Patents by Inventor Koji Sakata

Koji Sakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8213160
    Abstract: A solid electrolytic capacitor including a solid electrolytic capacitor component comprises a porous anode body 2 composed of valve metal having a anode lead 1 protruding therefrom, a anode oxide film, a solid electrolyte layer 4, a graphite layer 5, a silver paste layer 6, a resist layer 3 separating the anode lead 1 used as a anode portion and the porous anode body 2 used as a cathode portion, and a anode lead element 7 connected to the anode lead 1, the anode oxide film, solid electrolyte layer 4, graphite layer 5, silver paste layer 6 being successively formed on the surface of the porous anode body 2, wherein the solid electrolytic capacitor component is bonded on a mounting substrate 21 having a anode terminal 21a, a cathode terminal 21b, and an insulating portion 21c therebetween with a precuring insulating adhesive 9 formed on the insulating portion 21c of the mounting substrate 21 and precuring conductive adhesives 8 formed on the anode terminal and cathode terminal, and sealed with exterior resin 10
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: July 3, 2012
    Assignee: NEC Tokin Corporation
    Inventors: Takeshi Saito, Yuji Yoshida, Takeo Kasuga, Koji Sakata, Katsuhiro Yoshida, Masanori Takahashi
  • Publication number: 20120097460
    Abstract: A hydraulically powered working vehicle includes a turning section provided at an upper side of a travel unit capable of turning, and hydraulic circuits for the working vehicle. The hydraulic circuit for the working vehicle has a first actuator group including a one side traveling motor, a first variable capacity pump for driving the first actuator group, a second actuator group including an other side traveling motor and a turning motor, and a second variable capacity pump for driving the second actuator group. The second variable capacity pump is set so that a maximum value for discharge capacity per unit time becomes large compared to that of the first variable capacity pump.
    Type: Application
    Filed: October 24, 2011
    Publication date: April 26, 2012
    Applicants: YANMAR CO., LTD., KANZAKI KOKYUKOKI MFG. CO., LTD.
    Inventors: Kazuhiro OWADA, Hideki KANENOBU, Koji SAKATA, Takeshi OKAZAKI
  • Publication number: 20120097022
    Abstract: A pump unit includes a variable capacity pump, and a balanced piston mechanism having a piston body, connected to an operation section of a variable swash plate, provided inside a cylinder, capable of sliding in an axial direction. The balanced piston mechanism has first, second and third pressure receiving chambers provided in the cylinder. Primary side and the secondary side working fluid pressures of an actuator switching valve are respectively introduced to the first receive pressure chamber and the second pressure receiving chamber, and a set pressure that has been previously set, corresponding to a working fluid differential pressure arising before and after passing through the actuator switching valve, in a steady state of the operating position of the actuator switching valve is introduced to the third pressure receiving chamber.
    Type: Application
    Filed: October 24, 2011
    Publication date: April 26, 2012
    Applicants: YANMAR CO., LTD., KANZAKI KOKYUKOKI MFG. CO., LTD.
    Inventors: Kazuhiro OWADA, Hideki KANENOBU, Koji SAKATA, Takeshi OKAZAKI
  • Publication number: 20120032301
    Abstract: A semiconductor device includes a lead frame including an island, a power supply lead, and a GND lead; a sheet-like solid electrolytic capacitor that is mounted on the island; a semiconductor chip that is mounted on the solid electrolytic capacitor, a plane area of the semiconductor chip being smaller than that of the solid electrolytic capacitor; a bonding wire that connects the semiconductor chip and the solid electrolytic capacitor, and a bonding wire that connects the solid electrolytic capacitor and the power supply lead or the GND lead, in which at least the connection part between the anode plate and the anode part of the solid electrolytic capacitor and the connection part between the anode plate and the bonding wire do not overlap when being vertically projected.
    Type: Application
    Filed: August 4, 2011
    Publication date: February 9, 2012
    Applicant: NEC TOKIN CORPORATION
    Inventors: Takeo KASUGA, Koji SAKATA, Takeshi SAITO
  • Patent number: 8107224
    Abstract: In a thin solid electrolytic capacitor including a solid electrolytic capacitor element disposed on a substrate, the solid electrolytic capacitor element has an upper surface largely extending along the substrate as compared with a height dimension thereof from the substrate. A casing portion is at least partly made of a resin and surrounds the solid electrolytic capacitor element jointly with the substrate. The casing portion includes a non-adhesive member that is in contact with an upper surface of the solid electrolytic capacitor element, but is not adhesive to the solid electrolytic capacitor element.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: January 31, 2012
    Assignee: NEC TOKIN Corporation
    Inventors: Masanori Takahashi, Takeshi Saito, Takeo Kasuga, Yuji Yoshida, Katsuhiro Yoshida, Koji Sakata
  • Patent number: 8018713
    Abstract: Anodized films are formed at both surfaces of an aluminum base and, at the center portion on each side of the aluminum base, a solid electrolyte layer of a conductive polymer, a graphite layer, and a metal layer are stacked in the order, thereby forming a rectangular cathode portion. An insulator layer is formed at the peripheries of four sides of the cathode portion and, further, an anode lead frame is provided at the peripheries of four sides of the upper insulator layer, thereby forming an anode portion. Openings are formed at four corners of the insulator layer or the anode portion, thereby establishing electrical connection between the cathode portions on both sides of the aluminum base. By setting the ratio of a total region, occupied by the openings, of the cathode portion to 25% or less, the ESL of a capacitor can be suppressed low even when the openings are provided.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: September 13, 2011
    Assignee: NEC Tokin Corporation
    Inventors: Yuji Yoshida, Katsuhiro Yoshida, Takeo Kasuga, Masanori Takahashi, Takeshi Saito, Koji Sakata
  • Patent number: 8014129
    Abstract: A stacked solid electrolytic capacitor includes a plurality of stacked solid electrolytic capacitor elements. Each solid electrolytic capacitor element includes an anode formed of a valve action metal, an anode section formed on an end of the anode, a dielectric formed on the surface of the valve action metal and including an oxide of the valve action metal, and a cathode layer formed on the dielectric. The cathode layers and the anode sections of the solid electrolytic capacitor elements are, respectively, connected to each other across the plurality of stacked solid electrolytic capacitor elements. A conductive layer extending in the stacking direction is formed on at least part of a side face of an area where the cathode layers of the solid electrolytic capacitor elements are formed.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: September 6, 2011
    Assignee: NEC Tokin Corporation
    Inventors: Takeshi Saito, Takeo Kasuga, Koji Sakata
  • Patent number: 8014127
    Abstract: In a solid electrolytic capacitor, a capacitor element laminate formed by stacking capacitor elements each using a valve metal as an anode body is bonded to a substrate by a conductive adhesive and packaged by a resin portion. The substrate includes a printed substrate made of an epoxy resin. On its mounting surface for the capacitor element laminate, there are provided an anode mounting portion and a cathode mounting portion each made of a copper base material. The anode mounting portion and the cathode mounting portion are electrically connected to an external anode terminal and an external cathode terminal, respectively, formed on the mounting surface of the solid electrolytic capacitor, through anode vias and cathode vias each penetrating through the epoxy resin. A part of the anode mounting portion on the substrate (6) extends to the outside of the packaging resin portion.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: September 6, 2011
    Assignee: NEC Tokin Corporation
    Inventors: Takeo Kasuga, Takashi Mizukoshi, Koji Sakata, Takeshi Saito
  • Patent number: 7954316
    Abstract: A hydrostatic stepless transmission comprises: a hydraulic pump; a hydraulic motor, wherein at least one of the hydraulic pump and motor is variable in displacement, and is provided with a movable swash plate; a closed circuit connecting the hydraulic pump and motor to each other through a pair of main fluid passages, wherein one main fluid passage is higher-pressurized during forward traveling, and wherein the other main fluid passage is higher-pressurized during backward traveling; a hydraulic servomechanism for controlling a tilt angle of the movable swash plate of the at least one of the hydraulic pump and motor; a speed-controlling motive member attached to the hydraulic servomechanism, wherein the speed-controlling motive member interlocks with the movable swash plate and is moved by operating a speed control operation lever; and a load controlling system attached to the hydraulic servomechanism.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: June 7, 2011
    Assignee: Yanmar Co., Ltd.
    Inventors: Koji Sakata, Yasuhisa Mochizuki
  • Patent number: 7898795
    Abstract: A solid-state electrolytic capacitor including a stacked body of a solid-state electrolytic capacitor element unit and an electrode conversion board. The unit includes two kinds of solid-state electrolytic capacitor elements. Each of first kind of solid-state electrolytic capacitor elements uses an anode body having a total thickness of an aluminum foil of 350 ?m and a residual core thickness, i.e., the total thickness minus the thickness of an etched layer, is 50 ?m. A second kind of solid-state electrolytic capacitor element provided on the mounting surface side uses an anode body having a total thickness of an aluminum foil of 150 ?m and a residual core thickness is 50 ?m. The electrode conversion board includes external anode and external cathode terminals that are arranged in a checkered manner and also includes, on the side opposite to the board, anode electrode and cathode electrode plates.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: March 1, 2011
    Assignee: NEC TOKIN Corporation
    Inventors: Takeo Kasuga, Masanori Takahashi, Koji Sakata, Yuji Yoshida, Takeshi Saito, Katsuhiro Yoshida
  • Publication number: 20100110212
    Abstract: Setting information is converted into a plurality of image patterns (22), and the plurality of image patterns (22) are displayed in time sequence according to a predetermined sequence. A camera device reproduces the setting information from image information (3) which the camera device acquires by capturing the displayed description to set the setting information thereto.
    Type: Application
    Filed: June 3, 2009
    Publication date: May 6, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Naoki Kuwahara, Koji Sakata, Tetsuji Haga, Koichi Takeuchi
  • Publication number: 20100080404
    Abstract: The present invention provides a drive unit manufacturing method including the steps of: preparing a conducting wire which contains at least copper and forms a voice coil for conversion between sound and electric signals and arranging the conducting wire on a land which is formed on a board that the voice coil is arranged on and is provided for transmitting the electric signals; and connecting the conducting wire and the land by resistance welding.
    Type: Application
    Filed: September 28, 2009
    Publication date: April 1, 2010
    Applicant: Sony Corporation
    Inventors: Ryuzo Tamayama, Satoshi Arai, Masaru Yajima, Koji Sakata
  • Patent number: 7684172
    Abstract: A solid electrolytic capacitor includes a valve metal formed with an anodized film; an inner conductive polymer film formed on the anodized film; and an outer conductive polymer film formed on the inner conductive polymer film. The outer conductive polymer film is obtained by: preparing a first polymer solution (PEDOT/PSSA); dissolving a predetermined dissolved substance in a non-aqueous solvent, the predetermined dissolved substance being selected from the group consisting of boric acid, 1-naphthalenesulfonic acid, 2-naphthalenesulfonic acid, 1,3,6-naphthalenetrisulfonic acid, and polystyrenesulfonic acid, and a salt thereof; mixing the dissolved solvent with pure water to obtain an additive solution; adding the additive solution into the first polymer solution to obtain a second polymer solution; and applying the second polymer solution to the inner conductive polymer film.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: March 23, 2010
    Assignee: NEC TOKIN Corporation
    Inventors: Takeo Kasuga, Yuji Yoshida, Masanori Takahashi, Ryuta Kobayakawa, Takeshi Saito, Koji Sakata, Sadamu Toita, Katsuhiro Yoshida
  • Patent number: 7619876
    Abstract: A solid electrolytic capacitor includes a porous sintered body made of a valve-acting metal and embedded with part of an anode lead having a protruding portion, a solid electrolyte layer formed in contact with a dielectric layer formed in the porous sintered body, a mounting anode terminal member, a mounting cathode terminal member, and an insulating casing resin. The capacitor further includes a small piece of a metal frame made of a valve-acting metal. This small piece of the metal frame is formed integrally with the protruding portion of the anode lead by cutting, after the anodic oxidation, the metal frame to which the protruding portion of the anode lead is fixed by resistance welding. The small piece of the metal frame and the mounting anode terminal member are connected together by wire bonding so that the anode lead and the mounting anode terminal member are electrically connected together.
    Type: Grant
    Filed: June 17, 2008
    Date of Patent: November 17, 2009
    Assignee: NEC TOKIN Corporation
    Inventors: Kunihiko Shimizu, Takashi Mizukoshi, Koji Sakata
  • Publication number: 20090237868
    Abstract: A capacitor device comprises first and second substrates and a capacitor element that comprises an anode portion and a cathode portion. The first substrate has a first inner surface and a first outer surface and is provided with a first inner anode terminal, a first inner cathode terminal, a first outer anode terminal and a first outer cathode terminal. The capacitor element is mounted on the first inner surface of the first substrate. The first inner anode terminal and the first inner cathode terminal are formed on the first inner surface and are electrically connected to the anode portion and the cathode portion, respectively. The first outer anode terminal and the first outer cathode terminal are formed on the first outer surface and are electrically connected to the first inner anode terminal and the first inner cathode terminal, respectively.
    Type: Application
    Filed: March 17, 2009
    Publication date: September 24, 2009
    Applicant: NEC TOKIN Corporation
    Inventors: Masanori TAKAHASHI, Koji Sakata, Katsuhiro Yoshida
  • Publication number: 20090201631
    Abstract: In a solid electrolytic capacitor, a capacitor element laminate formed by stacking capacitor elements each using a valve metal as an anode body is bonded to a substrate by a conductive adhesive and packaged by a resin portion. The substrate includes a printed substrate made of an epoxy resin. On its mounting surface for the capacitor element laminate, there are provided an anode mounting portion and a cathode mounting portion each made of a copper base material. The anode mounting portion and the cathode mounting portion are electrically connected to an external anode terminal and an external cathode terminal, respectively, formed on the mounting surface of the solid electrolytic capacitor, through anode vias and cathode vias each penetrating through the epoxy resin. A part of the anode mounting portion on the substrate (6) extends to the outside of the packaging resin portion.
    Type: Application
    Filed: February 13, 2009
    Publication date: August 13, 2009
    Applicant: NEC TOKIN Corporation
    Inventors: Takeo KASUGA, Takashi Mizukoshi, Koji Sakata, Takeshi Saito
  • Publication number: 20090195969
    Abstract: The terminal plate 30 is attached to the capacitor elements 10 so that a second plate surface of the insulating plate 32 faces a side surface of each of the capacitor elements 10. The side surface is parallel to the longitudinal direction L1 and the thickness direction t1 of the anode plate 1.
    Type: Application
    Filed: February 4, 2009
    Publication date: August 6, 2009
    Applicant: NEC TOKIN CORPORATION
    Inventors: Yuji YOSHIDA, Takashi Mizukoshi, Koji Sakata, Katsuhiro Yoshida, Takeshi Saito
  • Publication number: 20090168304
    Abstract: The present invention provides a stacked solid electrolytic capacitor that allows further reducing ESR by increasing the number of stacked layers. The stacked solid electrolytic capacitor according to the present invention is a stacked solid electrolytic capacitor having a plurality of stacked solid electrolytic capacitor elements, and each solid electrolytic capacitor element comprises an anode formed of a valve action metal, an anode section formed on an end of the anode, a dielectric formed on the surface of the valve action metal and comprising an oxide of the valve action metal, and a cathode layer formed on the dielectric. The cathode layers and the anode sections of the solid electrolytic capacitor elements are respectively connected to each other across the plurality of stacked solid electrolytic capacitor elements.
    Type: Application
    Filed: December 1, 2008
    Publication date: July 2, 2009
    Applicant: NEC TOKIN CORPORATION
    Inventors: Takeshi Saito, Takeo Kasuga, Koji Sakata
  • Patent number: 7523609
    Abstract: There is provided a hydrostatic transmission (HST) in which a hydraulic pump unit operatively driven by a driving power source and a hydraulic motor unit arranged spaced apart from the hydraulic pump unit and operatively driving a driving-wheel are fluidly connected by way of operation fluid lines so as to form a closed circuit. The hydraulic motor unit is provided with motor-side operation fluid passages forming one part of the operation fluid lines. A motor-side charge fluid passage having a first end opened to an outside to form a motor-side charge port and a second end fluidly connected to at least one of the motor-side operation fluid passages is also included. A check valve is interposed in the motor-side charge fluid passage so as to allow the fluid to flow from the motor-side charge port to one motor-side operation fluid passage while preventing reverse flow.
    Type: Grant
    Filed: January 24, 2007
    Date of Patent: April 28, 2009
    Assignee: Kanzaki Kokyukoki Mfg. Co., Ltd.
    Inventors: Yasuhisa Mochizuki, Koji Sakata, Kazuhiro Owada
  • Patent number: 7525791
    Abstract: A solid electrolytic capacitor is provided which is capable of exhibiting an excellent characteristic and high reliability against thermal stress. The solid electrolytic capacitor includes a base member having a capacitor element connecting face on its upper surface side and an electrode mounting face on its lower surface side and being made up of an insulating plate having first conductors and second conductors, disposed in a staggered format, each providing conduction between the upper and lower surface sides of the base member, and the capacitor element having anode portions and cathode portions, each being disposed in a staggered format, connected to each of the first and second conductors.
    Type: Grant
    Filed: March 5, 2008
    Date of Patent: April 28, 2009
    Assignee: NEC Tokin Corporation
    Inventors: Koji Sakata, Takeshi Saito, Yuji Yoshida, Takeo Kasuga, Masanori Takahashi, Katsuhiro Yoshida