Abstract: Even if the process for permitting execution of software is enabled in accordance with first license information, upon transmitting an invalidation signal from the invalidation signal transmitter 116, the execution of the process for permitting execution of software is limited in accordance with second license information. Thus, the invalidation signal can limit the execution of the process for permitting execution of software in accordance with specific license information and the execution of the licensed software without fail.

Abstract: Printed circuit board (PCB) design support apparatus and method are provided. The target element disposed on a front surface of the printed circuit board is mirror-copied, and then the straight line distance between the mirror copied element and a back element disposed on the back surface of the PCB is calculated under the condition that the thickness of the PCB is zero. The resultant creepage distance between the target element and the back element is obtained by adding the thickness of the PCB to the straight line distance. The creepage distance can be obtained accurately and quickly by a calculation on a straight line distance.

Abstract: This invention relates a thermosetting resin composition which is produced by curing a composition containing a thermosetting resin and a reactive mono-olefin polymer, and its phase structure is sea-island structure which comprises a continuous phase mainly composed of a cured composition containing a thermosetting resin and, if necessary, further curing agent and dispersed phases mainly composed of a reactive mono-olefin polymer and said dispersed phases contain a plurality of finer dispersed phases and/or at least one layer of interfacial phases surrounding said dispersed phases, thereby providing a thermosetting resin composition that is suitable for use in sealing or encapsulating semiconductor devices, which composition has improved impact strength, resistance to thermal cracking, resistance to deterioration by oxidation, without losing thermal stability.

Abstract: The purpose of the present invention provides a thermosetting resin composition suitable for use in sealing or encapsulating semiconductor devices, which resin composition is improved in impact strength, resistance in thermal cracking test, resistance to deterioration caused by heat or by oxidation, without lowering thermal stability represented by HDT, wherein the composition containing a thermosetting resin, an epoxy group-containing liquid polybutene and, if necessary, a curing agent, and said epoxy group-containing liquid polybutene has epoxy structures substantially at the terminal ends of molecules and 80 molar % or more of repeating units in the main chain structure has a specific structure. Furthermore, the cured thermosetting resin composition has a phase structure, in which dispersed phases of several &mgr;m in diameter and being mainly composed of epoxy group-containing liquid polybutene, are dispersed in a continuous phase that is mainly composed of said thermosetting resin.

Abstract: A boron trifluoride complex can be recovered without changing its molar coordination ratio, by applying a direct and/or alternating voltage to an electrically-nonconductive fluid in which at least a part of boron trifluoride complex is dispersed and/or dissolved, and separating the boron trifluoride complex by settling from the electrically-nonconductive fluid. By utilizing this method for the preparation of olefin oligomer using a boron trifluoride complex catalyst, it is possible to reuse the recovered catalyst as it stands for the reaction.

Abstract: A method and an apparatus for continuously extracting a wax component contained in a solid residue with a solvent, in which method, the solid residue obtained from the juice of sugar cane is used as a raw material. To make the extraction time uniform and to obtain the wax at a high efficiency of extraction, the solid residue and an organic solvent for extraction are mixed under shear force and agitated in directions perpendicular to the flow direction. The mixing is conducted under an agitated flow condition so as to form a substantially plug flow in the flow direction.

Abstract: A fuel assembly is composed of first fuel rods containing nuclear fuel material and burnable poison material and second fuel rods containing nuclear fuel material but no burnable poison material. The fuel assembly is charged in a high conversion area of a boiling water type nuclear reactor having a reactor core having the high conversion area and a burner area surrounding the high conversion area. A ratio V.sub.C /V.sub.F is not greater than 1.5 in the fuel assembly where V.sub.C is the volume occupied by coolant flow paths and V.sub.F is the volume occupied by the nuclear fuel material per unit length in an axial direction of the fuel assembly. In addition, the burnable poison material is composed of neutron absorption nuclides having at least one resonant energy in a neutron energy region of one electron volt or less.