Patents by Inventor Koji Torii

Koji Torii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing device having a pad which has grooves and holes
    Patent number: 5725420
    Abstract: Shallow grooves are formed on the surface of a hard layer of a polishing pad for polishing the wafer so as to join a plurality of. Since the grooves are formed for causing no negative pressure between the polishing pad and the wafer, the distance between the grooves is made more than several times as large as the pitch between the holes.
    Type: Grant
    Filed: October 22, 1996
    Date of Patent: March 10, 1998
    Assignee: NEC Corporation
    Inventor: Koji Torii