Patents by Inventor Koji Tsukagoshi
Koji Tsukagoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11764131Abstract: The present invention provides a small and thin semiconductor device. The semiconductor device flip-chip bonds a semiconductor chip 1 and a lead 6 via a metal bonding portion 5 and includes a sealing resin covering them. The metal bonding portion 5 is provided with a gold-rich bonding layer 5a on the side of a first electrode 3a of the semiconductor chip 1 and a gold-rich bonding layer 5b on the side of a second electrode 3b of the lead 6, and connection between the semiconductor chip 1 and the lead 6 is strengthened, so that the semiconductor device does not require an anchor portion.Type: GrantFiled: December 27, 2021Date of Patent: September 19, 2023Assignee: ABLIC Inc.Inventor: Koji Tsukagoshi
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Publication number: 20220238418Abstract: The present invention provides a small and thin semiconductor device. The semiconductor device flip-chip bonds a semiconductor chip 1 and a lead 6 via a metal bonding portion 5 and includes a sealing resin covering them. The metal bonding portion 5 is provided with a gold-rich bonding layer 5a on the side of a first electrode 3a of the semiconductor chip 1 and a gold-rich bonding layer 5b on the side of a second electrode 3b of the lead 6, and connection between the semiconductor chip 1 and the lead 6 is strengthened, so that the semiconductor device does not require an anchor portion.Type: ApplicationFiled: December 27, 2021Publication date: July 28, 2022Applicant: ABLIC Inc.Inventor: Koji TSUKAGOSHI
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Patent number: 11069824Abstract: An optical sensor device has an optical semiconductor element fixed into a recessed portion of a base portion, and a pad portion of the optical semiconductor element is electrically connected to a lead portion of the base portion. On an upper surface of a protruding portion provided in an outer region of the base portion, a metallization layer having notch portions, a metal bonding layer, a metallization layer having notch portions, and a lid portion are provided. Through use of the metallization layers and the metal bonding layer, the lid portion can be hermetically bonded to the base portion.Type: GrantFiled: January 31, 2020Date of Patent: July 20, 2021Assignee: ABLIC INC.Inventor: Koji Tsukagoshi
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Patent number: 11024563Abstract: A semiconductor device includes: a die pad; a semiconductor chip mounted on the die pad; a lead having an outer lead part and an inner lead par which is set up by a lead leg part extending from the outer lead part; an encapsulating resin sealing the die pad, the semiconductor chip, and the lead so that the lead is partially exposed; a support resin part provided on a bottom surface of the inner lead part, the support resin part being a portion of the encapsulating resin; and a notch part where the encapsulating resin is absent, and locating in a region surrounded by a bottom surface of the support resin part, an outer side surface of the outer lead part and an outer side surface of the lead leg part.Type: GrantFiled: March 13, 2019Date of Patent: June 1, 2021Assignee: ABLIC Inc.Inventor: Koji Tsukagoshi
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Patent number: 10794760Abstract: This optical sensor device includes a first light receiving portion having sensitivity to ultraviolet light, a first sealing portion covering the first light receiving portion, a second light receiving portion having sensitivity to ultraviolet light, and a second sealing portion which covers the second light receiving portion. At least one of the first sealing portion and the second sealing portion is configured to transmit at least part of a ultraviolet light wavelength band, the first sealing portion is formed from one or more resin layers and has transmission spectral characteristics that a first wavelength is set as a lower limit value of a transmission wavelength band, and the second sealing portion is formed from one or more resin layers and has transmission spectral characteristics that a second wavelength different from the first wavelength is set as a lower limit value of the transmission wavelength band.Type: GrantFiled: February 13, 2018Date of Patent: October 6, 2020Assignees: ABLIC INC., TOHOKU TECHNO ARCH CO., LTD.Inventors: Koji Tsukagoshi, Shigetoshi Sugawa, Rihito Kuroda
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Publication number: 20200259023Abstract: An optical sensor device has an optical semiconductor element fixed into a recessed portion of a base portion, and a pad portion of the optical semiconductor element is electrically connected to a lead portion of the base portion. On an upper surface of a protruding portion provided in an outer region of the base portion, a metallization layer having notch portions, a metal bonding layer, a metallization layer having notch portions, and a lid portion are provided. Through use of the metallization layers and the metal bonding layer, the lid portion can be hermetically bonded to the base portion.Type: ApplicationFiled: January 31, 2020Publication date: August 13, 2020Inventor: Koji TSUKAGOSHI
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Publication number: 20190287882Abstract: A semiconductor device includes: a die pad; a semiconductor chip mounted on the die pad; a lead having an outer lead part and an inner lead par which is set up by a lead leg part extending from the outer lead part; an encapsulating resin sealing the die pad, the semiconductor chip, and the lead so that the lead is partially exposed; a support resin part provided on a bottom surface of the inner lead part, the support resin part being a portion of the encapsulating resin; and a notch part where the encapsulating resin is absent, and locating in a region surrounded by a bottom surface of the support resin part, an outer side surface of the outer lead part and an outer side surface of the lead leg part.Type: ApplicationFiled: March 13, 2019Publication date: September 19, 2019Applicant: ABLIC Inc.Inventor: Koji TSUKAGOSHI
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Patent number: 10340397Abstract: A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.Type: GrantFiled: May 23, 2017Date of Patent: July 2, 2019Assignee: ABLIC Inc.Inventor: Koji Tsukagoshi
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Publication number: 20180231414Abstract: This optical sensor device includes a first light receiving portion having sensitivity to ultraviolet light, a first sealing portion covering the first light receiving portion, a second light receiving portion having sensitivity to ultraviolet light, and a second sealing portion which covers the second light receiving portion. At least one of the first sealing portion and the second sealing portion is configured to transmit at least part of a ultraviolet light wavelength band, the first sealing portion is formed from one or more resin layers and has transmission spectral characteristics that a first wavelength is set as a lower limit value of a transmission wavelength band, and the second sealing portion is formed from one or more resin layers and has transmission spectral characteristics that a second wavelength different from the first wavelength is set as a lower limit value of the transmission wavelength band.Type: ApplicationFiled: February 13, 2018Publication date: August 16, 2018Inventors: Koji TSUKAGOSHI, Shigetoshi SUGAWA, Rihito KURODA
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Patent number: 9997645Abstract: A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of each of a plurality of leads are molded with a resin so as to be integrated, the part of each of the plurality of leads being embedded in and completely surrounded by the first resin molded portion. The second resin molded portion is molded over at least a portion of the first resin molded portion to form an outer shape of the package and has embedded therein and completely surrounds a part of each of the plurality of leads. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.Type: GrantFiled: March 3, 2016Date of Patent: June 12, 2018Assignee: SII Semiconductor CorporationInventor: Koji Tsukagoshi
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Patent number: 9773926Abstract: An optical sensor device includes a resin sealing portion for sealing an optical sensor element fixed to an element-mounting portion. The resin sealing portion is constituted of a resin having mixed and dispersed therein a glass filler obtained by pulverizing a phosphate-based glass which has spectral luminous efficacy properties by composition adjustment and high heat resistance and weatherability. The optical sensor device is highly reliable and capable of accommodating size and thickness reductions in packages and has stable and hardly changeable spectral luminous efficacy properties.Type: GrantFiled: January 27, 2015Date of Patent: September 26, 2017Assignee: SII Semiconductor CorporationInventors: Koji Tsukagoshi, Noriyoshi Higashi
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Publication number: 20170256658Abstract: A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.Type: ApplicationFiled: May 23, 2017Publication date: September 7, 2017Inventor: Koji TSUKAGOSHI
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Patent number: 9716190Abstract: An optical sensor device comprises an element-mounting portion, an optical sensor element provided on the element-mounting portion, a lead having a first contact region connected to the optical sensor element and a second contact region for an external connection, and a resin-encapsulating portion which covers at least a light-receiving plane of the optical sensor element. The resin-encapsulating portion comprises a resin and a glass filler including borosilicate glass dispersed in the resin. The transmissivity of the resin-encapsulating portion in one example is equal to or more than 40% in a wavelength range between 300 nm to 400 nm, and in another example is equal to or more than 60% in a wavelength range between 300 nm and 350 nm.Type: GrantFiled: March 18, 2016Date of Patent: July 25, 2017Assignee: SII Semiconductor CorporationInventors: Koji Tsukagoshi, Noriyoshi Higashi
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Patent number: 9691914Abstract: The following configuration is adopted in order to provide a highly reliable optival sensor device which enhances the reliability of devices without making the devices unsuitable for size and thickness reductions. The light sensor comprises an element-mounting portion (3) having a cavity and a lid member closely attached thereinto, the lid member being composed of: a window (2) constituted of a phosphate-based glass to which properties approximate to a spectral luminous efficacy properties have been imparted by compositional control; and a frame (1) constituted of a phosphate-based glass having light-shielding properties.Type: GrantFiled: January 27, 2015Date of Patent: June 27, 2017Assignee: SII Semiconductor CorporationInventors: Koji Tsukagoshi, Noriyoshi Higashi
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Patent number: 9653624Abstract: The following configuration is adopted in order to provide a highly reliable optival sensor device which enhances the reliability of devices without making the devices unsuitable for size and thickness reductions. The light sensor comprises an element-mounting portion (3) having a cavity and a lid member closely attached thereinto, the lid member being composed of: a window (2) constituted of a phosphate-based glass to which properties approximate to a spectral luminous efficacy properties have been imparted by compositional control; and a frame (1) constituted of a phosphate-based glass having light-shielding properties.Type: GrantFiled: January 27, 2015Date of Patent: May 16, 2017Assignee: SII Semiconductor CorporationInventors: Koji Tsukagoshi, Noriyoshi Higashi
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Publication number: 20160351730Abstract: A highly-reliable optical sensor device which is capable of accommodating size and thickness reductions in packages and which has stable and hardly changeable spectral luminous efficacy properties is provided. The optical sensor device includes a resin sealing portion (1) for sealing an optical sensor element (4) fixed to an element-mounting portion (7), and the resin sealing portion (1) is constituted of a resin and filler obtained by pulverizing a phosphate-based glass which has spectral luminous efficacy properties by composition adjustment and:high heat resistance and weatherability which is mixed and dispersed in the resin.Type: ApplicationFiled: January 27, 2015Publication date: December 1, 2016Inventors: Koji TSUKAGOSHI, Noriyoshi HIGASHI
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Publication number: 20160351731Abstract: The following configuration is adopted in order to provide a highly reliable optival sensor device which enhances the reliability of devices without making the devices unsuitable for size and thickness reductions. The light sensor comprises an element-mounting portion (3) having a cavity and a lid member closely attached thereinto, the lid member being composed of: a window (2) constituted of a phosphate-based glass to which properties approximate to a spectral luminous efficacy properties have been imparted by compositional control; and a frame (1) constituted of a phosphate-based glass having light-shielding properties.Type: ApplicationFiled: January 27, 2015Publication date: December 1, 2016Inventors: Koji TSUKAGOSHI, Noriyoshi HIGASHI
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Publication number: 20160284875Abstract: An optical sensor device according to an aspect of the present invention comprises an element-mounting portion, an optical sensor element provided on the element-mounting portion, a lead having a first contact region connected to the optical sensor element and a second contact region for an external connection, and a resin-encapsulating portion which covers at least a light-receiving plane of the optical sensor element. The resin-encapsulating portion comprises a resin and a glass filler including borosilicate glass dispersed in the resin. The transmissivity of the resin-encapsulating portion is equal to or more than 40% in a wavelength range between 300 nm to 400 nm.Type: ApplicationFiled: March 18, 2016Publication date: September 29, 2016Inventors: Koji TSUKAGOSHI, Noriyoshi HIGASHI
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Publication number: 20160190352Abstract: A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.Type: ApplicationFiled: March 3, 2016Publication date: June 30, 2016Inventor: Koji TSUKAGOSHI
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Patent number: 9362195Abstract: Provided is a semiconductor device including a package having a hollow portion, which can meet the need of reduction in size and thickness. The semiconductor device includes: a resin molded member (1) including a hollow portion (10) having an inner bottom surface on which a semiconductor chip (6) is mounted, a surrounding portion (1b) that surrounds the hollow portion (10), and a bottom surface portion (1a); an inner lead (2e, 2f); and an outer lead (2a, 2b) exposed from the resin molded member (1). The inner lead buried in the molded member (1) includes an L-shaped lead extending portion having a through hole formed therethrough.Type: GrantFiled: June 30, 2014Date of Patent: June 7, 2016Assignee: SII SEMICONDUCTOR CORPORATIONInventors: Koji Tsukagoshi, Sadao Oku, Hiroyuki Fujita, Keiichiro Hayashi, Masaru Akino