Patents by Inventor Koji Nakanishi
Koji Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230011050Abstract: A reactor includes a coil having gaps between adjacent turns of a winding, a core inserted through the coil, and a heat-dissipating material that is in contact with a side face of the coil. The heat-dissipating material is inserted between the adjacent turns of the winding of the coil, and the thickness of the heat-dissipating material outside the coil in a direction of an axis of the coil is smaller than the thickness of the heat-dissipating material between the adjacent turns of the winding. By reducing the thickness of the heat-dissipating material outside the coil where contribution to coil cooling is small, the amount of the heat-dissipating material can be reduced without lowering the cooling performance to the coil.Type: ApplicationFiled: June 30, 2022Publication date: January 12, 2023Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Koji Nakanishi
-
Patent number: 11534940Abstract: The present invention aims to provide a method for producing a pellet and an apparatus for producing a pellet, including a conveyor belt that conveys a strand formed by melting a composition containing a thermoplastic resin and an additive and then ejecting the molten composition from a feeder, a liquid-spraying device spraying a liquid toward the strand conveyed, a gas-blowing device blowing a gas toward the strand conveyed, a strand cutter cutting the strand conveyed into a pellet, the liquid-spraying device, the gas-blowing device, and the strand cutter being disposed in this order in the conveying direction of the strand, a measurement device measuring a surface temperature of the strand, the measurement device being disposed upstream of the strand cutter in the conveying direction, and an adjustment mechanism adjusting driving of at least one of the liquid-spraying device and the gas-blowing device in accordance with the surface temperature measured.Type: GrantFiled: July 4, 2017Date of Patent: December 27, 2022Assignee: DIC CorporationInventors: Yoshinobu Sakurai, Yasuaki Kumagai, Hisanori Ikeda, Koji Nakanishi, Yasuhiro Iriguchi, Kazunari Fukasawa, Hiroshi Yamaguchi
-
Patent number: 11491892Abstract: A selection apparatus includes an acquirer configured to acquire information of a usage state of at least one reuse component before being reused and a purpose of use of the at least one reused component; and a selector configured to select a reused component suitable for the purpose of use based on the usage state.Type: GrantFiled: March 13, 2020Date of Patent: November 8, 2022Assignee: HONDA MOTOR CO., LTD.Inventor: Koji Nakanishi
-
Patent number: 11490025Abstract: A method includes setting an exposure time of an image sensor included in a terminal device so that, in an image obtained by capturing a subject by the image sensor, a bright line corresponding to each of a plurality of exposure lines included in the image sensor appears according to a change in luminance of the subject. The method also includes obtaining a bright line image including a plurality of bright lines, by capturing the subject that changes in luminance by the image sensor with the set exposure time. The method further includes estimating a plurality of center areas each of which is in each of the plurality of bright lines, and obtaining identification information of the subject, by demodulating data specified by a pattern of the plurality of center areas.Type: GrantFiled: September 30, 2021Date of Patent: November 1, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICAInventors: Mitsuaki Oshima, Koji Nakanishi, Hideki Aoyama, Ikuo Fuchigami, Hidehiko Shin, Tsutomu Mukai, Yosuke Matsushita, Shigehiro Iida, Kazunori Yamada
-
Patent number: 11332614Abstract: The present invention provides a reinforced polycarbonate resin composition having all of excellent strength, impact resistance, heat resistance, flame retardancy and thermal stability. A reinforced polycarbonate resin composition which contains 100 parts by weight of a resin composition composed of (A) 50 to 95 parts by weight of a polycarbonate resin (component A) and (B) 5 to 50 parts by weight of a fibrous filler (component B) and (C) 2 to 45 parts by weight of a fluororesin (component C-I) or 2 to 45 parts by weight of a fluororesin (component C-II), wherein (I) the fluororesin (component C-I) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2] and has a melting point of 200 to 280° C., and (II) the fluororesin (component C-II) is a copolymer containing polymerization units respectively represented by general formulae [1] and [2], has a melting point of 240 to 300° C., and has a 5% weight loss temperature of 470° C.Type: GrantFiled: June 25, 2018Date of Patent: May 17, 2022Assignees: TEIJIN LIMITED, DAIKIN INDUSTRIES, LTD.Inventors: Shunsuke Okuzawa, Toshiyuki Miyake, Koji Nakanishi, Masaji Komori, Hideki Kono
-
Publication number: 20220132015Abstract: A method includes setting an exposure time of an image sensor included in a terminal device so that, in an image obtained by capturing a subject by the image sensor, a bright line corresponding to each of a plurality of exposure lines included in the image sensor appears according to a change in luminance of the subject. The method also includes obtaining a bright line image including a plurality of bright lines, by capturing the subject that changes in luminance by the image sensor with the set exposure time. The method further includes estimating a plurality of center areas each of which is in each of the plurality of bright lines, and obtaining identification information of the subject, by demodulating data specified by a pattern of the plurality of center areas.Type: ApplicationFiled: September 30, 2021Publication date: April 28, 2022Applicant: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICAInventors: Mitsuaki OSHIMA, Koji NAKANISHI, Hideki AOYAMA, Ikuo FUCHIGAMI, Hidehiko SHIN, Tsutomu MUKAI, Yosuke MATSUSHITA, Shigehiro IIDA, Kazunori YAMADA
-
Patent number: 11261324Abstract: A resin composition containing a polycarbonate resin and a fluorine-containing copolymer. The fluorine-containing copolymer is a copolymer containing a polymerized unit based on tetrafluoroethylene in an amount of 75% by mass or more of all polymerized units and at least one selected from a polymerized unit based on hexafluoropropylene and a polymerized unit based on a perfluoro(alkyl vinyl ether) in an amount of 2% by mass or more. Also disclosed is a molded article formed from the resin composition, the polycarbonate resin constituting a continuous phase and the fluorine-containing copolymer constituting a dispersed phase having an average particle size of 0.01 to 2.5 ?m.Type: GrantFiled: June 25, 2018Date of Patent: March 1, 2022Assignees: DAIKIN INDUSTRIES, LTD., TEIJIN LIMITEDInventors: Koji Nakanishi, Masaji Komori, Hideki Kono, Shunsuke Okuzawa, Toshiyuki Miyake
-
Publication number: 20220010131Abstract: A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380° C. and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238. Also disclosed is a pellet obtained by molding the resin composition and a molded article formed from the resin composition or the pellet.Type: ApplicationFiled: September 23, 2021Publication date: January 13, 2022Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Koji NAKANISHI, Toyomitsu SEKI, Hideki KONO
-
Patent number: 11177144Abstract: Embodiments of the present disclosure provide a thermal process chamber that includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate alters temperature profile. The shape of the beam spot produced by the spot heating module can be modified without making changes to the optics of the spot heating module.Type: GrantFiled: May 9, 2019Date of Patent: November 16, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Shu-Kwan Lau, Zhiyuan Ye, Zuoming Zhu, Koji Nakanishi, Toshiyuki Nakagawa, Nyi O. Myo, Schubert S. Chu
-
Patent number: 11165967Abstract: A method includes determining a pattern of a change in luminance, by demodulating an identification information to be transmitted with a ceiling light, and transmitting the identification information, by the ceiling light changing in luminance according to the determined pattern of the change in luminance. Additionally, in the determining, a first luminance change pattern, corresponding to a first body, and a second luminance change pattern, corresponding to a first header used for the first body, are determined. Furthermore, in the transmitting, the first header and the first body are transmitted by the ceiling light changing in luminance according to the first luminance change pattern, the second luminance change pattern, and the first luminance change pattern in the stated order.Type: GrantFiled: November 12, 2020Date of Patent: November 2, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICAInventors: Mitsuaki Oshima, Koji Nakanishi, Hideki Aoyama, Ikuo Fuchigami, Hidehiko Shin, Tsutomu Mukai, Yosuke Matsushita, Shigehiro Iida, Kazunori Yamada
-
Publication number: 20210285105Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.Type: ApplicationFiled: May 26, 2021Publication date: September 16, 2021Inventors: Shu-Kwan LAU, Koji NAKANISHI, Toshiyuki NAKAGAWA, Zuoming ZHU, Zhiyuan YE, Joseph M. RANISH, Nyi O. MYO, Errol Antonio C. SANCHEZ, Schubert S. CHU
-
Publication number: 20210245647Abstract: A robot (1) includes: a main body (10) including a hollow portion (110) that is a hollow space penetrating the main body (10) in an up-down direction, the main body (10) being configured to lift and support a support object (30) inserted in the hollow portion (110) by moving in the up-down direction; and a movable member (200) configured to move the main body (10) at least in the up-down direction by operating a leg (20).Type: ApplicationFiled: June 19, 2019Publication date: August 12, 2021Inventors: TAKASHI KITO, YUKI ITOTANI, KOJI NAKANISHI, TAKARA KASAI, KAZUO HONGO, YASUHISA KAMIKAWA, ATSUSHI SAKAMOTO
-
Publication number: 20210189188Abstract: A thermally conductive composition 26 contains a base polymer, an adhesive polymer, and thermally conductive particles. A thermal conductivity of the thermally conductive composition 26 is 0.3 W/mK or more. The base polymer is a silicone polymer. The adhesive polymer contains a methyl hydrogen polysiloxane, an epoxy group-containing alkyltrialkoxysilane, and a cyclic polysiloxane oligomer. The amount of the adhesive polymer is 5 to 35 parts by weight with respect to 100 parts by weight of the base polymer. A thermally conductive sheet of the present invention includes the thermally conductive composition in the form of a sheet. Thus, the present invention provides a thermally conductive composition that has high thermal conductive properties and excellent resilience and that can prevent interfacial peeling due to stress, a thermally conductive sheet including the thermally conductive composition, and a method for producing the thermally conductive sheet.Type: ApplicationFiled: December 9, 2020Publication date: June 24, 2021Inventors: Yuki KAMIYA, Masakazu HATTORI, Tomoki MATSUMURA, Katsuyuki SUZUMURA, Koji NAKANISHI, Ayako YAMAGUCHI
-
Patent number: 11021795Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.Type: GrantFiled: October 25, 2018Date of Patent: June 1, 2021Assignee: Applied Materials, Inc.Inventors: Shu-Kwan Lau, Koji Nakanishi, Toshiyuki Nakagawa, Zuoming Zhu, Zhiyuan Ye, Joseph M. Ranish, Nyi O. Myo, Errol Antonio C. Sanchez, Schubert S. Chu
-
Publication number: 20210136273Abstract: A method includes determining a pattern of a change in luminance, by demodulating an identification information to be transmitted with a ceiling light, and transmitting the identification information, by the ceiling light changing in luminance according to the determined pattern of the change in luminance. Additionally, in the determining, a first luminance change pattern, corresponding to a first body, and a second luminance change pattern, corresponding to a first header used for the first body, are determined. Furthermore, in the transmitting, the first header and the first body are transmitted by the ceiling light changing in luminance according to the first luminance change pattern, the second luminance change pattern, and the first luminance change pattern in the stated order.Type: ApplicationFiled: November 12, 2020Publication date: May 6, 2021Applicant: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICAInventors: Mitsuaki OSHIMA, Koji NAKANISHI, Hideki AOYAMA, Ikuo FUCHIGAMI, Hidehiko SHIN, Tsutomu MUKAI, Yosuke MATSUSHITA, Shigehiro IIDA, Kazunori YAMADA
-
Patent number: 10887528Abstract: The method includes obtaining, using a face camera of a smart phone, identification information from a ceiling light of a facility with visible light communication, and obtaining location information of the ceiling light related to the identification information. The method also includes displaying a location related to the location information of the ceiling light on a map of the facility on a display of the smart phone. The smart phone is set on a cart in a state that the face camera is directed to a ceiling of the facility on which the ceiling light is attached, and the face camera is a CMOS sensor and the CMOS sensor is used only for the visible light communication.Type: GrantFiled: June 22, 2020Date of Patent: January 5, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICAInventors: Mitsuaki Oshima, Koji Nakanishi, Hideki Aoyama, Ikuo Fuchigami, Hidehiko Shin, Tsutomu Mukai, Yosuke Matsushita, Shigehiro Iida, Kazunori Yamada
-
Publication number: 20200322520Abstract: The method includes obtaining, using a face camera of a smart phone, identification information from a ceiling light of a facility with visible light communication, and obtaining location information of the ceiling light related to the identification information. The method also includes displaying a location related to the location information of the ceiling light on a map of the facility on a display of the smart phone. The smart phone is set on a cart in a state that the face camera is directed to a ceiling of the facility on which the ceiling light is attached, and the face camera is a CMOS sensor and the CMOS sensor is used only for the visible light communication.Type: ApplicationFiled: June 22, 2020Publication date: October 8, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICAInventors: Mitsuaki OSHIMA, Koji NAKANISHI, Hideki AOYAMA, Ikuo FUCHIGAMI, Hidehiko SHIN, Tsutomu MUKAI, Yosuke MATSUSHITA, Shigehiro IIDA, Kazunori YAMADA
-
Publication number: 20200309858Abstract: A lifetime prediction device includes: an acquirer configured to acquire information regarding a use state of a battery member mounted on a vehicle; and a predictor configured to predict a lifetime of the battery member to be reused at the time of reuse according to the use state.Type: ApplicationFiled: March 19, 2020Publication date: October 1, 2020Inventor: Koji Nakanishi
-
Publication number: 20200307413Abstract: A selection apparatus includes an acquirer configured to acquire information of a usage state of at least one reuse component before being reused and a purpose of use of the at least one reused component; and a selector configured to select a reused component suitable for the purpose of use based on the usage state.Type: ApplicationFiled: March 13, 2020Publication date: October 1, 2020Inventor: Koji Nakanishi
-
Patent number: 10745561Abstract: A filler for a heat transfer member includes: a core material which is made of an inorganic material or metal material having a thermal conductivity of 15 W/mK or more, and transfers heat; and an insulating film which includes a silicon oxide film and a diamond-like carbon film having electrical insulation properties, and covers the core material. The dielectric breakdown voltage of the filler is 500 V or more.Type: GrantFiled: October 3, 2018Date of Patent: August 18, 2020Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Koji Nakanishi