determining a pattern of a change in luminance, by demodulating an identification information to be transmitted with a ceiling light, and transmitting the identification information, by the ceiling light changing in luminance according to the determined pattern of the change in luminance. Additionally, in the determining, a first luminance change pattern, corresponding to a first body, and a second luminance change pattern, corresponding to a first header used for the first body, are determined. Furthermore, in the transmitting, the first header and the first body are transmitted by the ceiling light changing in luminance according to the first luminance change pattern, the second luminance change pattern, and the first luminance change pattern in the stated order.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: November 2, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Mitsuaki Oshima, Koji Nakanishi, Hideki Aoyama, Ikuo Fuchigami, Hidehiko Shin, Tsutomu Mukai, Yosuke Matsushita, Shigehiro Iida, Kazunori Yamada
  • Publication number: 20210285105
    Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.
    Type: Application
    Filed: May 26, 2021
    Publication date: September 16, 2021
    Inventors: Shu-Kwan LAU, Koji NAKANISHI, Toshiyuki NAKAGAWA, Zuoming ZHU, Zhiyuan YE, Joseph M. RANISH, Nyi O. MYO, Errol Antonio C. SANCHEZ, Schubert S. CHU
  • Publication number: 20210245647
    Abstract: A robot (1) includes: a main body (10) including a hollow portion (110) that is a hollow space penetrating the main body (10) in an up-down direction, the main body (10) being configured to lift and support a support object (30) inserted in the hollow portion (110) by moving in the up-down direction; and a movable member (200) configured to move the main body (10) at least in the up-down direction by operating a leg (20).
    Type: Application
    Filed: June 19, 2019
    Publication date: August 12, 2021
    Inventors: TAKASHI KITO, YUKI ITOTANI, KOJI NAKANISHI, TAKARA KASAI, KAZUO HONGO, YASUHISA KAMIKAWA, ATSUSHI SAKAMOTO
  • Publication number: 20210189188
    Abstract: A thermally conductive composition 26 contains a base polymer, an adhesive polymer, and thermally conductive particles. A thermal conductivity of the thermally conductive composition 26 is 0.3 W/mK or more. The base polymer is a silicone polymer. The adhesive polymer contains a methyl hydrogen polysiloxane, an epoxy group-containing alkyltrialkoxysilane, and a cyclic polysiloxane oligomer. The amount of the adhesive polymer is 5 to 35 parts by weight with respect to 100 parts by weight of the base polymer. A thermally conductive sheet of the present invention includes the thermally conductive composition in the form of a sheet. Thus, the present invention provides a thermally conductive composition that has high thermal conductive properties and excellent resilience and that can prevent interfacial peeling due to stress, a thermally conductive sheet including the thermally conductive composition, and a method for producing the thermally conductive sheet.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 24, 2021
    Inventors: Yuki KAMIYA, Masakazu HATTORI, Tomoki MATSUMURA, Katsuyuki SUZUMURA, Koji NAKANISHI, Ayako YAMAGUCHI
  • Patent number: 11021795
    Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: June 1, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Shu-Kwan Lau, Koji Nakanishi, Toshiyuki Nakagawa, Zuoming Zhu, Zhiyuan Ye, Joseph M. Ranish, Nyi O. Myo, Errol Antonio C. Sanchez, Schubert S. Chu
  • Publication number: 20210136273
    Abstract: A method includes determining a pattern of a change in luminance, by demodulating an identification information to be transmitted with a ceiling light, and transmitting the identification information, by the ceiling light changing in luminance according to the determined pattern of the change in luminance. Additionally, in the determining, a first luminance change pattern, corresponding to a first body, and a second luminance change pattern, corresponding to a first header used for the first body, are determined. Furthermore, in the transmitting, the first header and the first body are transmitted by the ceiling light changing in luminance according to the first luminance change pattern, the second luminance change pattern, and the first luminance change pattern in the stated order.
    Type: Application
    Filed: November 12, 2020
    Publication date: May 6, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Mitsuaki OSHIMA, Koji NAKANISHI, Hideki AOYAMA, Ikuo FUCHIGAMI, Hidehiko SHIN, Tsutomu MUKAI, Yosuke MATSUSHITA, Shigehiro IIDA, Kazunori YAMADA
  • Patent number: 10887528
    Abstract: The method includes obtaining, using a face camera of a smart phone, identification information from a ceiling light of a facility with visible light communication, and obtaining location information of the ceiling light related to the identification information. The method also includes displaying a location related to the location information of the ceiling light on a map of the facility on a display of the smart phone. The smart phone is set on a cart in a state that the face camera is directed to a ceiling of the facility on which the ceiling light is attached, and the face camera is a CMOS sensor and the CMOS sensor is used only for the visible light communication.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: January 5, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Mitsuaki Oshima, Koji Nakanishi, Hideki Aoyama, Ikuo Fuchigami, Hidehiko Shin, Tsutomu Mukai, Yosuke Matsushita, Shigehiro Iida, Kazunori Yamada
  • Publication number: 20200322520
    Abstract: The method includes obtaining, using a face camera of a smart phone, identification information from a ceiling light of a facility with visible light communication, and obtaining location information of the ceiling light related to the identification information. The method also includes displaying a location related to the location information of the ceiling light on a map of the facility on a display of the smart phone. The smart phone is set on a cart in a state that the face camera is directed to a ceiling of the facility on which the ceiling light is attached, and the face camera is a CMOS sensor and the CMOS sensor is used only for the visible light communication.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Applicant: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Mitsuaki OSHIMA, Koji NAKANISHI, Hideki AOYAMA, Ikuo FUCHIGAMI, Hidehiko SHIN, Tsutomu MUKAI, Yosuke MATSUSHITA, Shigehiro IIDA, Kazunori YAMADA
  • Publication number: 20200307413
    Abstract: A selection apparatus includes an acquirer configured to acquire information of a usage state of at least one reuse component before being reused and a purpose of use of the at least one reused component; and a selector configured to select a reused component suitable for the purpose of use based on the usage state.
    Type: Application
    Filed: March 13, 2020
    Publication date: October 1, 2020
    Inventor: Koji Nakanishi