Abstract: A heat sink board having a first heat sink and a second heat sink with a smaller linear expansion coefficient than that of the first heat sink and being bonded to the first heat sink to form the heat sink board. The second heat sink is fitted to the first heat sink, and a material of the first heat sink in the vicinity of a boundary between the fitted heat sinks is plastically deformed for close adhesion to the second heat sink. A forming method makes bonding between the first and second heat sinks possible at room temperature, and the heat sink board made of a composite member having a high flat-surface accuracy can be easily and reliably obtained.

Abstract: A liquid discharge head including a discharge element substrate including an orifice plate having a discharge port for discharging a liquid, and a supply port opened in the reverse side of the surface forming the discharge port for supplying a liquid into the discharge port; a support member having a supply path for supplying a liquid into the supply port; and a flexible wiring substrate having a blanking portion for transmitting a signal for discharging a liquid to the discharge element substrate. The discharge element substrate is electrically connected to the flexible wiring substrate on the surface opening the supply port, the flexible wiring substrate is bonded to both the discharge element substrate and the support member by means of an adhesive, the end face of the blanking portion is covered with the adhesive, the covered blanking portion communicates with the supply port, and the adhesive is a thermally fusible adhesive composed of denatured polyolefin, having a softening point of 80° C. or higher.

Abstract: A method comprising constraining a circumference of a blank of a Cu—Mo alloy and one of surfaces to be worked with the use of a die, and using a working punch or a counter punch to apply working pressures to the other of the surfaces to be worked, thereby obtaining a cup-shaped body.

Abstract: The invention provides a heat sink board and a manufacturing method thereof, which can realize a high product accuracy and superior productivity. To that end, a second heat sink (3) having a smaller linear expansion coefficient than that of a first heat sink (2) is bonded to the first heat sink (2) to form a heat sink board. The second heat sink (3) is fitted to the first heat sink (2), and a material of the first heat sink (2) in the vicinity of a boundary between the fitted heat sinks is plastically deformed for close adhesion to the second heat sink (3). Such a forming method makes bonding between the first and second heat sinks possible at room temperature, and the heat sink board made of a composite member having a high flat-surface accuracy can be easily and reliably obtained.

Abstract: A method comprising constraining a circumference of a blank of a Cu—Mo alloy and one of surfaces to be worked with the use of a die, and using a working punch or a counter punch to apply working pressures to the other of the surfaces to be worked, thereby obtaining a cup-shaped body.

Abstract: A liquid discharge head comprising: a discharge element substrate including an orifice plate having a discharge port for discharging a liquid, and a supply port opened in the reverse side of the surface forming the discharge port for supplying a liquid into the discharge port; a support member having a supply path for supplying a liquid into the supply port; and a flexible wiring substrate having a blanking portion for transmitting a signal for discharging a liquid to the discharge element substrate. The discharge element substrate is electrically connected to the flexible wiring substrate on the surface opening the supply port, the flexible wiring substrate is bonded to both the discharge element substrate and the support member by means of an adhesive, and the end face of the blanking portion is covered with the adhesive, the covered blanking portion communicates with the supply port, and the adhesive is a thermally fusible adhesive composed of denatured polyolefin, having a softening point of 80° C.

Abstract: An object of the present invention is to provide an electric motor unit with a controller of a machinery and electricity integration type for eliminating variations due to mechanical factors and obtaining excellent operation reliability. A magnet member is attached to a gear on the side of a gear case, and a sensor for sensing the magnet member and detecting a rotational angle of the gear in a controller case, and a cylindrical opening concentric with the rotational center of the gear is installed on the gear case, and a cylindrical part fitting into the cylindrical opening is installed on the controller case, and the controller case is positioned and mounted on the gear case by the fitting between the cylindrical part and the cylindrical opening.

Abstract: An object of the present invention is to provide a rotor with a high accuracy, a manufacturing method of the rotor and the motor for an electrically driven power steering in a manner that the accuracy of a shaft itself is not degraded, then a core is not applied with excessive deformation, and the shaft and the core are joined while maintaining the accuracy of each of these parts. A rotor is configured by a rotor core which is formed by laminating a plurality of silicon steel plates and has a through hole at the center thereof, and a shaft which is pressed into the through hole of the rotor core. The rotor core is locally annealed only at a portion near the surface of the through hole.

Abstract: The disclosure is concerned with a bonding method for bonding metallic members, which comprises the steps of: fitting a metallic members to another metallic member, followed by effecting preliminarily plastic bonding by means of a preliminarily bonding punch; and generating compression force in an axial direction of the members in the vicinity of the fitting portion of the bonding members after the preliminarily plastic bonding, and allowing part of the material of the bonding member to effect plastic-flow in such a manner as to fill a gap defined between the metallic members, so as to plastically bond the members; whereby the members are tightly integrated with each other.

Abstract: In order to realize a method of forming a rotor core that improves the productivity and enhances the product accuracy, a forming method of a rotor that is equipped with both permanent-magnet fastener on the inner perimetric end of the magnetic pole claw of the rotor core and tapered surface on the outer perimetric end on one end of the magnetic pole claw in the circumferential direction. By constraining the inner perimetric surface of the magnetic pole claw by a die and applying a forming pressure in the radial direction, the tapered surface on the outer perimetric end of the magnetic pole claw and permanent-magnet fastener on the inner perimetric end can be formed at the same time and a rotor core with high product accuracy and mass-productivity is realized.

Abstract: A method comprising constraining a circumference of a blank of a Cu—Mo alloy and one of surfaces to be worked with the use of a die, and using a working punch or a counter punch to apply working pressures to the other of the surfaces to be worked, thereby obtaining a cup-shaped body.

Abstract: The disclosure is concerned with a bonding method for bonding metallic members, which comprises the steps of: fitting a metallic members to another metallic member, followed by effecting preliminarily plastic bonding by means of a preliminarily bonding punch; and generating compression force in an axial direction of the members in the vicinity of the fitting portion of the bonding members after the preliminarily plastic bonding, and allowing part of the material of the bonding member to effect plastic-flow in such a manner as to fill a gap defined between the metallic members, so as to plastically bond the members; whereby the members are tightly integrated with each other.

Abstract: A outer circumferential part of a body to be coupled having an annular groove formed 31 in the outer periphery of a shaft 1 is press-fitted into the inner circumferential part of a coupling hole in the central portion of a hub 2, the vicinity of the hole in the end of the hub is plastic-deformed over the whole periphery, and material for the hub is caused to plastic-flow so as to bury a recess of the shaft, and to apply compression stress to the shaft, whereby a coupling force between a thin hub and a small diameter shaft is obtained by shearing force and compressing force of the material for the hub.

Abstract: In a method of removing a coating from an edge of a substrate a solvent reservoir is filled with a solvent to dissolve and remove a photoresist film, the solvent includes one of dipropylene glycol monoalkyl ether, a mixture of this ether and an easily volatile organic solvent (boiling point of 75-130.degree. C., vapor pressure of 5-75 mmHg at 20.degree. C.), and an alkaline aqueous solution, an edge of a substrate W is horizontally inserted in the reservoir, and thereafter, the edge of the substrate W is immersed in the solvent for a period of time, so as to dissolve and remove a coating such as photoresist from the edge of the substrate. The solvent may be filled into the solvent reservoir either before or after the edge of the substrate is inserted therein, and the method may further involve aspirating the solvent from the reservoir after the substrate edge has been inserted therein.

Abstract: A photopolymerizable composition composed principally of an acrylic linear copolymer, an ethylenically-unsaturated compound and a photoinitiator and adapted to fabricate printed circuit boards. The ethylenically-unsaturated compound contains a specific acrylic ester. The photopolymerizable composition can be developed with an aqueous mild alkaline solution.

Abstract: A seal structure in which a hole (5) is defined by a metal base member (4) as a partition member for partitioning the regions on the opposite sides thereof to a gas tight or liquid tight state and a member passes through the hole (5) and extends therefrom. The member passing through the hole (5) may be an electric conductor (2), a pipe member for flowing gas or liquid, a heat pipe for flowing a heat medium, an optical fiber for transferring an optical signal, or the like, and the structure is arranged such that the member passing through the hole is disposed through a synthetic resin seal member (3) and the hole (5) is sealed based on the confinement effected by the plastic deforming action of the base member (4) and the deforming action of the seal member (3) effected by making use of the elastic plasticity thereof, whereby the structure exhibits an excellent pressure resistive performance and can effectively seal the hole (5).

Abstract: The invention proposes an improved method for the pre-treatment of a photoresist layer formed on a substrate surface prior to pattern-wise exposure of the photoresist layer to actinic rays, in which extraneous portions of the resist layer formed by overspreading of the photoresist solution as in the marginal zone of the patterning area and on the peripheral and back surfaces of the substrate, by dissolving away with a cleaning solution. In contrast to the conventional cleaning solutions consisting entirely or mainly of an organic solvent capable of dissolving the photoresist composition, the cleaning solution used in the inventive method is an aqueous alkaline solution containing a water-soluble alkaline compound dissolved in an aqueous medium consisting of water and a limited amount of a water-miscible organic solvent such as monohydric alcohols, alkyleneglycol monoalkyl ethers and aprotic solvents. The cleaning solution may optionally contain an anti-corrosion agent.

Abstract: This invention provides a substrate processing system including a cassette station on which at least one cassette containing a plurality of objects is placed, a process station including a plurality of process chambers for performing processing for the objects, and an object conveying unit for loading the objects into the process chambers and unloading the objects from the process chambers, a first object transfer unit for transferring the objects between the cassette station and the process station, and an interface section including an object waiting region where the objects wait, and a second object transfer unit for transferring the objects to the process station, wherein the process chambers in the process station are arranged around the object conveying unit, and the object conveying unit has a rotating shaft almost parallel to the vertical direction and can move up and down in the vertical direction along the rotating shaft and rotate about the rotating shaft.

Abstract: An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.

Abstract: A heat-treating method of heating and cooling a substrate comprising the steps of carrying the wafer into a heat-treating section by a main arm and mounting the wafer on a heating stage, heating the wafer mounted on the heating stage, lifting the wafer thus heated from the heating stage, approaching a cooling holder to the wafer thus lifted to cool the wafer above the heating stage, and carrying the cooled wafer from above the heating stage.