Abstract: An imaging apparatus for diagnosis and a control method of an imaging apparatus for diagnosis are disclosed, which acquire line data represented by multiple luminance values in a radial direction from a rotation center position of an imaging core, which are derived by a rotation position and movement of the imaging core. Then, based on the acquired line data, an image of a two-dimensional space in which ? representing a rotation angle and z representing a position in a movement direction are set to two axes is generated and displayed.

Abstract: A warp correction apparatus includes an injection mechanism including a nozzle that performs injection treatment, an adsorption table that holds the substrate by adsorption at a principal surface side or a film surface side, a moving mechanism that moves the adsorption table so that the substrate relatively moves with respect to an injection area of an injection particle by the nozzle, an injection treatment chamber that houses the substrate held on the adsorption table and in the interior of which injection treatment is performed, a measurement mechanism that measures a warp of the substrate, and a control device that, based on a difference between a target warp amount and a warp amount measured by the measurement mechanism, performs at least either one of a setting processing of an injection treatment condition of the injection mechanism and an accept/reject determination of the substrate for which injection treatment has been performed.

Abstract: A process for producing a caking additive for coke production, the process including a step of extracting a solvent deasphalted pitch that can be used as a caking additive for coke production from a residue containing at least one of an atmospheric residue obtained by atmospheric distillation of a crude oil and a vacuum residue obtained by atmospheric distillation and vacuum distillation of a crude oil, wherein the extraction is performed using, as a solvent, a light reformate obtained by catalytic reforming a naphtha fraction that is fractionated from a crude oil by atmospheric distillation of the crude oil.

Abstract: A liquid crystal display device in which a liquid crystal layer is sandwiched between a TFT substrate having pixel electrodes and opposed electrodes formed and an opposed substrate, an external conductive film of a transparent electrode is formed on an outer surface of the opposed substrate, and an upper polarizing plate is arranged on the external conductive film. A portion of the external conductive film that is not covered with the upper polarizing plate is electrically connected to a ground potential through a conductive thermocompression bonding tape.

Abstract: A warp correction apparatus includes an injection mechanism including a nozzle that performs injection treatment, an adsorption table that holds the substrate by adsorption at a principal surface side or a film surface side, a moving mechanism that moves the adsorption table so that the substrate relatively moves with respect to an injection area of an injection particle by the nozzle, an injection treatment chamber that houses the substrate held on the adsorption table and in the interior of which injection treatment is performed, a measurement mechanism that measures a warp of the substrate, and a control device that, based on a difference between a target warp amount and a warp amount measured by the measurement mechanism, performs at least either one of a setting processing of an injection treatment condition of the injection mechanism and an accept/reject determination of the substrate for which injection treatment has been performed.

Abstract: An object of the present invention is to reliably ground an external conductive film formed on an opposed substrate to secure a stable shield effect in an IPS-type liquid crystal display device. An external conductive film formed on an opposed substrate is connected to an earth pad formed on a TFT substrate through a conductive thermocompression bonding tape. The conductive thermocompression bonding tape is connected by a thermocompression bonding head to form a conductive area. The width of the conductive area on the opposed substrate is made larger than the width of the conductive area on the TFT substrate to prevent the conductive thermocompression bonding tape from peeling off from the opposed substrate. Accordingly, the external conductive film of the opposed substrate is reliably grounded.

Abstract: The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.

Abstract: This disclosure aims to reduce workloads and material costs when a driving circuit and a flexible wiring board are fixed to a first substrate. A display device includes a display panel having the first substrate. The driving circuit is fixed to the first substrate in a portion other than a display portion with an anisotropic conductive film. The flexible wiring board is fixed to the first substrate at an end of the portion other than the display portion with an anisotropic conductive film. The anisotropic conductive film for fixing the driving circuit and the anisotropic film for fixing the flexible wiring board are the same. The anisotropic conductive film is also formed and hardened in a region other than a region having the driving circuit and the flexible wiring board fixed therein within the portion other than the display portion of the first substrate.

Abstract: A high-accuracy blood pressure value deriving method that is hardly influenced by individual differences of a person to be measured is provided. A blood pressure measuring apparatus includes a cuff member comprising a compression air bladder, a sub air bladder, and a pulse wave detection air bladder, pressure control means for pressurizing or depressurizing each air bladder, a pressure sensor which senses the internal pressure of each air bladder, pulse wave signal extracting means for extracting time-series data of a pulse wave signal superposed on a cuff internal pressure, in the process during which the pressure control means pressurizes or depressurizes each air bladder, and blood pressure value deriving means for deriving a systolic blood pressure value and/or a diastolic blood pressure value based on a change in feature amount of the pulse wave signal and a cuff internal pressure at a point of time of the change.

Abstract: A blood pressure measuring apparatus includes a cuff member (2) which can be attached to and detached from a blood pressure measurement portion, and a cuff main body (1) including a compression air bladder (8) for pressing the blood pressure measurement portion, a sub air bladder (7), and a pulse wave detection air bladder (5). After pressurization is performed by compression air bladder pressurizing/depressurizing means (22, 23) and sub air bladder pressurizing/depressurizing means (27, 26), depressurization is controlled at the same depressurization rate, thereby reducing the cuff-edge effect and obtaining a pulse wave signal.

Abstract: An object of the present invention is to reliably ground an external conductive film formed on an opposed substrate to secure a stable shield effect in an IPS-type liquid crystal display device. An external conductive film formed on an opposed substrate is connected to an earth pad formed on a TFT substrate through a conductive thermocompression bonding tape. The conductive thermocompression bonding tape is connected by a thermocompression bonding head to form a conductive area. The width of the conductive area on the opposed substrate is made larger than the width of the conductive area on the TFT substrate to prevent the conductive thermocompression bonding tape from peeling off from the opposed substrate. Accordingly, the external conductive film of the opposed substrate is reliably grounded.

Abstract: This invention provides a user with information by which the reliability of a measured blood pressure value can be determined. A blood pressure measurement device includes a cuff which presses a blood pressure measurement portion, a pressure control means for pressurizing or depressurizing the interior of the cuff, a pressure sensor which senses the internal pressure of the cuff, a pulse wave signal extracting means for extracting time-series data of a pulse wave signal superposed on the cuff internal pressure sensed by the pressure sensor, in the process in which the pressure control means pressurizes or depressurizes the cuff, and a display means for displaying a pulse waveform corresponding to a pulse wave signal of at least one period, together with the value of a cuff internal pressure corresponding to the pulse wave signal, based on the extracted pulse wave signal time-series data.

Abstract: A process for producing a caking additive for coke production, the process including a step of extracting a solvent deasphalted pitch that can be used as a caking additive for coke production from a residue containing at least one of an atmospheric residue obtained by atmospheric distillation of a crude oil and a vacuum residue obtained by atmospheric distillation and vacuum distillation of a crude oil, wherein the extraction is performed using, as a solvent, a light reformate obtained by catalytic reforming a naphtha fraction that is fractionated from a crude oil by atmospheric distillation of the crude oil.

Abstract: The present invention provides a thermosetting type die bond film that can be preferably broken by tensile force. It is a thermosetting type die bond film used for a method of obtaining a semiconductor element from a semiconductor wafer by forming a reforming region by irradiating the semiconductor wafer with a laser beam and then breaking the semiconductor wafer in the reforming region or a method of obtaining a semiconductor element from a semiconductor wafer by forming grooves that do not reach the backside of the semiconductor wafer on a surface thereof and then exposing the grooves from the backside by grinding the backside of the semiconductor wafer, wherein the elongation rate at break at 25° C. before thermal curing is larger than 40% and 500% or less.

Abstract: The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.

Abstract: The present invention provides a thermosetting adhesive film that is capable of improving the package reliability by preventing damage of a semiconductor chip due to pressure during die bonding of the film having a configuration where a filler is not substantially added, preventing a decrease of tensile storage modulus and preventing generation of warping due to heat shrinkage during thermosetting. It is a thermosetting adhesive film used at the time of manufacturing a semiconductor device, the film having a tensile storage modulus at 260° C. after thermosetting of 2×105 to 5×107 Pa, a content of a filler of 0.1% by weight or less based on the entire thermosetting adhesive film, and a thickness of 1 to 10 ?m.

Abstract: The present invention provides a film for a semiconductor device, which is capable of preventing interface delamination between each of the films, a film lifting phenomenon, and transfer of the adhesive film onto the cover film even during transportation or after long-term storage in a low temperature condition. The film for a semiconductor device of the present invention is a film in which an adhesive film and a cover film are sequentially laminated on a dicing film, in which a peel force F1 between the adhesive film and the cover film in a T type peeling test is within a range of 0.025 to 0.075 N/100 mm, a peel force F2 between the adhesive film and the dicing film is within a range of 0.08 to 10 N/100 mm, and F1 and F2 satisfy a relationship of F1<F2.

Abstract: An object of the present invention is to provide a thermosetting die-bonding film with which a die-bonding film is suitably broken with a tensile force. The object is achieved by a thermosetting die-bonding, film at least having an adhesive layer that is used to fix a semiconductor chip to an adherend, in which the breaking energy per unit area is 1 J/mm2 or less and the elongation at break is 40% or more to 500% or less at room temperature before thermal setting.

Abstract: A high-accuracy blood pressure value deriving method that is hardly influenced by individual differences of a person to be measured is provided. A blood pressure measuring apparatus includes a cuff member comprising a compression air bladder, a sub air bladder, and a pulse wave detection air bladder, pressure control means for pressurizing or depressurizing each air bladder, a pressure sensor which senses the internal pressure of each air bladder, pulse wave signal extracting means for extracting time-series data of a pulse wave signal superposed on a cuff internal pressure, in the process during which the pressure control means pressurizes or depressurizes each air bladder, and blood pressure value deriving means for deriving a systolic blood pressure value and/or a diastolic blood pressure value based on a change in feature amount of the pulse wave signal and a cuff internal pressure at a point of time of the change.

Abstract: A method of manufacturing a dicing die-bonding film having excellent adhesive properties during a dicing step and excellent peeling properties during a pickup. A method of manufacturing a dicing die-bonding film comprising a pressure-sensitive adhesive layer and an adhesive layer laminated sequentially on a base material, the method including the steps of forming the adhesive layer on a releasing film, the film containing an inorganic filler, having an arithmetic mean roughness Ra of 0.015 to 1 ?m, and having an uneven surface and bonding the pressure-sensitive adhesive layer and the adhesive layer provided on the base material under the conditions of a temperature of 30 to 50° C. and a pressure of 0.1 to 0.6 MPa and making the contact area of the pressure-sensitive adhesive layer and the adhesive layer be in the range of 35 to 90% to the bonding area.