Patents by Inventor Koji Yamazaki
Koji Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11451479Abstract: A network load balancing apparatus has a data buffer provided to each communication path of transfer destinations of a received packet and being associated with a virtual function, determines a destination virtual function based on a field value of the received packet, determines a communication path of a transfer destination of a packet to be subject to priority control based on a first hash value calculated using the field value, determines a communication path of a transfer destination of a packet to be subject to load balancing control, to match a preset load balancing situation of the data buffer, based on a second hash value based on the first hash value, and transmits the packet to a data buffer corresponding to the destination virtual function and the communication path of the transfer destination.Type: GrantFiled: July 5, 2019Date of Patent: September 20, 2022Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Saki Hatta, Shoko Oteru, Tomoaki Kawamura, Koji Yamazaki, Takahiro Hatano
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Patent number: 11321255Abstract: A packet processing apparatus includes a line adapter configured to receive packets from a communication line, a packet combining unit configured to generate a combined packet by combining a plurality of packets received from the communication line, a packet memory configured to store packets received from the communication line, and a combined packet transferring unit configured to DMA transfer the combined packet generated by the packet combining unit to the packet memory. The combined packet transferring unit determines an address of start data of each packet inside the combined packet on the packet memory, writes information on the address into the descriptor that is a predetermined data area on a memory, and DMA transfers the combined packet to the packet memory.Type: GrantFiled: May 13, 2019Date of Patent: May 3, 2022Assignee: Nippon Telegraph and Telephone CorporationInventors: Tomoaki Kawamura, Saki Hatta, Shoko Oteru, Koji Yamazaki, Takahiro Hatano
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Patent number: 11196684Abstract: A flow control device includes an analysis unit identifying a flow of a received packet, a plurality of queues temporarily storing packets sorted according to each flow, an allocation information storage unit storing allocation information regarding a queue allocated for each flow, a sorting unit deciding a queue to be a storage destination of the received packet and sorts the packet based on a result identified by the analysis unit and the allocation information, a saved packet holding unit saving a packet belonging to a flow determined to have no allocation information regarding the queue to be allocated by the sorting unit, and a transmission unit transmitting the packet temporarily stored in the plurality of queues and the packet saved in the saved packet holding unit to a processing unit that processes a packet.Type: GrantFiled: February 8, 2019Date of Patent: December 7, 2021Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Syuhei Yoshida, Yuta Ukon, Koji Yamazaki, Koyo Nitta
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Publication number: 20210372513Abstract: A differential device is provided with: a ring gear having a tooth row arranged around an axis to mesh with an input gear; an outer case combined with the ring gear and rotatable about the axis; an inner case rotatable about the axis relative to the outer case and having a toothed end with axially projecting dog teeth; a differential gear set supported by the inner case and to be coupled with a pair of axles to allow differential motion between the axles; a clutch member engaging with the outer case and disconnectably connecting with the dog teeth so as to prevent the inner case from rotating relative to the outer case; and perforations penetrating the outer case and opened on an outer face of the outer case, the perforations being so disposed as to expose the dog teeth radially outwardly from the outer case.Type: ApplicationFiled: August 18, 2021Publication date: December 2, 2021Inventors: Kazuhiro Ohashi, Hideki Nonaka, Koji Yamazaki
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Publication number: 20210343676Abstract: Provided is a joint structure interposed between a semiconductor element and a substrate, the joint structure including: a Sn phase; Cu alloy particles containing P in an amount of 1 mass % or more and less than 7 mass %; and Ag particles, wherein the Cu alloy particles are each coated with a Cu6Sn5 layer, wherein the Ag particles are each coated with a Ag3Sn layer, wherein the Cu alloy particles and the Ag particles are at least partially bonded to each other through a Cu10Sn3 phase, wherein a total of addition amounts of the Cu alloy particles and the Ag particles is 25 mass % or more and less than 65 mass % with respect to the joint structure, and wherein a mass ratio of the addition amount of the Ag particles to the addition amount of the Cu alloy particles is 0.2 or more and less than 1.2.Type: ApplicationFiled: November 8, 2018Publication date: November 4, 2021Applicant: Mitsubishi Electric CorporationInventors: Koji YAMAZAKI, Yoshio TAMURA
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Publication number: 20210305194Abstract: Provided is a metal joint (5) including: a Ag—Cu—Zn layer (7); and Cu—Zn layers (6) joined to both surfaces of the Ag—Cu—Zn layer (7), wherein the Ag—Cu—Zn layer (7) has a composition in which a Cu component is 1 atm % or more and 10 atm % or less, a Zn component is 1 atm % or more and 40 atm % or less, and the balance is a Ag component with respect to the total 100 atm %, and wherein the Cu—Zn layers (6) have a composition in which a Zn component is 10 atm % or more and 40 atm % or less and the balance is a Cu component with respect to the total 100 atm %. It is therefore possible to obtain the metal joint (5), which is capable of joining metal base materials to each other without being limited to aluminum-based materials, and also have high mechanical strength.Type: ApplicationFiled: September 25, 2018Publication date: September 30, 2021Applicant: Mitsubishi Electric CorporationInventors: Takashi IJIMA, Koji YAMAZAKI
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Publication number: 20210281516Abstract: A network load balancing apparatus has a data buffer provided to each communication path of transfer destinations of a received packet and being associated with a virtual function, determines a destination virtual function based on a field value of the received packet, determines a communication path of a transfer destination of a packet to be subject to priority control based on a first hash value calculated using the field value, determines a communication path of a transfer destination of a packet to be subject to load balancing control, to match a preset load balancing situation of the data buffer, based on a second hash value based on the first hash value, and transmits the packet to a data buffer corresponding to the destination virtual function and the communication path of the transfer destination.Type: ApplicationFiled: July 5, 2019Publication date: September 9, 2021Inventors: Saki Hatta, Shoko Oteru, Tomoaki Kawamura, Koji Yamazaki, Takahiro Hatano
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Publication number: 20210281517Abstract: A network load balancing apparatus has a data buffer for each communication path of a received packet's transfer destinations, calculates a first hash value using a field value contained in the packet, determines, based on the field value of the packet or the first hash value, a communication path of a transfer destination of the packet subject to external transfer control for transmission to a predetermined external server, determines, based on the first hash value, a communication path of a transfer destination of the packet to be subject to priority control, determines, based on a second hash value based on the first hash value, a communication path of a transfer destination of the packet to be subject to load balancing control, to match a preset load balancing situation of the data buffer, and transmits the packet to a data buffer corresponding to the communication path of the transfer destination.Type: ApplicationFiled: July 5, 2019Publication date: September 9, 2021Inventors: Koji Yamazaki, Saki Hatta, Shoko Oteru, Tomoaki Kawamura, Yuta Ukon, Shuhei Yoshida, Koyo Nitta
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Patent number: 11059133Abstract: A bonded structure, including a Zn-based brazing filler metal and a Cu-based bonding object bonded to each other, wherein the bonded structure includes a joint including a first alloy phase, a second alloy phase and a third alloy phase between the Zn-based brazing filler metal and the Cu-based bonding object, wherein the second alloy phase is formed at an interface between the first alloy phase and the third alloy phase, and wherein, in a cross section parallel to a bonding direction, a ratio of the second alloy phase at the interface between the first alloy phase and the third alloy phase is less than 80%.Type: GrantFiled: January 26, 2018Date of Patent: July 13, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Koji Yamazaki, Tomoaki Kato
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Patent number: 11011440Abstract: A semiconductor element bonding body including: a substrate, in which a concave portion is formed; and a semiconductor element placed in the concave portion to be mounted to the substrate. A portion of the substrate in which the concave portion is formed is made of Cu. The concave portion has a perimeter portion in which a level difference is formed, and the level difference has a height d of 20 ?m or more and less than 50 ?m. The concave portion has a bottom surface having a flatness degree of ?/8.7 ?m or more and ?/1.2 ?m or less when a wavelength ? of a laser is 632.8 nm. A metal film is formed on the semiconductor element, and the bottom surface of the concave portion and the metal film are bonded directly to each other.Type: GrantFiled: December 20, 2017Date of Patent: May 18, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Koji Yamazaki, Tomoaki Kato
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Publication number: 20210141751Abstract: A packet processing apparatus includes a line adapter configured to receive packets from a communication line, a packet combining unit configured to generate a combined packet by combining a plurality of packets received from the communication line, a packet memory configured to store packets received from the communication line, and a combined packet transferring unit configured to DMA transfer the combined packet generated by the packet combining unit to the packet memory. The combined packet transferring unit determines an address of start data of each packet inside the combined packet on the packet memory, writes information on the address into the descriptor that is a predetermined data area on a memory, and DMA transfers the combined packet to the packet memory.Type: ApplicationFiled: May 13, 2019Publication date: May 13, 2021Applicant: Nippon Telegraph and Telephone CorporationInventors: Tomoaki Kawamura, Saki Hatta, Shoko Oteru, Koji Yamazaki, Takahiro Hatano
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Publication number: 20210116882Abstract: An optimum combination of a loop unrolling number and a circuit parallel number in a high-level synthesis is determined. A circuit synthesis information generation unit sets, as parameter candidates, a plurality of combinations of a loop unrolling number and a circuit parallel number to generate circuit synthesis information indicating a synthesis circuit obtained by high-level synthesis processing for each of the combinations. An optimum parameter determination unit calculates, for each piece of the generated circuit synthesis information, an estimation processing performance related to the synthesis circuit indicated by the circuit synthesis information, and determines an optimum combination of the loop unrolling number and the circuit parallel number based on the circuit synthesis information based on which a maximum estimation processing performance is obtained.Type: ApplicationFiled: May 21, 2019Publication date: April 22, 2021Inventors: Syuhei Yoshida, Yuta Ukon, Koji Yamazaki, Koyo Nitta
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Patent number: 10950396Abstract: A switch device which is capable of ensuring mounting strength of an additional member while ensuring ease of operation. The switch device has an operating knob that transmits an input operation to a switch unit with an electric contact, and a housing that houses a switch unit. The housing that houses the switch unit has an opening via which the switch unit and the operating knob face each other. The housing has a water prevention wall installed in a standing manner to surround the opening. The operating knob has a box-shaped base member with one end thereof opened. An additional member with at least one insertion portion which is inserted into a through hole of the base member is mounted on the base member. The insertion portion extends to cross a standing direction of the water prevention wall, and as seen in the standing direction, the insertion portion and the opening are located away from each other.Type: GrantFiled: December 23, 2019Date of Patent: March 16, 2021Assignee: TOYO DENSO KABUSHIKI KAISHAInventors: Takuya Takano, Koji Yamazaki
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Publication number: 20210051117Abstract: A flow control device includes an analysis unit identifying a flow of a received packet, a plurality of queues temporarily storing packets sorted according to each flow, an allocation information storage unit storing allocation information regarding a queue allocated for each flow, a sorting unit deciding a queue to be a storage destination of the received packet and sorts the packet based on a result identified by the analysis unit and the allocation information, a saved packet holding unit saving a packet belonging to a flow determined to have no allocation information regarding the queue to be allocated by the sorting unit, and a transmission unit transmitting the packet temporarily stored in the plurality of queues and the packet saved in the saved packet holding unit to a processing unit that processes a packet.Type: ApplicationFiled: February 8, 2019Publication date: February 18, 2021Inventors: Syuhei Yoshida, Yuta Ukon, Koji Yamazaki, Koyo Nitta
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Publication number: 20210034559Abstract: A packet processing device includes: a line adapter configured to receive packets from a communication line; a packet combining unit configured to generate a combined packet by combining a plurality of packets received from the communication line; a packet memory configured to store packets received from the communication line; and a combined packet transferring unit configured to DMA transfer the combined packet generated by the packet combining unit to the packet memory. The combined packet transferring unit writes information of an address of first data of each packet inside the combined packet on the packet memory into a descriptor that is a data area on a memory set in advance.Type: ApplicationFiled: March 28, 2019Publication date: February 4, 2021Inventors: Tomoaki Kawamura, Saki Hatta, Shoko Oteru, Koji Yamazaki, Takahiro Hatano
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Patent number: 10891246Abstract: A buffer (32) for temporarily storing a packet is installed in a packet order control circuit (12H). A comparison circuit (31) compares the packet ID of an input packet with a next-selection ID indicating the packet ID of a packet to be selected next in accordance with an order. If the comparison result indicates that the packet ID and the next-selection ID do not match, a control circuit (36) stores the input packet in a storage position corresponding to the packet ID. If the packet ID and the next-selection ID match, the control circuit (36) selects the input packet as a target of a transfer process without storing the packet in the buffer (32). If the next-selection ID matches the packet ID of a packet stored in the buffer (32), the control circuit (36) selects the packet as a target of the transfer process. This guarantees the packet processing order with few memory resources.Type: GrantFiled: February 28, 2018Date of Patent: January 12, 2021Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATIONInventors: Yuta Ukon, Syuhei Yoshida, Koji Yamazaki
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Patent number: 10813203Abstract: In an X-ray generating apparatus 101 in which an X-ray tube 102 is anode-grounded to a protruding portion 107c of a container 107, electrical discharge between the X-ray tube 102 and the container 107 is reduced. The container 107 includes the protruding portion 107c in such a way that, in the axial direction Dt, a bent portion 107d is positioned between an anode-side joint portion 128 where the insulating tube 4 and the anode 103 are joined to each other and a cathode-side joint portion 122 where the insulating tube 4 and the cathode 104 are joined to each other.Type: GrantFiled: September 28, 2017Date of Patent: October 20, 2020Assignee: Canon Kabushiki KaishaInventors: Junya Kawase, Koji Yamazaki
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Publication number: 20200286700Abstract: A switch device which is capable of ensuring mounting strength of an additional member while ensuring ease of operation. The switch device has an operating knob that transmits an input operation to a switch unit with an electric contact, and a housing that houses a switch unit. The housing that houses the switch unit has an opening via which the switch unit and the operating knob face each other. The housing has a water prevention wall installed in a standing manner to surround the opening. The operating knob has a box-shaped base member with one end thereof opened. An additional member with at least one insertion portion which is inserted into a through hole of the base member is mounted on the base member. The insertion portion extends to cross a standing direction of the water prevention wall, and as seen in the standing direction, the insertion portion and the opening are located away from each other.Type: ApplicationFiled: December 23, 2019Publication date: September 10, 2020Inventors: Takuya TAKANO, Koji YAMAZAKI
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Publication number: 20200273762Abstract: A semiconductor element bonding body including: a substrate, in which a concave portion is formed; and a semiconductor element placed in the concave portion to be mounted to the substrate. A portion of the substrate in which the concave portion is formed is made of Cu. The concave portion has a perimeter portion in which a level difference is formed, and the level difference has a height d of 20 ?m or more and less than 50 ?m. The concave portion has a bottom surface having a flatness degree of ?/8.7 ?m or more and ?/1.2 ?m or less when a wavelength ? of a laser is 632.8 nm. A metal film is formed on the semiconductor element, and the bottom surface of the concave portion and the metal film are bonded directly to each other.Type: ApplicationFiled: December 20, 2017Publication date: August 27, 2020Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Koji YAMAZAKI, Tomoaki KATO
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Publication number: 20200262010Abstract: A bonded structure, including a Zn-based brazing filler metal and a Cu-based bonding object bonded to each other, wherein the bonded structure includes a joint including a first alloy phase, a second alloy phase and a third alloy phase between the Zn-based brazing filler metal and the Cu-based bonding object, wherein the second alloy phase is formed at an interface between the first alloy phase and the third alloy phase, and wherein, in a cross section parallel to a bonding direction, a ratio of the second alloy phase at the interface between the first alloy phase and the third alloy phase is less than 80%.Type: ApplicationFiled: January 26, 2018Publication date: August 20, 2020Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Koji YAMAZAKI, Tomoaki KATO