Patents by Inventor Kouji Oda

Kouji Oda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electric resistance welding method with unequal force application
    Patent number: 5977505
    Abstract: When a workpiece which is made up by laminating a plurality of plates of different thicknesses is welded by using a spot welding gun having a pair of electrode tips, the electrode force to the workpiece by one of the electrode tips, which is positioned on the side of a thinner plate, is made larger that the electrode force to the workpiece by the other of the electrode tips. The contact pressure on the side of the thinner plate becomes larger with the result that the contact resistance decreases. Therefore, the nugget on the side of the thinner plate becomes smaller than the nugget on the side of the thicker plate.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: November 2, 1999
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Nobuo Kobayashi, Isao Bundou, Toshihiro Murakawa, Kouji Oda, Toshiaki Nagasawa
  • Semiconductor device including a two-layer protective insulating layer
    Patent number: 5880518
    Abstract: A protective insulating film in a semiconductor device is formed in a multi-layer structure. A lower layer portion is constituted by an organic-silane-based silicon oxide film formed by a P-CVD process using organic silane and oxygen to improve step coverage. An upper layer portion is constituted by a silane-based silicon oxide film containing excess silicon in an amount greater than that in the stoichiometric composition and formed by a P-CVD process to improve moisture resistance.
    Type: Grant
    Filed: March 28, 1997
    Date of Patent: March 9, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kouji Oda, Seiji Ohkura