Abstract: An imaging device shoots a common subject in synchronization with other imaging devices. The imaging device includes a processor. The processor receives states of the other imaging devices, compare an own state of the imaging device with the received states of the other imaging devices, and determine whether the imaging device functions as a main device or a subordinate device for setting an imaging condition. When the processor determines that the imaging device functions as the main device, the processor sends imaging information acquired or determined by the imaging device for shooting the common subject to the subordinate devices. When the processor determines that the imaging device functions as the subordinate device, the processor sets the imaging condition in the imaging device based on the imaging information received from the main device.

Abstract: An image processing apparatus 1 includes an imaging control unit 51, a face recognition unit 52, a synthesis position analysis unit 54, and an image synthesis unit 55. The imaging control unit 51 acquires a first image and a second image. The face recognition unit 52 determines relevance between a subject of the first image and a subject of the second image. The synthesis position analysis unit 54 decides the synthesis position of the second image in the first image on the basis of the relevance between the subjects determined by the face recognition unit 52. The image synthesis unit 55 synthesizes the first image and the second image in the synthesis position decided by the synthesis position analysis unit 54.

Abstract: An object of the present invention is to provide: a rubber composition which, when it is applied to a component member (such as a tread) of a tire, exhibits good wear resistance without deteriorating rolling resistance of the tire; a cross-linked rubber composition obtained by cross-linking the rubber composition; and a tire using the rubber composition or the cross-linked rubber composition as a material thereof. Specifically, the present invention provides a rubber composition obtained by blending and kneading a rubber component and hydrated silica together, characterized in that: provided that D represents the average primary particle diameter and LP represents the log differential pore volume at a pore diameter of 30 nm, of the hydrated silica in the rubber composition, D and LP satisfy relationships represented by following formula (1) and (2). LP>?0.045×D+1.45??(1) D<30 nm??(2).

Abstract: The present invention provides a rubber composition that can offer excellent abrasion resistance when applied to a tire member such as a tread, without deteriorating rolling resistance. To solve the problem, a rubber composition according to the present invention contains a rubber component, hydrous silicate, and a surfactant, in which the hydrous silicate is modified by the surfactant before being kneaded with the rubber component.

Abstract: An image acquisition apparatus 1 includes: an image acquisition unit 43 that sequentially acquires images consecutively captured by an image capture unit 16; a face detection unit 44 that detects a predetermined subject in the acquired image each time an image is acquired; and an image acquisition stop unit 46 that stops the acquisition of target images for composition when the predetermined subject is detected.

Abstract: An image capture apparatus includes a second communication control unit, a first communication control unit and a communication unit. The second communication control unit controls the communication unit so as to transmit information of a face image serving as identification information to identify a specific subject to one other image capture apparatus. The first communication control unit controls the communication unit so as to receive from the other image capture apparatus, from among images captured by the image capture unit included in each image capture apparatus, an image in which a subject designated by the transmitted face image is captured.

Abstract: An object of the present invention is to provide: a rubber composition which, when it is applied to a component member (such as a tread) of a tire, exhibits good wear resistance without deteriorating rolling resistance of the tire; a cross-linked rubber composition obtained by cross-linking the rubber composition; and a tire using the rubber composition or the cross-linked rubber composition as a material thereof. Specifically, the present invention provides a rubber composition obtained by blending and kneading a rubber component and hydrated silica together, characterized in that: provided that D represents the average primary particle diameter and LP represents the log differential pore volume at a pore diameter of 30 nm, of the hydrated silica in the rubber composition, D and LP satisfy relationships represented by following formulae (1) and (2). LP>?0.045×D+1.

Abstract: A circuit device according to one exemplary embodiment includes a ceramic substrate, a first conductive pattern provided on one face of the ceramic substrate, a second conductive pattern, formed mainly of Cu, which is provided on the other face of the ceramic substrate, and a semiconductor element provided on an island that constitutes the second conductive pattern. An electrode, whose outermost surface is formed mainly of Cu, is provided in the semiconductor element, and the interface between the island and the electrode is directly fixed by solid-phase bonding.

Abstract: A battery cell module includes a plurality of battery cells arranged to each other, bus bars used to connect external terminals of the plurality of battery cells, and separators provided between adjacent battery cells. Each battery cell includes an electrode body, a casing that houses the electrode body, and external terminals, provided external to the casing, which are electrically connected to the electrode body. The separator includes a heat transfer section that performs heat transfer between the heat section and the battery cell and an insulator that electrically insulates between the heat transfer section and the battery cell. The heat transfer section has a thermal conductivity higher than that of the insulator.

Abstract: A method for fabricating a semiconductor module includes: bonding a semiconductor substrate onto a first insulating resin layer; dicing the semiconductor substrate into a plurality of individual semiconductor devices; widening the spacings between the adjacent semiconductor devices by expanding the first insulating resin layer in a biaxially stretched manner; fixing the plurality of semiconductor devices to a flat sheet, with a second insulating resin layer held between the plurality of semiconductor devices and the flat sheet, and removing the first insulating resin layer; stacking the plurality of semiconductor devices, a third insulating resin layer, and a metallic plate, in this order, so as to form a laminated body having electrodes by which to electrically connect the device electrodes to the metallic plate; forming a wiring layer by selectively removing the metallic plate and forming a plurality of semiconductor modules; and separating the semiconductor modules into individual units.

Abstract: Methods for producing a substrate for mounting a device and for producing a semiconductor module are provided. The methods comprise preparing a metal plate on one major surface of which a plurality of projected electrodes are provided. An insulating resin layer is formed on the major surface so as to cover the top surface of the projected electrodes. The top surface of at least one of the plurality of projected electrodes is exposed by removing the insulating resin layer so that a major surface of the insulating resin layer opposite to the metal plate is level. A plurality of counter electrodes is arranged having a counterface to face the top face of the plurality of projected electrodes or a semiconductor device having a plurality of device electrodes is arranged to face the top face of the plurality of projected electrodes.

Abstract: A method for fabricating a semiconductor module includes: bonding a semiconductor substrate onto a first insulating resin layer; dicing the semiconductor substrate into a plurality of individual semiconductor devices; widening the spacings between the adjacent semiconductor devices by expanding the first insulating resin layer in a biaxially stretched manner; fixing the plurality of semiconductor devices to a flat sheet, with a second insulating resin layer held between the plurality of semiconductor devices and the flat sheet, and removing the first insulating resin layer; stacking the plurality of semiconductor devices, a third insulating resin layer, and a metallic plate, in this order, so as to form a laminated body having electrodes by which to electrically connect the device electrodes to the metallic plate; forming a wiring layer by selectively removing the metallic plate and forming a plurality of semiconductor modules; and separating the semiconductor modules into individual units.

Abstract: A device mounting board includes: an insulating resin layer; a wiring layer formed on one of the principal surfaces of the insulating resin layer; a protection layer covering the insulating resin layer and the wiring layer; a protruding electrode electrically connected to the wiring layer, the protruding electrode protruding from the wiring layer toward the insulating resin layer and penetrating through the insulating resin layer; a wiring-layer-side convex portion protruding from the wiring layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer; and a resin-layer-side convex portion protruding from the protection layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer.

Abstract: A semiconductor module includes a device mounting board and a semiconductor device mounted on the device mounting board. The device mounting board includes an insulating resin layer, a wiring layer provided on one main surface of the insulating resin layer, and bump electrodes, electrically connected to the wiring layer, which are protruded from the wiring layer toward the insulating resin layer. The semiconductor device has device electrodes which are disposed counter to a semiconductor substrate and the bump electrodes, respectively. The surface of a metallic layer provided on the device electrode lies on the same plane as the surface of a protective layer.

Abstract: The present invention provides a method of joining a metal that can join coppers at a relatively low temperature by a simple technique while maintaining connection reliability. The space between a first coating portion (14) (a copper oxide) coating a first base portion (12) (copper) and a second coating portion (24) (a copper oxide) coating a second base portion (22) (copper) is filled with a solution (30) in which the copper oxide of the first coating portion (14) and the copper oxide of the second coating portion (24) are to be eluted. As a result, the copper oxides forming the first coating portion (14) and the second coating portion (24) are eluted in the solution (30). To increase the pressure of the solution (30), pressure is applied to a first to-be-joined portion (10) and a second to-be-joined portion (20) with a pressing machine. During the pressure application, heating is performed at a relatively low temperature of 200 to 300° C.

Abstract: A device mounting board includes an insulating layer formed of an insulating resin, a glass cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the glass cloth is larger than that of the resin. Thus, solder bumps are formed on the electrode 14 of the device mounting board 10 with high precision.

Abstract: A device mounting board includes an insulating resin layer, a wiring layer provided on one of main surfaces of the insulating resin layer, and bump electrodes connected electrically to the wiring layer and protruding on a side of the insulating resin layer from the wiring layer. A semiconductor module is formed by having the bump electrodes connected to a semiconductor device. A recess is provided in the top face of each bump electrode. The recess communicates with an opening provided on a side surface of the bump electrode.

Abstract: A substrate for mounting a device comprises: an insulating resin layer; a plurality of projected electrodes that are connected electrically to a wiring layer provided on one major surface of the insulating resin layer, and that project toward the insulating resin layer from the wiring layer; and a counter electrode provided at a position corresponding to each of the plurality of projected electrodes on the other major surface of the insulating resin layer. Among the projected electrodes, a projected length of part of the projected electrodes is smaller than that of the other projected electrodes; and the projected electrode and the counter electrode corresponding thereto are capacitively-coupled, and the projected electrode and the counter electrode are connected electrically.

Abstract: A semiconductor module includes a device mounting board and a semiconductor device mounted on the device mounting board. The device mounting board includes an insulating resin layer, a wiring layer provided on one main surface of the insulating resin layer, and bump electrodes, electrically connected to the wiring layer, which are protruded from the wiring layer toward the insulating resin layer. The semiconductor device has device electrodes which are disposed counter to a semiconductor substrate and the bump electrodes, respectively. The surface of a metallic layer provided on the device electrode lies on the same plane as the surface of a protective layer.

Abstract: A substrate for mounting a device comprises: an insulating resin layer; a plurality of projected electrodes that are connected electrically to a wiring layer provided on one major surface of the insulating resin layer, and that project toward the insulating resin layer from the wiring layer; and a counter electrode provided at a position corresponding to each of the plurality of projected electrodes on the other major surface of the insulating resin layer. Among the projected electrodes, a projected length of part of the projected electrodes is smaller than that of the other projected electrodes; and the projected electrode and the counter electrode corresponding thereto are capacitively-coupled, and the projected electrode and the counter electrode are connected electrically.