Abstract: The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.

Abstract: A clutch outer includes a cylindrical portion with a plurality of slits defined therein which extend in an axial direction of the cylindrical portion. Engagement claws on outer peripheries of a plurality of friction plates slidably engage the slits. Each slit includes a wide portion defined on an inner periphery of the cylindrical portion and into which the engagement claws are engaged, and a narrow portion defined on an outer periphery of the cylindrical portion with a width in a circumferential direction of the cylindrical portion being smaller than that of the wide portion. The wide and narrow portions are connected through a step facing a radially inward direction of the cylindrical portion. A draft for the wide portion during die-casting is less than a draft for the narrow portion, and a die-parting face in the die-casting is established on the side of the outer periphery of the cylindrical portion.

Abstract: A designing method of a semiconductor integrated circuit is composed of providing a library storing a macro mask pattern for a macro circuit including buffer circuits, selecting one of the buffer circuits as a selected buffer circuit and arranging the macro mask pattern and a third wiring pattern to produce an integrated circuit mask. Each of buffer circuits is composed of first and second wirings apart from each other, a firs semiconductor element selectively supplying the first wiring with a power supply potential in accordance with the output signal and a second semiconductor element selectively supplying the second wiring with a grounded potential in accordance with the output signal. The macro mask pattern includes buffer mask patterns, each of which corresponds to one of the buffer circuits. Each of the buffer mask patterns is composed of a first wiring pattern for the first wiring, and a second wiring pattern for the second wiring.

Abstract: A clutch outer has a cylindrical portion, and slits defined in the cylindrical portion at a plurality of points circumferentially equally spaced apart from one another to extend in an axial direction of the cylindrical portion so that engagement claws on outer peripheries of a plurality of friction plates are slidably engaged into the slits. Each of the slits includes a wide portion which is defined on the side of an inner periphery of the cylindrical portion and into which the engagement claws are engaged, and a narrow portion defined on the side of an outer periphery of the cylindrical portion with a width in a circumferential direction of the cylindrical portion being smaller than that of the wide portion. The wide portion and the narrow portion are connected to each other through a step facing a radially inward direction of the cylindrical portion.

Abstract: In a clutch weight for a wet centrifugal clutch, a weight member 14 is formed of a sintered metal. Thus, the cost can be reduced, while stabilizing the clutch performance and enhancing the appearance.

Abstract: Disclosed is a method for making a semiconductor integrated circuit device used to form a p-channel MOS field-effect transistor and a n-channel MOS field-effect transistor on a common SOI substrate with a structure that a first silicon layer, insulating film and a second silicon layer are layered; wherein the steps from sectioning a SOI layer as the second silicon layer by insulation separation into a plurality of active regions to forming at least one gate electrode to be laid through gate insulating film on the surface of each of the plurality of active regions are conducted with no relation to the conductivity type of MOS field-effect transistor.

Abstract: A semiconductor integrated circuit so configured to stop the supplying of an electric power to a logic circuit in a standby mode, thereby to realize a low power consumption, includes a latch circuit characterized in that as the control signal a clock signal is supplied in the active mode, and a signal for creating an information hold condition is supplied in the standby mode, and in that MOSFETs applied with a control signal include a first conductivity type MOSFET having a high threshold and a second conductivity type MOSFET having a low threshold, a voltage amplitude of the control signal being larger than a power supply voltage. The semiconductor integrated circuit can be realized in that the high speed operation in the active mode and the low power consumption in the standby mode are compatible with each other, and it is sufficient if a power switch for the logic circuit is inserted at only either of the high level power supply voltage line side and the low level power supply voltage line side.

Abstract: In a clutch weight for a wet centrifugal clutch, a weight member 14 is formed of a sintered metal. Thus, the cost can be reduced, while stabilizing the clutch performance and enhancing the appearance.

Abstract: A semiconductor integrated circuit so configured to stop the supplying of an electric power to a logic circuit in a standby mode, thereby to realize a low power consumption, includes a latch circuit characterized in that as the control signal a clock signal is supplied in the active mode, and a signal for creating an information hold condition is supplied in the standby mode, and in that MOSFETs applied with a control signal include a first conductivity type MOSFET having a high threshold and a second conductivity type MOSFET having a low threshold, a voltage amplitude of the control signal being larger than a power supply voltage. The semiconductor integrated circuit can be realized in that the high speed operation in the active mode and the low power consumption in the standby mode are compatible with each other, and it is sufficient if a power switch for the logic circuit is inserted at only either of the high level power supply voltage line side and the low level power supply voltage line side.

Abstract: A designing method of a semiconductor integrated circuit is composed of providing a library storing a macro mask pattern for a macro circuit including buffer circuits, selecting one of the buffer circuits as a selected buffer circuit and arranging the macro mask pattern and a third wiring pattern to produce an integrated circuit mask. Each of buffer circuits is composed of first and second wirings apart from each other, a firs semiconductor element selectively supplying the first wiring with a power supply potential in accordance with the output signal and a second semiconductor element selectively supplying the second wiring with a grounded potential in accordance with the output signal. The macro mask pattern includes buffer mask patterns, each of which corresponds to one of the buffer circuits. Each of the buffer mask patterns is composed of a first wiring pattern for the first wiring, and a second wiring pattern for the second wiring.

Abstract: A latch type sense amplifier circuit comprises first and second latch circuits which output the same output signals when a potential difference between a bit line pair is equal to or greater than a predetermined value. The first and second latch circuits output different output signals when the potential difference between the bit line pair is less than the predetermined value. The latch type sense amplifier circuit further comprises a comparison result signal generating circuit which compares the output signals from the first and second latch circuits and outputs a signal indicative of the comparison result.

Abstract: A multivalued mask ROM is configured by arranging cell transistors in a matrix form, which is defined by wiring word lines and ground lines in rows and by wiring bit lines in columns. Each of the cell transistors is encompassed by a word line, a ground line and at least two bit lines. Herein, gates of the cell transistors which align in a same row are connected with a same word line, while sources and drains of the cell transistors are adequately connected or disconnected with the ground line and bit lines. In an integrated circuit, contacts are formed between n+ regions, first-layer metal and second-layer metal on a well region to establish connections by which the source and drain of the cell transistor are adequately connected with the ground line and/or bit lines. That is, ROM codes are formed using the contacts. A circuitry is provided for the multivalued mask ROM to read out stored information of the cell transistors in synchronization with a clock signal.

Abstract: A semiconductor integrated circuit includes a power supply circuit having a global source line VCC, a local source line QVCC coupled to VCC by a source switching transistor, and a global ground line VSS, a low-threshold logic (combinational) circuit connected between QVCC and VSS, and a data storage (sequential) circuit, connected between VCC and VSS. The data storage circuit includes a low-threshold input section for receiving data from the logic circuit and a high-threshold latch section for latching the data received by the input section. Mode switching transistors are inserted between the low-threshold logic circuit and VSS, between low-threshold input section and VCC and between the low-threshold input section and VSS, for effecting a sleep mode of the semiconductor integrated circuit. Low power dissipation is maintained with a reduced circuit scale.

Abstract: In a semiconductor integrated circuit, a control transistor 4 and a potential clamp circuit 9 are arranged between a power supply line 2 and a virtual power supply line 3. Even in a sleeve mode where the control transistor 4 is turned off, the potential clamp circuit 9-1 clamps the virtual power supply line 3 at a certain potential to hold a potential state (high level or low level) of each node of a logical circuit. At this time, each FET forming the logical circuit is applied with a back bias so that a threshold voltage Vt becomes higher than that in an active mode. Therefore, a leakage current can be decreased. In the semiconductor integrated circuit, the threshold voltage Vt of the control transistor 4 can be selected to be equal to that of one FET of the complementary FET forming the logical circuit. Therefore, the layout area and the number of manufacturing steps can be reduced.

Abstract: In a semiconductor device including a MOSFET, a first semiconductor layer is formed over a silicon substrate and has a gate region. Further, a second semiconductor layer is formed over the first semiconductor layer with a gate oxide film therebetween, and has an active region. The active region has a source region, a drain region and a channel region. An insulator layer on the active region encloses a back gate wiring layer.

Abstract: Disclosed is a method for making a semiconductor integrated circuit device used to form a p-channel MOS field-effect transistor and a n-channel MOS field-effect transistor on a common SOI substrate with a structure that a first silicon layer, insulating film and a second silicon layer are layered;wherein the steps from sectioning a SOI layer as the second silicon layer by insulation separation into a plurality of active regions to forming at least one gate electrode to be laid through gate insulating film on the surface of each of the plurality of active regions are conducted with no relation to the conductivity type of MOS field-effect transistor.

Abstract: In a semiconductor memory device, a plurality of memory cells are arranged in a matrix. Each of the plurality of memory cells is connected to one of a plurality of word lines and is connected to one of a plurality of bit lines such that a plurality of columns are formed from the plurality of memory cells. A word line selecting section selects one of the plurality of word lines based on a first address. A first column selector selects one of the plurality of columns as a first column based on the first address. A second column selector selects another one of the plurality of columns as a second column based on a second address. An address data of a predetermined portion of the first address is not equal to an address data of the second address. An input/output section includes a first sense amplifier and a first buffer.

Abstract: An inverter circuit has first and second input terminals for receiving a complementary input signals, first and second output terminals for outputting a complementary output signals generated from the complementary input signals, and a pair of rectifier sections each for flowing the charge stored on a higher-potential side of the output terminals to a lower-potential said of the output terminals, for saving power dissipation.

Abstract: A semiconductor integrated circuit is disclosed which avoids operating speed degradation resulting from an increase of the gate resistance due to making the size of the device small. In a basic cell 103 comprising a group 101 of P-channel MOS transistors and a group 102 of N-channel MOS transistors, the gate width of all the MOS transistors constituting the basic cell 103 is set below 7 .mu.m, and the gate electrodes 108a, 108b, 109a, 109b are formed to surround the perimeter of source or drain diffusion areas 106a, 106c, 107a, 107c of the MOS transistors to form an electrically closed loop.

Abstract: A semiconductor integrated circuit device with the SOI structure is provided, which decreases the chip area of wiring lines interconnecting p- and n-channel IGFETs, raising their integration level. This device is comprised of a semiconductor layer formed on an insulating substrate. The semiconductor layer has a first area extending along a first direction and a second area extending along the first direction. The first and second areas are adjacent to one another. A first IGFET of a first conductivity type is formed in the first area of the semiconductor layer. A second IGFET of a second conductivity type opposite to the first conductivity type is formed in the first area of the semiconductor layer. One of a pair of source/drain regions of the second IGFET is electrically connected to one of a pair of source/drain regions of the first IGFET by a first interconnection diffusion region. A third IGFET of the first conductivity type is formed in the second area of the semiconductor layer.