Abstract: An expansion device includes: a thermal distension unit configured to thermally distend a thermally-expandable sheet by irradiating the thermally-expandable sheet with predetermined energy; a reading unit configured to read identifiers provided at predetermined positions of the thermally-expandable sheet; and a setting unit configured to set an amount of energy per unit area to be emitted on the thermally-expandable sheet by the thermal distension unit depending on whether (i) a second identifier as well as a first identifier has been read, or (ii) whether a predetermined part of the first identifier has been read but another part has not been read, as a result of reading the identifiers by the reading unit.

Abstract: A photothermal conversion image generating device that generates a photothermal conversion image for forming a three-dimensional image by causing a thermally expandable sheet having a thermally expandable layer on a base material to expand, the device including: a processor that allocates, based on a line width of a line forming the three-dimensional image, an image for forming the line to either a front surface of the thermally expandable sheet or a rear surface of the thermally expandable sheet.

Abstract: A method of manufacturing a semiconductor chip includes: preparing a semiconductor wafer; forming a mask on a front surface of the semiconductor wafer so as to cover each of the element regions and to expose the dividing region; exposing the front surface to plasma in a state where a back surface of the semiconductor wafer is held with a dicing tape to dice the semiconductor wafer into a plurality of semiconductor chips by etching the dividing region exposed from the mask up to the back surface while protecting each of the element regions with the mask from plasma; and removing the mask from the front surface together with an adhesive tape by peeling off the adhesive tape after sticking the adhesive tape to the side of the front surface.

Abstract: A display device, including: a storage unit in which page image data including a figure or a photograph and figure photo information are stored so as to be associated with each other for each page, the figure photo information corresponding to a figure or a photograph included in a page, being information for individually displaying the figure or the photograph and including area information which indicates an area occupied by the figure or the photograph in page image data corresponding to the page; a display unit; an operation unit; an identification unit; and a display control unit.

Abstract: In an armature coil according to the present invention and, more particularly, in an armature coil including a plurality of coil conductors wound around a plurality of slots which are formed in a stator core and opened on the radially inner side, the circumferential width of the plurality of the coil conductors is formed in a substantially trapezoidal shape which gets narrower toward the radially inner side and the cross-sectional areas of the plurality of the coil conductors in the slot are each substantially the same and the circumferential width thereof is formed narrower as the coil conductor is arranged toward the radially inner side; and one coil conductor is formed in a convex shape and another coil conductor is formed in a concave shape along the convex shape.

Abstract: An image pickup apparatus enabling release time lag reduction. A first holder holds a first mirror and is movable between a first position in an optical path and a second position retracted from the optical path. A second holder holding a second mirror in a state rotatably attached to the first holder is movable between a third position in the optical path and a fourth position retracted from the optical path. An MPU causes an mirror drive unit to rotate the second holder in the third position toward the first holder in the first position, after termination of focus detection when the first and second holder are in the first and third positions, respectively, and before image pickup is instructed, to thereby move the second holder to a fifth position closer to the first holder than the third position is.

Abstract: A photothermal conversion image generating device that generates a photothermal conversion image for forming a three-dimensional image by causing a thermally expandable sheet having a thermally expandable layer on a base material to expand, the device including: a processor that allocates, based on a line width of a line forming the three-dimensional image, an image for forming the line to either a front surface of the thermally expandable sheet or a rear surface of the thermally expandable sheet.

Abstract: In an armature coil according to the present invention and, more particularly, in an armature coil including a plurality of coil conductors wound around a plurality of slots which are formed in a stator core and opened on the radially inner side, the circumferential width of the plurality of the coil conductors is formed in a substantially trapezoidal shape which gets narrower toward the radially inner side and the cross-sectional areas of the plurality of the coil conductors in the slot are each substantially the same and the circumferential width thereof is formed narrower as the coil conductor is arranged toward the radially inner side; and one coil conductor is formed in a convex shape and another coil conductor is formed in a concave shape along the convex shape.

Abstract: A stator in which stator coils are formed by a plurality of unit coils arranged so as to be shifted from each other in the circumferential direction and each having: a first slot-accommodated portion; a second slot-accommodated portion; a first terminal wire extending from the first slot-accommodated portion; a second terminal wire extending from the second slot-accommodated portion and shifted from the first terminal wire by one line of a conductive wire; a terminal-side coil end portion; and first and second anti-terminal-side coil end portions, wherein the first terminal wire and the second terminal wire of the respective different unit coils are joined with each other.

Abstract: An image pickup apparatus enabling release time lag reduction. A first holder holds a first mirror and is movable between a first position in an optical path and a second position retracted from the optical path. A second holder holding a second mirror in a state rotatably attached to the first holder is movable between a third position in the optical path and a fourth position retracted from the optical path. An MPU causes an mirror drive unit to rotate the second holder in the third position toward the first holder in the first position, after termination of focus detection when the first and second holder are in the first and third positions, respectively, and before image pickup is instructed, to thereby move the second holder to a fifth position closer to the first holder than the third position is.

Abstract: A mounting member includes a plurality of internal connecting portions, each of which is electrically connected to an electronic device, and a plurality of external connecting portions, each of which is soldered, wherein the plurality of external connecting portions include a first connecting portion in communication with at least any of the plurality of internal connecting portions, and a second connecting portion different from the first connecting portion, and surfaces of the first connecting portion and the second connecting portion include gold layers, and a thickness of the gold layer of the second connecting portion is smaller than a thickness of the gold layer of the first connecting portion.

Abstract: In an armature coil according to the present invention and, more particularly, in an armature coil including a plurality of coil conductors wound around a plurality of slots which are formed in a stator core and opened on the radially inner side, the circumferential width of the plurality of the coil conductors is formed in a substantially trapezoidal shape which gets narrower toward the radially inner side and the cross-sectional areas of the plurality of the coil conductors in the slot are each substantially the same and the circumferential width thereof is formed narrower as the coil conductor is arranged toward the radially inner side; and one coil conductor is formed in a convex shape and another coil conductor is formed in a concave shape along the convex shape.

Abstract: A mounting member includes a plurality of internal connecting portions, each of which is electrically connected to an electronic device, and a plurality of external connecting portions, each of which is soldered, wherein the plurality of external connecting portions include a first connecting portion in communication with at least any of the plurality of internal connecting portions, and a second connecting portion different from the first connecting portion, and surfaces of the first connecting portion and the second connecting portion include gold layers, and a thickness of the gold layer of the second connecting portion is smaller than a thickness of the gold layer of the first connecting portion.

Abstract: According to one embodiment, a first frame includes a first thin plate section and a first thick plate section. A second frame includes a second thin plate section and a second thick plate section. A semiconductor chip includes a first electrode bonded to a first inner surface of the first thin plate section of the first frame, and a second electrode bonded to a second inner surface of the second thick plate section of the second frame. A resin layer seals the semiconductor chip, but leaves exposed the first outer surface of the first frame and the second outer surface of the second frame.

Abstract: According to one embodiment, a grinding apparatus includes a chuck table, a grinding wheel that is pressed against a plurality of separate ground surfaces of a plurality of workpieces fixed to the chuck table while rotating to grind the workpieces, a measuring device that measures heights of the ground surfaces, and a control device that controls amount of grinding of the workpieces based on the heights of the plurality of ground surfaces measured before grinding the workpieces, and the heights of the plurality of ground surfaces measured after grinding the workpieces.

Abstract: According to one embodiment, a first frame includes a first thin plate section and a first thick plate section. A second frame includes a second thin plate section and a second thick plate section. A semiconductor chip includes a first electrode bonded to a first inner surface of the first thin plate section of the first frame, and a second electrode bonded to a second inner surface of the second thick plate section of the second frame. A resin layer seals the semiconductor chip, but leaves exposed the first outer surface of the first frame and the second outer surface of the second frame.

Abstract: A display device, including: a storage unit in which page image data including a figure or a photograph and figure photo information are stored so as to be associated with each other for each page, the figure photo information corresponding to a figure or a photograph included in a page, being information for individually displaying the figure or the photograph and including area information which indicates an area occupied by the figure or the photograph in page image data corresponding to the page; a display unit; an operation unit; an identification unit; and a display control unit.

Abstract: In one embodiment, a heat dissipation connector mounted on a semiconductor chip and sealed up with a molding resin along with the semiconductor chip and a lead frame includes a heat dissipation portion configured to have a block shape, and have an upper face exposed out of the molding resin. The connector further includes a connecting portion configured to extend from a first side face of the heat dissipation portion, and electrically connect an electrode arranged on the semiconductor chip to the lead frame. The heat dissipation portion and the connecting portion are integrally made of the same metal sheet.

Abstract: In one embodiment, a semiconductor device includes a lead frame including an island portion and a terminal portion separated from the island portion. The device further includes a semiconductor chip mounted on the island portion and including an electrode. The device further includes an insulating layer disposed on the semiconductor chip and having an opening to expose at least a part of the electrode. The device further includes a connector covering the electrode exposed through the opening and electrically connecting the electrode and the terminal portion.

Abstract: There is provided a net comprising a plurality of attack-resistant cords joined in a net mesh, wherein each attack-resistant cord comprises one or more hard metal wires running at least partially along its length and one or more high tenacity yarns having a tenacity of at least 1.5N/tex.