Abstract: There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

Abstract: There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

Abstract: There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

Abstract: A semiconductor device which permits reduction in the number of pins and in size thereof is provided.

Abstract: A semiconductor device which permits reduction in the number of pins and in size thereof is provided.

Abstract: A semiconductor device which permits reduction in the number of pins and in size thereof is provided.

Abstract: There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

Abstract: According to the exceptional processing of new damage, when the character (230) succeeds in passing the first devastating flame (340A) and drops into the next devastating flame 340D, since the damage of the devastating flame (340D) is the first damage, the “game continuity ability value” is exempted from decrement. However, if the character (230) drops again into the devastating flame 340G, since it is not the new damage, the “game continuity ability value” is decreased by a predetermined decrement value. According to the exceptional processing of recurrent damage, when the character (230) succeeds in passing the devastating flame (340A), drops into the devastating flame (340D) and drops again into the devastating flame (340G), since the first failure occurs at the devastating flame (340D), the “game continuity ability value” is decreased by a predetermined value. And the “game continuity ability value” is exempted from decrement at the devastating flame (340G) because the drop is a recurrent failure.

Abstract: A semiconductor device which permits reduction in the number of pins and in size thereof is provided.

Abstract: A gaming system includes a parent game apparatus and at least one child game apparatus which is connectable to the parent game apparatus. A main game program executes on the parent game apparatus and is ordinarily controlled by player actions on the parent game apparatus. When the main game reaches a predetermined state, the parent gain apparatus downloads a subgame to a child game apparatus connected to the parent game apparatus. The subgame executes on the child game apparatus and transfers a result of the subgame to the parent game apparatus. The result of the subgame affects the state of the main game.

Abstract: A finely divided pigment is formed of an aggregate of primary particles. A number of primary particles of not greater than 0.1 &mgr;m in particle size is at least 95% of an entire number of the primary particles, and a number of primary particles of greater than 0.1 &mgr;m in particle size is at most 5% of the entire number of the primary particles. The finely divided pigment can be produced by grinding a parent pigment (pre-division pigment) together with a water-soluble inorganic salt and a water-soluble organic solvent in a grinding machine at a temperature of from 30 to 90° C. for 2 to 6 hours under a load, and then removing the water-soluble inorganic salt and the water-soluble organic solvent. A coloring composition comprises a dispersing medium and the finely divided pigment dispersed in the dispersing medium.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

Abstract: A finely divided pigment is formed of an aggregate of primary particles. A number of primary particles of not greater than 0.1 &mgr;m in particle size is at least 95% of an entire number of the primary particles, and a number of primary particles of greater than 0.1 &mgr;m in particle size is at most 5% of the entire number of the primary particles. The finely divided pigment can be produced by grinding a parent pigment (pre-division pigment) together with a water-soluble inorganic salt and a water-soluble organic solvent in a grinding machine at a temperature of from 30 to 90° C. for 2 to 6 hours under a load, and then removing the water-soluble inorganic salt and the water-soluble organic solvent. A coloring composition comprises a dispersing medium and the finely divided pigment dispersed in the dispersing medium.

Abstract: A memory device has a small-sized LCD disposed on an upper part of the front side of a case, and operation buttons disposed below the LCD. An external connection terminal for connecting a game apparatus or others to an outside apparatus is disposed in the lower side of the case nearer the front side thereof. A controller has a card slot for the memory device to be loaded in, which is provided in an upper part of an operation side thereof. The card slot has a window opened so as to expose a required part of the memory device when the memory device is loaded in the controller. With the memory device loaded in the controller a game player operates the operation buttons while watching the LCD of the memory device.

Abstract: A memory device has a small-sized LCD disposed on an upper part of the front side of a case, and operation buttons disposed below the LCD. An external connection terminal for connecting a game apparatus or others to an outside apparatus is disposed in the lower side of the case nearer the front side thereof. A controller has a card slot for the memory device to be loaded in, which is provided in an upper part of an operation side thereof. The card slot has a window opened so as to expose a required part of the memory device when the memory device is loaded in the controller. With the memory device loaded in the controller a game player operates the operation buttons while watching the LCD of the memory device.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

Abstract: Tricyclic benzazepine compounds represented by the following formula (I) and pharmacologically acceptable salts thereof are disclosed. These compounds have antiallergic activity and are useful for treatment and prevention of bronchial asthma, eczema, hives, allergic gastrointestinal troubles, allergic rhinitis, allergic conjunctivitis, etc. wherein R represents a hydrogen atom, substituted C.sub.1-6 alkyl or a protective group and R.sup.1, R.sup.2, R.sup.3, and R.sup.4 represent a hydrogen atom, a hydroxyl group, substituted C.sub.1-4 alkyl, substituted C.sub.2-12 alkenyl, substituted C.sub.1-12 alkoxy, or substituted amino.

Abstract: Compounds of formulae (II), (III), (IV) and (V) or salts thereof are intermediates for pharmacologically active tricyclic benzazepine and benzothiazepine derivatives, ##STR1## wherein R represents hydrogen, alkyl, phenylalkyl, or a protective group of a triazole ring, R.sup.1 -R.sup.5 represent hydrogen, alkyl, alkenyl, alkoxy, amino, oxim or hydroxyl, and R.sup.41 represents hydrogen, C.sub.1-6 alkyl which may be optionally substituted, or a protective group for a carboxyl group.

Abstract: The tricyclic benzazepine and benzothiazepine derivatives represented by the formula (I) and pharmacologically acceptable salts thereof are disclosed. ##STR1## wherein Z represents CO, --CR.sup.6 R.sup.7 -- or --S(O).sub.n, R represents hydrogen, alkyl, phenylalkyl, or a protective group of a triazole ring, R.sup.1 -R.sup.5 represent hydrogen, alkyl, alkenyl, alkoxy, amino, oxim or hydroxyl. These compounds have anti-allergic effect and are useful for the treatment and prophylaxis of allergic diseases.