Patents by Inventor Kouji Sato

Kouji Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240337293
    Abstract: A flexible boot for a constant velocity universal joint includes: attachment portions to a mating member at both ends; and a bent portion provided between the attachment portions and absorbing deformation caused by operation of a constant velocity universal joint. The flexible boot is made of a rubber material obtained by blending 50 to 80 parts by weight of HNBR having an acrylonitrile content of 15 to 21 wt % and 20 to 50 parts by weight of EPDM, the rubber material having an elastic recovery rate of 18% or more at ?40° C. in a TR test.
    Type: Application
    Filed: April 27, 2022
    Publication date: October 10, 2024
    Inventors: Mika KOHARA, Sho TAKESHITA, Hiroshi MURAKAMI, Shuichi SATO, Rina OZAWA, Kouji MASUJIMA
  • Publication number: 20240318627
    Abstract: A wind turbine includes: a collector base; a tunnel body; and a wind turbine. The collector base has an entire circumference at which a wind inflow part is formed. The tunnel body includes a lower front member that is vertically installed on the collector base, that has a substantially rectangular cross-sectional shape, and whose cross-sectional area is reduced linearly or curvilinearly from a wind inlet formed on the collector base side, and an upper member that linearly or curvilinearly expands from a position of the reduced cross-sectional area to the wind outlet at an upper end. The wind turbine is installed at a reduced part of the tunnel body such that an interval between long side parts of the tunnel body is minimum, and a ratio of short side parts and the long side parts of the tunnel body is 1 to 10 times.
    Type: Application
    Filed: March 31, 2022
    Publication date: September 26, 2024
    Inventors: Souichirou ASAI, Kunimitsu SATO, Norio SEITOKU, Yasutaka YOSHIBA, Kouji YAMADA
  • Publication number: 20240280075
    Abstract: A wind-speed accelerating wind turbine has the wind turbine installed in the nacelle, the nacelle has a front nacelle member having a cross-section area formed so as to linearly or curvilinearly contract from a wind inlet to an installed position of the wind turbine and has a rear nacelle member having the contracted cross-section area formed so as to linearly or curvilinearly expand or maintain the same cross-section area from the installed position of the wind turbine to a wind outlet, and a wind dispersion part or a wind dispersion shape is provided at the wind outlet of the rear nacelle member.
    Type: Application
    Filed: March 28, 2022
    Publication date: August 22, 2024
    Inventors: Souichirou ASAI, Kunimitsu SATO, Norio SEITOKU, Yasutaka YOSHIBA, Kouji YAMADA
  • Patent number: 12042823
    Abstract: An article sorting facility includes: a first floor including a plurality of first travel paths; a second floor installed at a different height from the first floor in a vertical direction, and including a plurality of second travel paths; a plurality of first elevation mechanisms connecting terminating ends of the first travel paths to starting ends of the second travel paths; a plurality of second elevation mechanisms connecting terminating ends of the second travel paths to starting ends of the first travel paths; a plurality of receiving sections configured to receive articles from the transport vehicles; and at least one supply section configured to supply the articles to the transport vehicles. The plurality of second travel paths overlap corresponding first travel paths or corresponding receiving sections as viewed in the vertical direction, at least in a partial segment.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: July 23, 2024
    Assignee: Daifuku Co., Ltd.
    Inventors: Yasuhisa Mishina, Tadasuke Ogawa, Kouji Fujita, Kenichi Ukisu, Nobuhiko Sato, Masaya Miyamoto
  • Publication number: 20180037680
    Abstract: The invention provides an acrylic resin-based transparent substrate having an alignment layer spread thereon, wherein the photo-alignment layer and the substrate are kept tightly bonded to each other. The invention also provides a layered body having an acrylic resin-containing transparent substrate and, as formed on one surface of the transparent substrate by spreading and bonding thereto, a photo-alignment layer containing photo-responsive molecules capable of responding to light. According to the invention, there can be provided an acrylic resin-based transparent substrate having on the surface thereof, a photo-alignment layer having excellent adhesion force and containing photo-responsive molecules capable of responding to light.
    Type: Application
    Filed: September 29, 2015
    Publication date: February 8, 2018
    Applicant: DIC Corporation
    Inventors: Yoshitaka Saito, Kazuki Obi, Hiroyuki Itou, Kouji Sato, Hiroshi Hasebe, Masanao Takashima, Fumiaki Kodera
  • Publication number: 20160041703
    Abstract: A character string selecting apparatus is provided with a menu display unit for setting a plurality of menu display areas, displaying, in a first column of the menu display area, selection target character strings extracted at intervals from selection target character strings provided with a display order, and displaying, in an i-th column, selection target character strings extracted at intervals smaller than intervals of extraction in an i-1-th column; a slide operation processing unit for scrolling display of selection target character strings of a j-th column in response to slide operation in the j-th column and display of the selection target character strings of the other columns in conjunction with each other based on amounts of scrolling according to the intervals of extraction; and a character string selection unit for specifying a selection target character string selected in one of the columns as an input character string.
    Type: Application
    Filed: August 3, 2015
    Publication date: February 11, 2016
    Inventors: Tatsuo Kakuta, Masahiro Nishibori, Kouji Sato
  • Patent number: 9159663
    Abstract: A semiconductor device comprises a substrate, pluralities of first and second external electrodes formed in two end portions of one surface of the substrate, a first semiconductor chip mounted on the other surface of the substrate, the first semiconductor chip having an electrode pad row formed in one end portion of one surface of the first semiconductor chip and electrically connected to the first external electrodes, the first semiconductor chip being disposed so that the one end portion of the first semiconductor chip is positioned on an end portion on which the first external electrodes of the substrate are formed, and a second semiconductor chip mounted on the first semiconductor chip, the second semiconductor chip having an electrode pad row formed in one end portion of one surface of the second semiconductor chip and electrically connected to the second external electrode, the second semiconductor chip being disposed so that the one end portion of the second semiconductor chip is positioned on an end p
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: October 13, 2015
    Assignee: PS4 Luxco S.a.r.l.
    Inventors: Satoshi Isa, Hiromasa Takeda, Kouji Sato
  • Publication number: 20140252613
    Abstract: The present invention reduces the occurrence of fracture in external terminal connecting sections and improves the reliability of secondary packaging of a semiconductor device. Specifically, the present invention provides a semiconductor device including a wiring board, a semiconductor chip mounted on one surface of the wiring board via a bonding member, and external electrodes formed on the other surface of the wiring board and electrically connected to the semiconductor chip. In the semiconductor device, a peripheral end of the bonding member is arranged in a position where the peripheral end does not overlap the external electrodes.
    Type: Application
    Filed: May 16, 2014
    Publication date: September 11, 2014
    Inventors: Yoshinori IWAMOTO, Kouji SATO, Yutaka NAKAJIMA, Ken HAYAKAWA
  • Publication number: 20120086111
    Abstract: The present invention reduces the occurrence of fracture in external terminal connecting sections and improves the reliability of secondary packaging of a semiconductor device. Specifically, the present invention provides a semiconductor device including a wiring board, a semiconductor chip mounted on one surface of the wiring board via a bonding member, and external electrodes formed on the other surface of the wiring board and electrically connected to the semiconductor chip. In the semiconductor device, a peripheral end of the bonding member is arranged in a position where the peripheral end does not overlap the external electrodes.
    Type: Application
    Filed: December 22, 2010
    Publication date: April 12, 2012
    Inventors: Yoshinori IWAMOTO, Kouji Sato, Yutaka Nakajima, Ken Hayakawa
  • Patent number: 8146924
    Abstract: A low-compression force metal gasket includes a coating layer containing a polymer material on at least a sealing surface of the gasket, and the coating layer satisfies the following conditions (1) to (3): (1) the layer comprises a resin, a rubber or a mixture thereof having an oxygen gas permeability coefficient at 25° C. of 10×10?12 to 0.1×10?12 (m2/s); (2) when the layer is compression deformed, the storage elastic modulus (E?) at 200° C. is in the range of 1.0×107 to 1.0×102 Pa; and (3) the coating layer has a thickness of 1 to 40 ?m. The gasket provides a high seal at a low clamping force.
    Type: Grant
    Filed: June 11, 2008
    Date of Patent: April 3, 2012
    Assignees: Tohoku University, Nippon Valqua Industries, Ltd.
    Inventors: Tadahiro Ohmi, Yasuyuki Shirai, Yasushi Aburatani, Akira Muramatsu, Masayuki Noguchi, Kouji Sato, Satoshi Kumaki
  • Publication number: 20110291295
    Abstract: A semiconductor device comprises a substrate, pluralities of first and second external electrodes formed in two end portions of one surface of the substrate, a first semiconductor chip mounted on the other surface of the substrate, the first semiconductor chip having an electrode pad row formed in one end portion of one surface of the first semiconductor chip and electrically connected to the first external electrodes, the first semiconductor chip being disposed so that the one end portion of the first semiconductor chip is positioned on an end portion on which the first external electrodes of the substrate are formed, and a second semiconductor chip mounted on the first semiconductor chip, the second semiconductor chip having an electrode pad row formed in one end portion of one surface of the second semiconductor chip and electrically connected to the second external electrode, the second semiconductor chip being disposed so that the one end portion of the second semiconductor chip is positioned on an end p
    Type: Application
    Filed: May 23, 2011
    Publication date: December 1, 2011
    Inventors: Satoshi ISA, Hiromasa Takeda, Kouji Sato
  • Patent number: 7808086
    Abstract: The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: October 5, 2010
    Assignees: NEC Electronics Corporation, Hitachi Cable Precision Co., Ltd.
    Inventors: Akimi Saiki, Hiroyuki Shoji, Gousuke Takahashi, Noriyuki Hasegawa, Fumio Takano, Kouji Sato
  • Publication number: 20080309028
    Abstract: A low-compression force metal gasket includes a coating layer containing a polymer material on at least a sealing surface of the gasket, and the coating layer satisfies the following conditions (1) to (3): (1) the layer comprises a resin, a rubber or a mixture thereof having an oxygen gas permeability coefficient at 25° C. of 10×10?12 to 0.1×10?12 (m2/s); (2) when the layer is compression deformed, the storage elastic modulus (E?) at 200° C. is in the range of 1.0×107 to 1.0×102 Pa; and (3) the coating layer has a thickness of 1 to 40 ?m. The gasket provides a high seal at a low clamping force.
    Type: Application
    Filed: June 11, 2008
    Publication date: December 18, 2008
    Applicants: Tohoku University, Nippon Valqua Industries, Ltd.
    Inventors: Tadahiro Ohmi, Yasuyuki Shirai, Yasushi Aburatani, Akira Muramatsu, Masayuki Noguchi, Kouji Sato, Satoshi Kumaki
  • Publication number: 20080296746
    Abstract: The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.
    Type: Application
    Filed: May 29, 2008
    Publication date: December 4, 2008
    Applicants: NEC ELECTRONICS CORPORATION, HITACHI CABLE PRECISION CO., LTD.
    Inventors: Akimi SAIKI, Hiroyuki SHOJI, Gousuke TAKAHASHI, Noriyuki HASEGAWA, Fumio TAKANO, Kouji SATO
  • Publication number: 20080022000
    Abstract: A communication network includes a plurality of user networks that accommodates IP terminals and does not perform a call control function, a core network (a call control network) that is located among the user networks and performs a call control function and a call management function, and a gateway that connects the user networks to the core network. The gateway receives a communication request packet from the user network or a data packet that is initially transmitted, and analyzes the packet. Thus, the gateway establishes a necessary call in the core network to allow an IP packet to pass through the core network.
    Type: Application
    Filed: November 11, 2004
    Publication date: January 24, 2008
    Inventors: Shinji Furuya, Tetsuya Yokotani, Kouji Sato, Kazuyuki Kashima
  • Patent number: 7217560
    Abstract: Treatment of a lactic acid ester derivative with an enzyme or the like, which has asymmetric ester-hydrolyzing ability, can specifically hydrolyze the ester moiety of an isomer existing as the pair to the racemic derivative.
    Type: Grant
    Filed: March 6, 2002
    Date of Patent: May 15, 2007
    Assignee: Daiichi Pharmaceutical Co., Ltd.
    Inventors: Kouji Sato, Tsutomu Yagi, Kazuo Kubota, Akihiro Imura
  • Patent number: 7189847
    Abstract: Processes for producing antibacterial agents and intermediates useful in producing antibacterial agents are provided and include producing compound (VI-a) in accordance with the following reaction schema, as well as production intermediates thereof
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: March 13, 2007
    Assignee: Daiichi Pharmaceutical Co., Ltd.
    Inventors: Kouji Sato, Yoshihiro Takayanagi, Katsuhiko Okano, Keiji Nakayama, Akihiro Imura, Mikihiro Itoh, Tsutomu Yagi, Yukinari Kobayashi, Tomoyuki Nagai
  • Patent number: 7126003
    Abstract: A process for producing a compound represented by the following formula (II) which comprises treating a compound represented by the following formula (I) (wherein R1, R2 and R3 represent each a specific substituent) with an enzyme capable of asymmetrically hydrolyzing an ester and the novel compound (II).
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: October 24, 2006
    Assignee: Daiichi Pharmaceutical Co., Ltd.
    Inventors: Kouji Sato, Tsutomu Yagi, Yutaka Kitagawa, Shigeru Ichikawa, Akihiro Imura
  • Patent number: 7087778
    Abstract: Processes for producing antibacterial agents and intermediates useful in producing antibacterial agents are provided and include producing compound (VI-a) in accordance with the following reaction schema, as well as production intermediates thereof
    Type: Grant
    Filed: August 23, 2004
    Date of Patent: August 8, 2006
    Assignee: Daiichi Pharmaceutical Co., Ltd.
    Inventors: Kouji Sato, Yoshihiro Takayanagi, Katsuhiko Okano, Keiji Nakayama, Akihiro Imura, Mikihiro Itoh, Tsutomu Yagi, Yukinari Kobayashi, Tomoyuki Nagai
  • Publication number: 20060110296
    Abstract: The invention relates to an automatic separator/extractor and a method of controlling same, with the object, particularly in all manner of fields such as medical science, agricultural science, scientific fields, or pharmaceuticals, of being able to achieve at high speed and accuracy, extraction or separation of precipitate or supernatant at a high quality, accuracy and reliability, above that which can be achieved by manual means.
    Type: Application
    Filed: January 4, 2006
    Publication date: May 25, 2006
    Applicant: Precision Systems Science Co., Ltd.
    Inventors: Hideji Tajima, Norihisa Sagawa, Toyosaku Sato, Masataka Morita, Hiroshi Hayasaka, Kouji Sato, Kahoru Takahashi