Abstract: A remote operation device includes: a vibration detector to detect a plurality of vibration components in a plurality of directions different from each other, the vibration components being included in a vibration caused on an attachment; a transmission device; and a transmission control section that controls an operation of the transmission device. A vibration determination condition is set in advance, the vibration determination condition including a condition that an amplitude of a maximum vibration component largest in amplitude among the plurality of vibration components detected by the vibration detector is equal to or larger than a preset amplitude threshold. The transmission control section controls the operation of the transmission device to allow the vibration information to be transmitted to an operator only when the vibration determination condition is met.

Abstract: A fibrous body processing apparatus includes a humidifying unit, a first processing unit, a second processing unit, a first supply passage, a second supply passage, and a returning passage. The humidifying unit generates humidified air. The first processing unit processes a material that contains fibers. The second processing unit processes the material that was processed at the first processing unit. Humidified air is supplied from the humidifying unit to the first processing unit through the first supply passage. Humidified air is supplied from the first processing unit to the second processing unit, together with the material, through the second supply passage. The returning passage includes an upstream-side end portion and a downstream-side end portion. Humidified air is returned from the second supply passage or the second processing unit to the humidifying unit through the returning passage.

Abstract: A fibrous body processing apparatus includes a coarsely-crushed-pieces reservoir unit; a humidifying unit that generates humidified air and supplies the humidified air to the coarsely-crushed-pieces reservoir unit; a weight measurement unit that measures a weight of the coarsely crushed pieces let out of the coarsely-crushed-pieces reservoir unit; a fixed amount supplying unit that supplies a fixed amount of the coarsely crushed pieces measured by the weight measurement unit; a defibrating unit that defibrates the coarsely crushed pieces supplied from the fixed amount supplying unit; a first transportation portion through which the coarsely crushed pieces are sent from the coarsely-crushed-pieces reservoir unit to the weight measurement unit; a second transportation portion through which the coarsely crushed pieces are sent from the fixed amount supplying unit to the defibrating unit; and a generated at the humidifying unit is supplied to the defibrating unit while bypassing the weight measurement unit.

Abstract: A novel functional panel that is highly convenient, useful, or reliable is provided. The functional panel includes a base material and a pair of pixels, and the base material covers the pair of pixels and has a light-transmitting property. The pair of pixels includes one pixel and another pixel, and the one pixel includes a light-emitting device and a first microlens. The light-emitting device emits light toward the base material, and the first microlens is interposed between the base material and the light emission and converges light. The first microlens includes a first surface and a second surface; the second surface is closer to the light-emitting device than the first surface is; and the second surface has a smaller radius of curvature than the first surface. The other pixel includes a photoelectric conversion device and a second microlens. The second microlens is interposed between the base material and the photoelectric conversion and converges external light incident from the base material side.

Abstract: In this semiconductor device, a terminal having a first metal electrode portion at an upper surface is joined via a first joining material to an upper surface of a semiconductor element. The terminal and the semiconductor element are sealed by a sealing material so that an upper surface of the first metal electrode portion is exposed. The upper surface of the first metal electrode portion is connected via a second joining material to a lower surface of a second metal electrode portion formed at a lower surface of a circuit board. Slopes are provided on an upper surface of the sealing material so that vertical-direction height at the first metal electrode portion is the largest and vertical-direction height at an end of the sealing material is low.

Abstract: Provided is a surface treatment member used by being mounted on a rotary member in a surface treatment system including the rotary member. The surface treatment member includes: a base; a striking member having an annular body portion and a protruding portion that protrudes from the body portion; and a shaft member disposed in a region on an inner side of the body portion. When the surface treatment member is viewed along an imaginary axis about which the base is to be rotated, a portion of the striking member is exposed outside an outer periphery of the base by a centrifugal force when the surface treatment member is rotated, and an entirety of the striking member is retractable toward inside an imaginary circle that passes over an outermost periphery of the base about the imaginary axis after the striking member impinges on a surface treatment object.

Abstract: The present technology relates to a light detection device and an electronic apparatus capable of increasing sensitivity of a specific pixel. The light detection device includes a pixel array unit in which a plurality of pixels is regularly arranged, the plurality of pixels including a first pixel and a second pixel, the first pixel including at least a photodiode and one or more pixel transistors, the second pixel including at least a photodiode larger in size than the photodiode of the first pixel, in which the pixel transistor in the first pixel is shared by the first pixel and the second pixel. The present technology may be applied to image sensors and the like, for example.

Abstract: A semiconductor device having favorable display quality is provided. The semiconductor device is provided with a display portion, a line-of-sight sensor portion, a control portion, and an arithmetic portion. The line-of-sight sensor portion has a function of obtaining first information showing a direction of a user's line of sight. The arithmetic portion has a function of determining a first region including a gaze point of the user on the display portion with use of the first information and a function of increasing a definition of an image displayed on the first region. Light emitted from the display portion may be used to obtain the first information showing the direction of the line of sight.

Abstract: A high-resolution display apparatus having a function of sensing light is provided. A high-definition display apparatus having a function of sensing light is provided. The display apparatus includes a first light-emitting device, a second light-emitting device, a third light-emitting device, a first light-receiving device, and a second light-receiving device in a first pixel. The first light-emitting device has a function of emitting red light. The second light-emitting device has a function of emitting green light. The third light-emitting device has a function of emitting blue light. The first light-receiving device has a function of sensing light emitted from at least one of the three light-emitting devices. The second light-receiving device has a function of sensing infrared light.

Abstract: A multifunctional display apparatus with high resolution is provided. The display apparatus includes a first pixel; the first pixel includes a first light-emitting device, a second light-emitting device, and a first light-receiving device; the first light-emitting device includes a first light-emitting layer; the second light-emitting device includes a second light-emitting layer; the second light-emitting device has a function of emitting white light; the first light-emitting device has a function of emitting visible light of a color different from that of the second light-emitting device; the first light-receiving device has a function of sensing light emitted from the first light-emitting device; a side surface of the first light-emitting layer faces a side surface of the second light-emitting layer; and the distance between the side surface of the first light-emitting layer and the side surface of the second light-emitting layer is less than or equal to 8 ?m.

Abstract: A display device includes a liquid crystal element, a transistor, a scan line, and a signal line. The liquid crystal element includes a pixel electrode, a liquid crystal layer, and a common electrode. The scan line and the signal line are each electrically connected to the transistor. The scan line and the signal line each include a metal layer. The transistor is electrically connected to the pixel electrode. A semiconductor layer of the transistor includes a stack of a first metal oxide layer and a second metal oxide layer. The first metal oxide layer includes a region with lower crystallinity than the second metal oxide layer. The transistor includes a first region connected to the pixel electrode. The pixel electrode, the common electrode, and the first region are each configured to transmit visible light. Visible light passes through the first region and the liquid crystal element and exits from the display device.

Abstract: Provided is a joint structure interposed between a semiconductor element and a substrate, the joint structure including: a Sn phase; Cu alloy particles containing P in an amount of 1 mass % or more and less than 7 mass %; and Ag particles, wherein the Cu alloy particles are each coated with a Cu6Sn5 layer, wherein the Ag particles are each coated with a Ag3Sn layer, wherein the Cu alloy particles and the Ag particles are at least partially bonded to each other through a Cu10Sn3 phase, wherein a total of addition amounts of the Cu alloy particles and the Ag particles is 25 mass % or more and less than 65 mass % with respect to the joint structure, and wherein a mass ratio of the addition amount of the Ag particles to the addition amount of the Cu alloy particles is 0.2 or more and less than 1.2.

Abstract: An optimum combination of a loop unrolling number and a circuit parallel number in a high-level synthesis is determined. A circuit synthesis information generation unit sets, as parameter candidates, a plurality of combinations of a loop unrolling number and a circuit parallel number to generate circuit synthesis information indicating a synthesis circuit obtained by high-level synthesis processing for each of the combinations. An optimum parameter determination unit calculates, for each piece of the generated circuit synthesis information, an estimation processing performance related to the synthesis circuit indicated by the circuit synthesis information, and determines an optimum combination of the loop unrolling number and the circuit parallel number based on the circuit synthesis information based on which a maximum estimation processing performance is obtained.

Abstract: In a semiconductor device according to the present disclosure, one end and the other end of a plurality of insulation covering wires are joined to a connection region in an upper electrode of a DBC substrate over a semiconductor element while an insulation covering portion in a center region has contact with a surface of the semiconductor element. The plurality of insulation covering wires are provided along an X direction in the same manner as the plurality of metal wires. The plurality of insulation covering wires are provided with no loosening, thus have press force of pressing the semiconductor element in a direction of the solder joint portion.

Abstract: The present invention provides a coating composition wherein the coating composition comprises the following components (A) and (B): (A) an emulsion of a silicone acrylic copolymer resin having a glass transition temperature of 0° C. or higher and being a copolymer of 40 to 90 parts by mass of (a1) a polyorganosiloxane represented by the formula (1) with 10 to 60 parts by mass of (a2) a methacrylic acid ester monomer, provided that a total amount of components (a1) and (a2) is 100 parts by mass; the emulsion being in an amount of 5 to 80 parts by mass as a solid content, and (B) a metal oxide in an amount of 20 to 95 parts by mass, provided that a total mass of the solid content of component (A) and component (B) is 100 parts by mass.

Abstract: A differential device is provided with: a ring gear having a tooth row arranged around an axis to mesh with an input gear; an outer case combined with the ring gear and rotatable about the axis; an inner case rotatable about the axis relative to the outer case and having a toothed end with axially projecting dog teeth; a differential gear set supported by the inner case and to be coupled with a pair of axles to allow differential motion between the axles; a clutch member engaging with the outer case and disconnectably connecting with the dog teeth so as to prevent the inner case from rotating relative to the outer case; and perforations penetrating the outer case and opened on an outer face of the outer case, the perforations being so disposed as to expose the dog teeth radially outwardly from the outer case.

Abstract: Provided is a metal jointed body, joined by solid-phase joining in the atmosphere, in which no protrusion of molten joining material occurs, that improves dimensional stability. A metal jointed body is formed by (A) making Ag films of two metal laminated bodies opposed to each other, the metal jointed body being configured by sequentially laminating a Zn film and an Ag film on an Al substrate serving as a member to be joined, and (B) bringing the Ag films into contact with each other, then (C) heating is performed while pressurizing, and closely adhering and solid-phase joining the Ag films to each other. The completed metal jointed body is a portion where Al—Ag alloy layers are provided on both sides of an Ag—Zn—Al alloy layer to join the Al substrates to each other.

Abstract: A power module is obtained in which the thermal resistance in the range from a semiconductor device to a base plate is reduced and the stress in the joining portion is relieved. The power module includes at least one semiconductor device, an insulating substrate having an insulating layer, a circuit layer provided on an upper surface of the insulating layer and a metal layer provided on a lower surface of the insulating layer, and a sintering joining member with an upper surface larger in outer circumference than a back surface of the at least one semiconductor device, to join together the back surface of the at least one semiconductor device and an upper surface of the circuit layer on an upper-surface side of the insulating layer.

Abstract: A cell stack device includes a cell stack and an end current collector. The cell stack includes a plurality of cells arrayed therein. The end current collector is located in an end portion of the cell stack in an array direction of the plurality of cells. The end current collector includes a surface exposed to an oxidizing atmosphere covered with a covering material including manganese and a surface exposed to a reducing atmosphere covered with a film different from the covering material.

Abstract: A network load balancing apparatus has a data buffer for each communication path of a received packet's transfer destinations, calculates a first hash value using a field value contained in the packet, determines, based on the field value of the packet or the first hash value, a communication path of a transfer destination of the packet subject to external transfer control for transmission to a predetermined external server, determines, based on the first hash value, a communication path of a transfer destination of the packet to be subject to priority control, determines, based on a second hash value based on the first hash value, a communication path of a transfer destination of the packet to be subject to load balancing control, to match a preset load balancing situation of the data buffer, and transmits the packet to a data buffer corresponding to the communication path of the transfer destination.