Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

Abstract: A wiper motor has: a magnet disposed on the yoke and formed with at least four poles; an armature disposed on an inner side of the magnet; a speed reduction mechanism unit having an output shaft for transmitting the rotation of the armature shaft; a gear housing connected to the yoke; a gear housing cover covering an opening of the gear housing; a magnet attached to the output shaft of the speed reduction mechanism unit; an absolute position detecting sensor disposed so as to face the magnet; and a control board having the absolute position detecting sensor attached thereto, the control board being disposed between the gear housing and the gear housing cover, and configured to control the rotation of the armature shaft.

Abstract: In a brush holder accommodating part 26d of a gear housing 26, paired flat surface parts 26c and paired curved parts 26b are alternately disposed so as to be formed into an elliptical shape, one of the paired flat surface parts is formed with first heat sinks 26i, and two brushes 20 and 20 mounted on a brush holder unit 19 accommodated in the brush holder accommodating part 26d are disposed near the first heat sinks 26i.

Abstract: An object is to overcome the drawbacks of conventional blue phthalocyanine pigments upon the formation of images, and to develop a blue pigment that can satisfactorily exhibit a greenish blue color high in chroma and excellent in colorfulness, brightness, dispersibility, hue, tinting power and the like and that is applicable to various image recording methods. The object can be achieved by a greenish blue pigment, which exhibits a greenish blue hue of high chroma and contains a pigment represented by the following formula (I): wherein the number, m, of substituent phthalimidomethyl group(s) is in a range of 1.0?m?5.0, and the number, n, of a substituent sulfonic group R1 is in a range of 0.05?n?1.0.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: In a brush holder accommodating part 26d of a gear housing 26, paired flat surface parts 26c and paired curved parts 26b are alternately disposed so as to be formed into an elliptical shape, one of the paired flat surface parts is formed with first heat sinks 26i, and two brushes 20 and 20 mounted on a brush holder unit 19 accommodated in the brush holder accommodating part 26d are disposed near the first heat sinks 26i.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: An object is to overcome the drawbacks of conventional blue phthalocyanine pigments upon the formation of images, and to develop a blue pigment that can satisfactorily exhibit a greenish blue color high in chroma and excellent in colorfulness, brightness, dispersibility, hue, tinting power and the like and that is applicable to various image recording methods. The object can be achieved by a greenish blue pigment, which exhibits a greenish blue hue of high chroma and contains a pigment represented by the following formula (I): wherein the number, m, of substituent phthalimidomethyl group(s) is in a range of 1.0?m?5.0, and the number, n, of a substituent sulfonic group R1 is in a range of 0.05?n?1.0.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: There are constituted by a tab on which a semiconductor chip is mounted, a sealing portion formed by resin-sealing the semiconductor chip, a plurality of leads each having a mounted surface exposed to a peripheral portion of a rear surface of the sealing portion and a sealing-portion forming surface disposed on an opposite side thereto, and a wire for connecting a pad of the semiconductor chip and a lead, wherein the length between inner ends of the sealing-portion forming surfaces of the leads disposed so as to oppose to each other is formed to be larger than the length between inner ends of the mounted surfaces. Thereby, a chip mounting region surrounded by the inner end of the sealing-portion forming surface of each lead can be expanded and the size of the mountable chip is increased.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: There are constituted by a tab on which a semiconductor chip is mounted, a sealing portion formed by resin-sealing the semiconductor chip, a plurality of leads each having a mounted surface exposed to a peripheral portion of a rear surface of the sealing portion and a sealing-portion forming surface disposed on an opposite side thereto, and a wire for connecting a pad of the semiconductor chip and a lead, wherein the length between inner ends of the sealing-portion forming surfaces of the leads disposed so as to oppose to each other is formed to be larger than the length between inner ends of the mounted surfaces. Thereby, a chip mounting region surrounded by the inner end of the sealing-portion forming surface of each lead can be expanded and the size of the mountable chip is increased.

Abstract: There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

Abstract: In a brush holder accommodating part 26d of a gear housing 26, paired flat surface parts 26c and paired curved parts 26b are alternately disposed so as to be formed into an elliptical shape, one of the paired flat surface parts is formed with first heat sinks 26i, and two brushes 20 and 20 mounted on a brush holder unit 19 accommodated in the brush holder accommodating part 26d are disposed near the first heat sinks 26i.

Abstract: A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

Abstract: In processing new damage, when a character passes a first devastating flame and drops into a next devastating flame, damage of the latter devastating flame is deemed first damage, and the “game continuity ability value” is exempted from decrement. If the character drops into a further devastating flame, such drop is not new damage, and the “game continuity ability value” is decreased by a predetermined decrement value. In processing recurrent damage, when the character passes a first devastating flame, drops into a second devastating flame and drops again into a third devastating flame, the first failure occurs at the second devastating flame, and the “game continuity ability value” is decreased by a predetermined value, and is exempted from decrement at the third devastating flame because the drop is a recurrent failure.

Abstract: There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

Abstract: There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.