Abstract: Disclosed herein is a process for the manufacture of a fluoroelastomer composition containing fluoropolymer fibrils. The process comprises applying shear to a fluoroelastomer gum in a mixer while adding a liquid dispersion of fibrillatable fluoropolymer.

Abstract: Electrolyte compositions comprising fluorinated acyclic carboxylic acid esters, fluorinated acyclic carbonates, and/or fluorinated acyclic ethers; co-solvents; and certain film-forming chemical compounds are described. The electrolyte compositions are useful in electrochemical cells, such as lithium ion batteries where they provide the improved performance of a combination of high capacity and high cycle life.

Abstract: Electrolyte compositions comprising fluorinated acyclic carboxylic acid esters, fluorinated acyclic carbonates, and/or fluorinated acyclic ethers; co-solvents; and certain film-forming chemical compounds are described. The electrolyte compositions are useful in electrochemical cells, such as lithium ion batteries where they provide the improved performance of a combination of high capacity and high cycle life.

Abstract: Disclosed herein is a process for the manufacture of a fluoroelastomer composition containing fluoropolymer fibrils. The process comprises applying shear to a fluoroelastomer gum in a mixer while adding a liquid dispersion of fibrillatable fluoropolymer.

Abstract: The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Abstract: Disclosed is a mica paper composite and a process for making the mica paper composite. Articles comprising the mica paper composite are also disclosed.

Abstract: Disclosed is a mica paper composite and a process for making the mica paper composite. Articles comprising the mica paper composite are also disclosed.

Abstract: Cured fluoroelastomer compositions containing a phyllosilicate of the formula Mgx Si7-x O(28-2x)/2-(y/2) (OH)y, wherein x=1 to 5 and y=0 to (28-2x), said phyllosilicate having an average length of at least 50 nm in at least one dimension and an aspect ratio >3:1 are disclosed.

Abstract: Disclosed is a mica paper composite and a process for making the mica paper composite. Articles comprising the mica paper composite are also disclosed.

Abstract: Disclosed is a mica paper composite and a process for making the mica paper composite. Articles comprising the mica paper composite are also disclosed.

Abstract: The present invention discloses a multi-layer fluoropolymeric film that is useful as a light capture front sheet in solar modules, and more broadly as an antireflection layer. The present invention further discloses a glass shaped article having a multi-layer fluoropolymeric film disposed upon the surface thereof. The shaped article is useful in applications where it is desirable to reduce reflection of incident light.

Abstract: Fluoroelastomer compositions containing nanoparticles and a fluoroalkyl functionalized carbon black have a lower complex viscosity than do similar compounds absent the nanoparticles or containing carbon black that has been functionalized with a coupling agent other than a fluoroalkyl silane.

Abstract: The present invention discloses photovoltaic modules with a multi-layer fluoropolymeric film wherein the reflectance spectrum of the multi-layer fluoropolymeric film exhibits at least one minimum in the wavelength between 400 and 1100 nm. The film is useful as a light capture front sheet in solar modules, and more broadly as an antireflection layer. The invention further discloses photovoltaic arrays formed from such modules.

Abstract: A process is provided for making a reaction product comprising 1-butanol by contacting a reactant comprising ethanol containing a significant amount of water with a decomposed hydrotalcite catalyst. The catalyst may be 1) hydrotalcites which have been thermally decomposed, either partially or fully, to form catalytically active species; 2) combinations of hydrotalcites (optionally containing transition metals) and metal carbonates; and 3) hydrotalcites (optionally containing transition metals) surface-impregnated with a transition metal nitrate, where catalysts 2) and 3) have also been thermally decomposed, either partially or fully, to form catalytically active species. The catalyst, at a selected reaction time, has greater activity when the ethanol contains water as compared to when the ethanol is anhydrous.

Abstract: A process for forming at least one transistor on a substrate is described. The substrate comprises a polyimide and a nanoscopic filler. The polyimide is derived substantially or wholly from rigid rod monomers and the nanoscopic filler has an aspect ratio of at least 3:1. The substrates of the present disclosure are particularly well suited for thin film transistor applications, due at least in part to high resistance to hygroscopic expansion and relatively high levels of thermal and dimensional stability.

Abstract: An interposer film for IC packaging is disclosed. The interposer film comprises a substrate that supports a plurality of electrically conductive domains. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Abstract: The present disclosure is directed to a coverlay comprising a polyimide film and an adhesive layer. The polyimide film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Abstract: The assemblies of the present disclosure comprise an electrode, and a polyimide film. The polyimide film comprises a sub-micron filler and a polyimide. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Abstract: The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Abstract: The present disclosure is directed to a polyimide film. The film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.