Patents by Inventor Koji Tsukagoshi

Koji Tsukagoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190287882
    Abstract: A semiconductor device includes: a die pad; a semiconductor chip mounted on the die pad; a lead having an outer lead part and an inner lead par which is set up by a lead leg part extending from the outer lead part; an encapsulating resin sealing the die pad, the semiconductor chip, and the lead so that the lead is partially exposed; a support resin part provided on a bottom surface of the inner lead part, the support resin part being a portion of the encapsulating resin; and a notch part where the encapsulating resin is absent, and locating in a region surrounded by a bottom surface of the support resin part, an outer side surface of the outer lead part and an outer side surface of the lead leg part.
    Type: Application
    Filed: March 13, 2019
    Publication date: September 19, 2019
    Applicant: ABLIC Inc.
    Inventor: Koji TSUKAGOSHI
  • Patent number: 10340397
    Abstract: A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: July 2, 2019
    Assignee: ABLIC Inc.
    Inventor: Koji Tsukagoshi
  • Publication number: 20180231414
    Abstract: This optical sensor device includes a first light receiving portion having sensitivity to ultraviolet light, a first sealing portion covering the first light receiving portion, a second light receiving portion having sensitivity to ultraviolet light, and a second sealing portion which covers the second light receiving portion. At least one of the first sealing portion and the second sealing portion is configured to transmit at least part of a ultraviolet light wavelength band, the first sealing portion is formed from one or more resin layers and has transmission spectral characteristics that a first wavelength is set as a lower limit value of a transmission wavelength band, and the second sealing portion is formed from one or more resin layers and has transmission spectral characteristics that a second wavelength different from the first wavelength is set as a lower limit value of the transmission wavelength band.
    Type: Application
    Filed: February 13, 2018
    Publication date: August 16, 2018
    Inventors: Koji TSUKAGOSHI, Shigetoshi SUGAWA, Rihito KURODA
  • Patent number: 9997645
    Abstract: A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of each of a plurality of leads are molded with a resin so as to be integrated, the part of each of the plurality of leads being embedded in and completely surrounded by the first resin molded portion. The second resin molded portion is molded over at least a portion of the first resin molded portion to form an outer shape of the package and has embedded therein and completely surrounds a part of each of the plurality of leads. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: June 12, 2018
    Assignee: SII Semiconductor Corporation
    Inventor: Koji Tsukagoshi
  • Patent number: 9773926
    Abstract: An optical sensor device includes a resin sealing portion for sealing an optical sensor element fixed to an element-mounting portion. The resin sealing portion is constituted of a resin having mixed and dispersed therein a glass filler obtained by pulverizing a phosphate-based glass which has spectral luminous efficacy properties by composition adjustment and high heat resistance and weatherability. The optical sensor device is highly reliable and capable of accommodating size and thickness reductions in packages and has stable and hardly changeable spectral luminous efficacy properties.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: September 26, 2017
    Assignee: SII Semiconductor Corporation
    Inventors: Koji Tsukagoshi, Noriyoshi Higashi
  • Publication number: 20170256658
    Abstract: A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.
    Type: Application
    Filed: May 23, 2017
    Publication date: September 7, 2017
    Inventor: Koji TSUKAGOSHI
  • Patent number: 9716190
    Abstract: An optical sensor device comprises an element-mounting portion, an optical sensor element provided on the element-mounting portion, a lead having a first contact region connected to the optical sensor element and a second contact region for an external connection, and a resin-encapsulating portion which covers at least a light-receiving plane of the optical sensor element. The resin-encapsulating portion comprises a resin and a glass filler including borosilicate glass dispersed in the resin. The transmissivity of the resin-encapsulating portion in one example is equal to or more than 40% in a wavelength range between 300 nm to 400 nm, and in another example is equal to or more than 60% in a wavelength range between 300 nm and 350 nm.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: July 25, 2017
    Assignee: SII Semiconductor Corporation
    Inventors: Koji Tsukagoshi, Noriyoshi Higashi
  • Patent number: 9691914
    Abstract: The following configuration is adopted in order to provide a highly reliable optival sensor device which enhances the reliability of devices without making the devices unsuitable for size and thickness reductions. The light sensor comprises an element-mounting portion (3) having a cavity and a lid member closely attached thereinto, the lid member being composed of: a window (2) constituted of a phosphate-based glass to which properties approximate to a spectral luminous efficacy properties have been imparted by compositional control; and a frame (1) constituted of a phosphate-based glass having light-shielding properties.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: June 27, 2017
    Assignee: SII Semiconductor Corporation
    Inventors: Koji Tsukagoshi, Noriyoshi Higashi
  • Patent number: 9653624
    Abstract: The following configuration is adopted in order to provide a highly reliable optival sensor device which enhances the reliability of devices without making the devices unsuitable for size and thickness reductions. The light sensor comprises an element-mounting portion (3) having a cavity and a lid member closely attached thereinto, the lid member being composed of: a window (2) constituted of a phosphate-based glass to which properties approximate to a spectral luminous efficacy properties have been imparted by compositional control; and a frame (1) constituted of a phosphate-based glass having light-shielding properties.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: May 16, 2017
    Assignee: SII Semiconductor Corporation
    Inventors: Koji Tsukagoshi, Noriyoshi Higashi
  • Publication number: 20160351730
    Abstract: A highly-reliable optical sensor device which is capable of accommodating size and thickness reductions in packages and which has stable and hardly changeable spectral luminous efficacy properties is provided. The optical sensor device includes a resin sealing portion (1) for sealing an optical sensor element (4) fixed to an element-mounting portion (7), and the resin sealing portion (1) is constituted of a resin and filler obtained by pulverizing a phosphate-based glass which has spectral luminous efficacy properties by composition adjustment and:high heat resistance and weatherability which is mixed and dispersed in the resin.
    Type: Application
    Filed: January 27, 2015
    Publication date: December 1, 2016
    Inventors: Koji TSUKAGOSHI, Noriyoshi HIGASHI
  • Publication number: 20160351731
    Abstract: The following configuration is adopted in order to provide a highly reliable optival sensor device which enhances the reliability of devices without making the devices unsuitable for size and thickness reductions. The light sensor comprises an element-mounting portion (3) having a cavity and a lid member closely attached thereinto, the lid member being composed of: a window (2) constituted of a phosphate-based glass to which properties approximate to a spectral luminous efficacy properties have been imparted by compositional control; and a frame (1) constituted of a phosphate-based glass having light-shielding properties.
    Type: Application
    Filed: January 27, 2015
    Publication date: December 1, 2016
    Inventors: Koji TSUKAGOSHI, Noriyoshi HIGASHI
  • Publication number: 20160284875
    Abstract: An optical sensor device according to an aspect of the present invention comprises an element-mounting portion, an optical sensor element provided on the element-mounting portion, a lead having a first contact region connected to the optical sensor element and a second contact region for an external connection, and a resin-encapsulating portion which covers at least a light-receiving plane of the optical sensor element. The resin-encapsulating portion comprises a resin and a glass filler including borosilicate glass dispersed in the resin. The transmissivity of the resin-encapsulating portion is equal to or more than 40% in a wavelength range between 300 nm to 400 nm.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 29, 2016
    Inventors: Koji TSUKAGOSHI, Noriyoshi HIGASHI
  • Publication number: 20160190352
    Abstract: A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.
    Type: Application
    Filed: March 3, 2016
    Publication date: June 30, 2016
    Inventor: Koji TSUKAGOSHI
  • Patent number: 9362195
    Abstract: Provided is a semiconductor device including a package having a hollow portion, which can meet the need of reduction in size and thickness. The semiconductor device includes: a resin molded member (1) including a hollow portion (10) having an inner bottom surface on which a semiconductor chip (6) is mounted, a surrounding portion (1b) that surrounds the hollow portion (10), and a bottom surface portion (1a); an inner lead (2e, 2f); and an outer lead (2a, 2b) exposed from the resin molded member (1). The inner lead buried in the molded member (1) includes an L-shaped lead extending portion having a through hole formed therethrough.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: June 7, 2016
    Assignee: SII SEMICONDUCTOR CORPORATION
    Inventors: Koji Tsukagoshi, Sadao Oku, Hiroyuki Fujita, Keiichiro Hayashi, Masaru Akino
  • Patent number: 9240498
    Abstract: Phosphate-based glass doped with copper ions having infrared blocking filter characteristics is formed into particles and is mixed with a transparent encapsulating resin to encapsulate a semiconductor element. The glass particles have a particle diameter four times or more as large as a wavelength of infrared radiation to be blocked. An optical semiconductor device can be obtained having a stable filter characteristics thereof even if an incident light angle changes and is resistant to moisture.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: January 19, 2016
    Assignee: SEIKO INSTRUMENTS INC.
    Inventors: Hiroyuki Fujita, Sadao Oku, Koji Tsukagoshi, Keiichiro Hayashi
  • Patent number: 9219026
    Abstract: A semiconductor device has an island portion on which a semiconductor chip is adhered through intermediation of an insulating paste. Recessed portions having an inverted pyramid shape are formed in a semiconductor chip placing region of the island portion. A first opening angle formed by a normal extending upward from a vertex of each of the plurality of recessed portions each having an inverted pyramid shape and an opening line extending to an outer side of the semiconductor chip placing region is smaller than a second opening angle formed by the normal and an opening line extending to an inner side of the semiconductor chip placing region.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: December 22, 2015
    Assignee: SEIKO INSTRUMENTS INC.
    Inventor: Koji Tsukagoshi
  • Publication number: 20150221783
    Abstract: A package for an optical sensor device has a double molding structure in which a first resin molded portion (1) and a second resin molded portion (2) are subjected to contact fitting. The first resin molded portion (1) has a structure in which peripheries of a die pad portion (8) on which an optical sensor element (5) is mounted and a part of leads (3a, 3b) are molded with a resin so as to be integrated. The second resin molded portion (2) has a structure in which the periphery of the first resin molded portion (1) is molded with a resin so as to form an outer shape. When a cavity is formed, a glass substrate (4) having a filter function and an upper surface of the resin molded portions are bonded to each other to form a cavity structure.
    Type: Application
    Filed: January 23, 2015
    Publication date: August 6, 2015
    Inventor: Koji TSUKAGOSHI
  • Patent number: 9029968
    Abstract: An optical sensor element is mounted in a package which includes a glass substrate having a cavity, and a glass lid substrate bonded to the other substrate to close the cavity. The glass substrate with the cavity has metalized wiring patterns on front and rear surfaces thereof, and a through hole filled with metal to form a through-electrode interconnecting the wiring patterns on the front and rear surfaces. A metalized wiring pattern on the rear surface of the glass lid substrate is electrically connected to the wiring pattern on the front surface of the other substrate with an adhesive containing conductive particles. The glass lid substrate is made either of glass having a filter function or glass having a light shielding property with an opening therethrough filled with glass having a filter function.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: May 12, 2015
    Assignee: Seiko Instruments Inc.
    Inventors: Koji Tsukagoshi, Hitoshi Kamamori, Sadao Oku, Hiroyuki Fujita, Keiichiro Hayashi
  • Publication number: 20150076715
    Abstract: Provided is a downsized semiconductor device having high reliability. A plurality of recessed portions (2) each having an inverted pyramid shape are formed in a semiconductor chip placing region (3) provided on a surface of an island portion (1) on which a semiconductor chip is to be mounted. The recessed portions (2) are arranged so that at least one side of the recessed portion (2) having an inverted pyramid shape faces in parallel to the periphery of the rectangular semiconductor chip placing region (3), which is closest thereto, and the corner of the recessed portion (2) opposite to the side faces the inner side of the semiconductor chip placing region (3).
    Type: Application
    Filed: September 15, 2014
    Publication date: March 19, 2015
    Inventor: Koji TSUKAGOSHI
  • Publication number: 20150076645
    Abstract: Phosphate-based glass doped with copper ions having infrared blocking filter characteristics is formed into particles and is mixed with a transparent encapsulating resin to encapsulate a semiconductor element. The glass particles have a particle diameter four times or more as large as a wavelength of infrared radiation to be blocked. An optical semiconductor device can be obtained having a stable filter characteristics thereof even if an incident light angle changes and is resistant to moisture.
    Type: Application
    Filed: September 15, 2014
    Publication date: March 19, 2015
    Inventors: Hiroyuki FUJITA, Sadao OKU, Koji TSUKAGOSHI, Keiichiro HAYASHI