Patents by Inventor Koji Takayanagi
Koji Takayanagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9576934Abstract: A semiconductor device according to the present invention includes: a through via formed to penetrate a semiconductor substrate; first and second buffer circuits; a wiring forming layer formed in an upper layer of the semiconductor substrate; a connecting wiring portion formed in an upper portion of the through via assuming that a direction from the semiconductor substrate to the wiring forming layer is an upward direction, the connecting wiring portion being formed on a chip inner end face that faces the upper portion of the semiconductor substrate at an end face of the through via; a first path connecting the first buffer circuit and the through via; and a second path connecting the second buffer circuit and the through via. The first path and the second path are electrically connected through the connecting wiring portion.Type: GrantFiled: April 5, 2013Date of Patent: February 21, 2017Assignee: Renesas Electronics CorporationInventor: Koji Takayanagi
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Publication number: 20170043287Abstract: According to an embodiment of the present disclosure, a process liquid supply apparatus operating method is provided. The method includes filling a filter unit with a process liquid from an upstream side of the filter unit to a downstream side of the filter unit after newly mounting or replacing the filter unit and repeating a depressurization filtering process and a pressurization filtering process for a predetermined number of times. The depressurization filtering process depressurizes the process liquid in the downstream side of the filter unit and thereby allows the process liquid to permeate through the filter unit. The pressurization filtering process pressurizes the process liquid from the upstream side of the filter unit and thereby allows the process liquid to permeate through the filter unit.Type: ApplicationFiled: October 28, 2016Publication date: February 16, 2017Inventors: Hiroshi MARUMOTO, Koji TAKAYANAGI, Kenji ADACHI
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Patent number: 9508574Abstract: According to an embodiment of the present disclosure, a process liquid supply apparatus operating method is provided. The method includes filling a filter unit with a process liquid from an upstream side of the filter unit to a downstream side of the filter unit after newly mounting or replacing the filter unit and repeating a depressurization filtering process and a pressurization filtering process for a predetermined number of times. The depressurization filtering process depressurizes the process liquid in the downstream side of the filter unit and thereby allows the process liquid to permeate through the filter unit. The pressurization filtering process pressurizes the process liquid from the upstream side of the filter unit and thereby allows the process liquid to permeate through the filter unit.Type: GrantFiled: August 1, 2013Date of Patent: November 29, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Hiroshi Marumoto, Koji Takayanagi, Kenji Adachi
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Publication number: 20160236124Abstract: In one embodiment, after a new filter unit (3) is installed in a treatment liquid supply apparatus, there is performed, before a solvent-containing treatment liquid is passed through the filter unit, a step of soaking the filter unit with a solvent for pretreatment and then discharging therefrom the solvent. The solubility of a material, constituting a filter part (31) of the filter unit, to the solvent is greater than the solubility of the material to the treatment liquid. This step makes it possible to remove a component, which may elute from the filter part into the treatment liquid to produce foreign matters (particles), before treatment liquid is passed through the filter unit.Type: ApplicationFiled: September 26, 2014Publication date: August 18, 2016Inventors: Yuichi YOSHIDA, Ryouichirou NAITOU, Arnaud Alain Jean DAUENDORFFER, Koji TAKAYANAGI, Shinobu MIYAZAKI
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Publication number: 20160094027Abstract: Provided is a semiconductor device making it possible to promote area reduction while maintaining ESD resistance. The semiconductor device includes a power wire, a ground wire and a protection circuit provided between the power wire and the ground wire so as to cope with electrostatic discharge. The protection circuit includes a first transistor, a first resistive element, a second transistor, a first capacitive element, a first inverter and a protection transistor. Agate width of the second transistor is narrower than a gate width of the first transistor.Type: ApplicationFiled: September 25, 2015Publication date: March 31, 2016Applicant: Renesas Electronics CorporationInventors: Masashi ARAKAWA, Tadashi FUKUI, Koji TAKAYANAGI
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Publication number: 20160042984Abstract: A substrate heating device includes: heating modules each having a processing vessel within which a heating plate is disposed, an gas inlet port for introducing a purge gas into a processing atmosphere, and an exhaust port for exhausting the processing atmosphere; individual exhaust paths each connected to the exhaust port of the heating modules; a common exhaust path connected to downstream ends of the individual exhaust paths of the heating modules; a branch path branched from the individual exhaust paths and opened to the outside of the processing vessel; and an exhaust flow rate adjusting unit configured to adjust a flow rate ratio of an exhaust flow rate of a gas exhausted from the exhaust port into the common exhaust path and an introduction flow rate of a gas introduced from the outside of the processing vessel into the common exhaust path through the branch path.Type: ApplicationFiled: August 3, 2015Publication date: February 11, 2016Inventors: Masato MIZUTA, Koji TAKAYANAGI
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Publication number: 20150371853Abstract: A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a supply part supplying a coating solution to a front surface of the substrate held on the substrate holding part; and an airflow control plate provided at a predetermined position above the substrate held on the substrate holding part for locally changing an airflow above the substrate rotated by the rotation part at an arbitrary position.Type: ApplicationFiled: July 30, 2015Publication date: December 24, 2015Inventors: Kousuke YOSHIHARA, Koji TAKAYANAGI, Shinichi HATAKEYAMA, Kohei KAWAKAMI
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Patent number: 9165763Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.Type: GrantFiled: July 3, 2013Date of Patent: October 20, 2015Assignee: Tokyo Electron LimitedInventors: Katsunori Ichino, Koji Takayanagi, Tomohiro Noda
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Patent number: 9162247Abstract: A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a supply part supplying a coating solution to a front surface of the substrate held on the substrate holding part; and an airflow control plate provided at a predetermined position above the substrate held on the substrate holding part for locally changing an airflow above the substrate rotated by the rotation part at an arbitrary position.Type: GrantFiled: April 17, 2012Date of Patent: October 20, 2015Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Koji Takayanagi, Shinichi Hatakeyama, Kohei Kawakami
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Publication number: 20150151227Abstract: A filter device includes a housing having space, a filter in the space of the housing, a first joint connected to a first port of the housing and having an open end which connects to a supply path of a processing liquid, a second joint connected to a second port of the housing and having an open end which connects to the path, and an exhaust joint connected to an exhaust port of the housing and having an open end which connects to an exhaust path. The first and second ports introduce or discharge the liquid and have openings to the opposite end portions of the space, respective, the filter is intersecting a straight line passing through the centers of the first and second ports, and the first, the second and exhaust joints are formed to extend in the same direction outside the space of the housing.Type: ApplicationFiled: November 14, 2014Publication date: June 4, 2015Applicant: TOKYO ELECTRON LIMITEDInventors: Koji TAKAYANAGI, Kousuke Yoshihara
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Publication number: 20150125793Abstract: A processing liquid supplying apparatus performs an ejecting step in which a processing liquid suctioned into a pump passes through a filter device and is ejected from an ejecting part without returning the processing liquid back to the pump; a returning step in which the processing liquid suctioned into the pump is returned to a processing liquid source side of a mixing section; and a replenishing step in which the processing liquid returned to the processing liquid source side is suctioned into the pump together with the processing liquid replenished from the processing liquid source. The processing liquid passes through the filter device in at least one of the returning step and the replenishing step. The amount of the processing liquid returned to the processing liquid source side in the returning step is larger than the amount of the processing liquid ejected from the ejecting part in the ejecting step.Type: ApplicationFiled: October 30, 2014Publication date: May 7, 2015Inventors: Kousuke YOSHIHARA, Koji TAKAYANAGI, Toshinobu FURUSHO, Takashi SASA, Daisuke ISHIMARU
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Publication number: 20150090340Abstract: A processing-liquid supply apparatus includes a source, a discharge device, a supply channel connecting the source and discharge device, a filter device positioned in the channel to form first side having the source and second side having the discharge device, a pump device positioned in the channel, and a control device which controls suction and discharge by the pump device. The control device controls the pump device such that the liquid is discharged from the discharge device, that remaining of the liquid on the second side is suctioned to be returned to the first side and that the remaining of the liquid returned to the first side flows from the first toward second side together with refill of the liquid from the source, and the control device is set such that return amount of the liquid to the filter device is equal to or greater than amount of the discharge.Type: ApplicationFiled: September 26, 2014Publication date: April 2, 2015Applicant: TOKYO ELECTRON LIMITEDInventors: Koji Takayanagi, Kousuke Yoshihara, Yuichi Terashita, Toshinobu Furusho, Takashi Sasa
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Publication number: 20150092167Abstract: Disclosed is a processing liquid supplying apparatus. The apparatus includes: a processing liquid supply source configured to supply a processing liquid for processing a substrate to be processed; an ejection unit configured to eject the processing liquid to the substrate to be processed; a filter device configured to remove foreign matters in the processing liquid; a supply pump and an ejection pump which are provided in the supply path at a primary side and a secondary side of the filter device, respectively; and a control unit configured to output a control signal to decompress and degas the processing liquid supplied from the processing liquid supply source by using one of the supply pump and the ejection pump, and subsequently, pass the degassed processing liquid through the filter device beginning from the primary side to the secondary side of the filter device by using the supply pump and the ejection pump.Type: ApplicationFiled: September 15, 2014Publication date: April 2, 2015Inventors: Yuichi Terashita, Kousuke Yoshihara, Koji Takayanagi, Toshinobu Furusho, Takashi Sasa
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Patent number: 8851011Abstract: In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.Type: GrantFiled: March 15, 2013Date of Patent: October 7, 2014Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Tomohiro Iseki, Koji Takayanagi
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Publication number: 20140174475Abstract: A filtration efficiency, which is similar to the filtration efficiency obtained when a plurality of filters are provided, can be obtained by one filter, and decrease in throughput can be prevented. Based on a control signal from a control unit 101, a resist liquid L is sucked into a pump 70 through a filter. A part of the resist liquid sucked in the pump is discharged from a discharge nozzle 7. The remaining resist liquid is returned to a supply conduit 51b on a primary side of the filter. A process is synthesized by adding a replenishment amount equal to the discharge amount to the return amount. The discharge of the synthesized process liquid and the filtration thereof by the filter are performed the number of times corresponding to a rate between the discharge amount and the return amount.Type: ApplicationFiled: December 10, 2013Publication date: June 26, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Koji TAKAYANAGI, Yukie MINEKAWA, Yuichi YOSHIDA, Kousuke YOSHIHARA, Yuichi TERASHITA, Toshinobu FURUSHO, Takashi SASA
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Publication number: 20140034584Abstract: According to an embodiment of the present disclosure, a process liquid supply apparatus operating method is provided. The method includes filling a filter unit with a process liquid from an upstream side of the filter unit to a downstream side of the filter unit after newly mounting or replacing the filter unit and repeating a depressurization filtering process and a pressurization filtering process for a predetermined number of times. The depressurization filtering process depressurizes the process liquid in the downstream side of the filter unit and thereby allows the process liquid to permeate through the filter unit. The pressurization filtering process pressurizes the process liquid from the upstream side of the filter unit and thereby allows the process liquid to permeate through the filter unit.Type: ApplicationFiled: August 1, 2013Publication date: February 6, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Hiroshi MARUMOTO, Koji TAKAYANAGI, Kenji ADACHI
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Publication number: 20130295777Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.Type: ApplicationFiled: July 3, 2013Publication date: November 7, 2013Inventors: Katsunori ICHINO, Koji TAKAYANAGI, Tomohiro NODA
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Publication number: 20130285055Abstract: A semiconductor device according to the present invention includes: a through via formed to penetrate a semiconductor substrate; first and second buffer circuits; a wiring forming layer formed in an upper layer of the semiconductor substrate; a connecting wiring portion formed in an upper portion of the through via assuming that a direction from the semiconductor substrate to the wiring forming layer is an upward direction, the connecting wiring portion being formed on a chip inner end face that faces the upper portion of the semiconductor substrate at an end face of the through via; a first path connecting the first buffer circuit and the through via; and a second path connecting the second buffer circuit and the through via. The first path and the second path are electrically connected through the connecting wiring portion.Type: ApplicationFiled: April 5, 2013Publication date: October 31, 2013Applicant: RENESAS ELECTRONICS CORPORATIONInventor: Koji TAKAYANAGI
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Publication number: 20130239887Abstract: In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.Type: ApplicationFiled: March 15, 2013Publication date: September 19, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Kousuke Yoshihara, Tomohiro Iseki, Koji Takayanagi
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Patent number: 8501274Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.Type: GrantFiled: August 12, 2010Date of Patent: August 6, 2013Assignee: Tokyo Electron LimitedInventors: Katsunori Ichino, Koji Takayanagi, Tomohiro Noda