Abstract: A light-emitting apparatus and a method for manufacturing the same are provided in which heat dissipation from an LED package to a heat sinking substrate is improved while electrical insulation therebetween is ensured. The light-emitting apparatus includes a circuit board having an opening, an LED package inserted into the opening from the back side of the circuit board and having an edge connected to the back side of the circuit board, and a heat sinking substrate disposed on the back side of the circuit board so as to be in contact with the LED package.

Abstract: A light-emitting apparatus and a method for manufacturing the same are provided in which heat dissipation from an LED package to a heat sinking substrate is improved while electrical insulation therebetween is ensured. The light-emitting apparatus includes a circuit board having an opening, an LED package inserted into the opening from the back side of the circuit board and having an edge connected to the back side of the circuit board, and a heat sinking substrate disposed on the back side of the circuit board so as to be in contact with the LED package.

Abstract: A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as possible from a designed hue value, the light being a mixture of light emitted from a plurality of light-emitting elements mounted densely and excited light from a phosphor contained in a resin sealing the light-emitting elements. The light-emitting device includes a board, a plurality of light-emitting elements mounted densely on the board, a first resin free from any phosphor, placed among the plurality of light-emitting elements, and a second resin containing a phosphor and covering an exposed part of the plurality of light-emitting elements.

Abstract: A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as possible from a designed hue value, wherein the light is a mixture of light emitted from densely-mounted light-emitting elements and excited light from a phosphor contained in a resin sealing the light-emitting elements. The light-emitting device includes a board, light-emitting elements mounted densely on the board so that light-emitting surfaces thereof face opposite to the board, and a seal resin containing a plurality of different phosphors and covering all of the light-emitting elements, wherein the phosphors are excited by light from the light-emitting elements and deposited on upper surfaces of the light-emitting elements. A space between adjacent light-emitting elements has a length of 5 ?m or more and 120% or less of a median diameter D50 of a phosphor which has the largest average particle size of the phosphors.

Abstract: Provided is a light-emitting device of which a resin frame serving as a dam of a sealing resin is not readily deformed. The light-emitting device includes: a planar lead frame configured from first and second metal portions which are spaced apart from each other with an insulating resin interposed therebetween; light-emitting elements mounted on the first metal portion and electrically connected by wires to the first and second metal portions; a first resin frame disposed on the lead frame so as to enclose the light-emitting elements; a sealing resin containing a phosphor for converting the wavelength of light emitted from the light-emitting elements, the sealing resin being filled into a region on the lead frame enclosed by the first resin frame to seal the light-emitting elements; and a second resin frame being harder than the first resin frame and covering an outer surface of the first resin frame at an outer edge of the lead frame.

Abstract: Provided is a light-emitting device of which a resin frame serving as a dam of a sealing resin is not readily deformed. The light-emitting device includes: a planar lead frame configured from first and second metal portions which are spaced apart from each other with an insulating resin interposed therebetween; light-emitting elements mounted on the first metal portion and electrically connected by wires to the first and second metal portions; a first resin frame disposed on the lead frame so as to enclose the light-emitting elements; a sealing resin containing a phosphor for converting the wavelength of light emitted from the light-emitting elements, the sealing resin being filled into a region on the lead frame enclosed by the first resin frame to seal the light-emitting elements; and a second resin frame being harder than the first resin frame and covering an outer surface of the first resin frame at an outer edge of the lead frame.

Abstract: Provided is a light-emitting apparatus including a substrate, an LED light source disposed on the substrate, and a reflecting frame disposed laterally of the LED light source on the substrate, wherein the LED light source includes a side-emitting LED device which is disposed on the substrate, and which emits light laterally toward the reflecting frame, and a top-emitting LED device which is disposed above the side-emitting LED device on the substrate so as to straddle the side-emitting LED device and so as to not block a portion of the light emitted from the side-emitting LED device, and which emits light upward, the light being different in color than the light emitted from the side-emitting LED device, and wherein the reflecting frame is disposed so that the light emitted from the side-emitting LED device is reflected upward.

Abstract: A semiconductor device directly joins electrodes of a semiconductor element to electrodes of a metal substrate and has good yield, connection reliability, good mass productivity, and superior heat dissipation efficiency. A method for producing the semiconductor device that directly joins the electrodes of the metal substrate to the electrodes of the semiconductor element includes forming an electrode separating groove in an element mounting position on a main surface of the metal substrate at a predetermined depth. The semiconductor element is mounted to extend over the electrode separating groove. The metal substrate is ground from a surface reverse to the main surface of the metal substrate up to a position reaching the electrode separating groove.

Abstract: An LED package used in a light-emitting device is provided with a function of position correction in mounting by self-alignment, and mounting density of such LED packages is increased. The LED package includes an LED element including an element electrode on a bottom surface, a phosphor layer containing a phosphor and covering a top surface and a side surface of the LED element, and an auxiliary electrode having an upper face bonded to a lower face of the element electrode, wherein the auxiliary electrode is larger than the element electrode, the auxiliary electrode includes a step that makes a lower face smaller than the upper face, and an end portion of the auxiliary electrode on a side where the step is formed is located inside an outer peripheral side of the phosphor layer.

Abstract: A semiconductor device directly joins electrodes of a semiconductor element to electrodes of a metal substrate and has good yield, connection reliability, good mass productivity, and superior heat dissipation efficiency. A method for producing the semiconductor device that directly joins the electrodes of the metal substrate to the electrodes of the semiconductor element includes forming an electrode separating groove in an element mounting position on a main surface of the metal substrate at a predetermined depth. The semiconductor element is mounted to extend over the electrode separating groove. The metal substrate is ground from a surface reverse to the main surface of the metal substrate up to a position reaching the electrode separating groove.

Abstract: A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as possible from a designed hue value, wherein the light is a mixture of light emitted from densely-mounted light-emitting elements and excited light from a phosphor contained in a resin sealing the light-emitting elements. The light-emitting device includes a board, light-emitting elements mounted densely on the board so that light-emitting surfaces thereof face opposite to the board, and a seal resin containing a plurality of different phosphors and covering all of the light-emitting elements, wherein the phosphors are excited by light from the light-emitting elements and deposited on upper surfaces of the light-emitting elements. A space between adjacent light-emitting elements has a length of 5 ?m or more and 120% or less of a median diameter D50 of a phosphor which has the largest average particle size of the phosphors.

Abstract: A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as possible from a designed hue value, the light being a mixture of light emitted from a plurality of light-emitting elements mounted densely and excited light from a phosphor contained in a resin sealing the light-emitting elements. The light-emitting device includes a board, a plurality of light-emitting elements mounted densely on the board, a first resin free from any phosphor, placed among the plurality of light-emitting elements, and a second resin containing a phosphor and covering an exposed part of the plurality of light-emitting elements.

Abstract: An LED package used in a light-emitting device is provided with a function of position correction in mounting by self-alignment, and mounting density of such LED packages is increased. The LED package includes an LED element including an element electrode on a bottom surface, a phosphor layer containing a phosphor and covering a top surface and a side surface of the LED element, and an auxiliary electrode having an upper face bonded to a lower face of the element electrode, wherein the auxiliary electrode is larger than the element electrode, the auxiliary electrode includes a step that makes a lower face smaller than the upper face, and an end portion of the auxiliary electrode on a side where the step is formed is located inside an outer peripheral side of the phosphor layer.

Abstract: A light-emitting device includes a metal substrate, insulative portions, a plurality of LEDs, a support frame, and a light-transmissive encapsulation resin. The metal substrate includes electrode portions. The insulative portions separate the electrode portions from each other so that one serves as an anode and another serves as a cathode. The LEDs are positioned at a surface of the metal substrate. The LEDs each lie over a corresponding one of the insulative portions and are each electrically coupled to corresponding ones of the electrode portions. The support frame surrounds an outer perimeter of the metal substrate, and includes inner and outer wall portions. The inner wall portion is formed within a recessed groove along the outer perimeter of the metal substrate. The outer wall portion covers an outer perimeter surface of the metal substrate. The light-transmissive encapsulation resin encapsulates at least partially the LEDs.

Abstract: Provided is a light-emitting apparatus including a substrate, an LED light source disposed on the substrate, and a reflecting frame disposed laterally of the LED light source on the substrate, wherein the LED light source includes a side-emitting LED device which is disposed on the substrate, and which emits light laterally toward the reflecting frame, and a top-emitting LED device which is disposed above the side-emitting LED device on the substrate so as to straddle the side-emitting LED device and so as to not block a portion of the light emitted from the side-emitting LED device, and which emits light upward, the light being different in color than the light emitted from the side-emitting LED device, and wherein the reflecting frame is disposed so that the light emitted from the side-emitting LED device is reflected upward.

Abstract: A method for manufacturing an electronic device includes forming a resin film over a wafer, the wafer including a plurality of elements formed therein, each of the elements including a functional unit, patterning the resin film to form a plurality of frame members, each of the frame members being provided on each of the elements and surrounding the functional unit, dividing the wafer into the elements, and providing an encapsulation.

Abstract: The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.

Abstract: A method for manufacturing an electronic device includes forming a resin film over a wafer, the wafer including a plurality of elements formed therein, each of the elements including a functional unit, patterning the resin film to form a plurality of frame members, each of the frame members being provided on each of the elements and surrounding the functional unit, dividing the wafer into the elements, and providing an encapsulation.

Abstract: An electronic device capable of balancing both light transmitting and receiving performance and mounting reliability is provided. The electronic device includes an element (light receiving element), a transparent layer, and a sealing resin layer. The element is, for example, a semiconductor element and has an optically functional region having an optical function (for example, light receiving or light emission) on one face. The transparent layer is located on the optically functional region, directly comes in contact with the one face of the light receiving element, and is optically transparent. The sealing resin layer seals sides of the transparent layer and one face of the light receiving element, does not coat an upper face of the transparent layer, and is mixed with filler that improves rigidity.

Abstract: The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.