Patents by Inventor Kouji Sato
Kouji Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240337293Abstract: A flexible boot for a constant velocity universal joint includes: attachment portions to a mating member at both ends; and a bent portion provided between the attachment portions and absorbing deformation caused by operation of a constant velocity universal joint. The flexible boot is made of a rubber material obtained by blending 50 to 80 parts by weight of HNBR having an acrylonitrile content of 15 to 21 wt % and 20 to 50 parts by weight of EPDM, the rubber material having an elastic recovery rate of 18% or more at ?40° C. in a TR test.Type: ApplicationFiled: April 27, 2022Publication date: October 10, 2024Inventors: Mika KOHARA, Sho TAKESHITA, Hiroshi MURAKAMI, Shuichi SATO, Rina OZAWA, Kouji MASUJIMA
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Publication number: 20240318627Abstract: A wind turbine includes: a collector base; a tunnel body; and a wind turbine. The collector base has an entire circumference at which a wind inflow part is formed. The tunnel body includes a lower front member that is vertically installed on the collector base, that has a substantially rectangular cross-sectional shape, and whose cross-sectional area is reduced linearly or curvilinearly from a wind inlet formed on the collector base side, and an upper member that linearly or curvilinearly expands from a position of the reduced cross-sectional area to the wind outlet at an upper end. The wind turbine is installed at a reduced part of the tunnel body such that an interval between long side parts of the tunnel body is minimum, and a ratio of short side parts and the long side parts of the tunnel body is 1 to 10 times.Type: ApplicationFiled: March 31, 2022Publication date: September 26, 2024Inventors: Souichirou ASAI, Kunimitsu SATO, Norio SEITOKU, Yasutaka YOSHIBA, Kouji YAMADA
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Publication number: 20240280075Abstract: A wind-speed accelerating wind turbine has the wind turbine installed in the nacelle, the nacelle has a front nacelle member having a cross-section area formed so as to linearly or curvilinearly contract from a wind inlet to an installed position of the wind turbine and has a rear nacelle member having the contracted cross-section area formed so as to linearly or curvilinearly expand or maintain the same cross-section area from the installed position of the wind turbine to a wind outlet, and a wind dispersion part or a wind dispersion shape is provided at the wind outlet of the rear nacelle member.Type: ApplicationFiled: March 28, 2022Publication date: August 22, 2024Inventors: Souichirou ASAI, Kunimitsu SATO, Norio SEITOKU, Yasutaka YOSHIBA, Kouji YAMADA
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Patent number: 12042823Abstract: An article sorting facility includes: a first floor including a plurality of first travel paths; a second floor installed at a different height from the first floor in a vertical direction, and including a plurality of second travel paths; a plurality of first elevation mechanisms connecting terminating ends of the first travel paths to starting ends of the second travel paths; a plurality of second elevation mechanisms connecting terminating ends of the second travel paths to starting ends of the first travel paths; a plurality of receiving sections configured to receive articles from the transport vehicles; and at least one supply section configured to supply the articles to the transport vehicles. The plurality of second travel paths overlap corresponding first travel paths or corresponding receiving sections as viewed in the vertical direction, at least in a partial segment.Type: GrantFiled: January 30, 2023Date of Patent: July 23, 2024Assignee: Daifuku Co., Ltd.Inventors: Yasuhisa Mishina, Tadasuke Ogawa, Kouji Fujita, Kenichi Ukisu, Nobuhiko Sato, Masaya Miyamoto
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Publication number: 20180037680Abstract: The invention provides an acrylic resin-based transparent substrate having an alignment layer spread thereon, wherein the photo-alignment layer and the substrate are kept tightly bonded to each other. The invention also provides a layered body having an acrylic resin-containing transparent substrate and, as formed on one surface of the transparent substrate by spreading and bonding thereto, a photo-alignment layer containing photo-responsive molecules capable of responding to light. According to the invention, there can be provided an acrylic resin-based transparent substrate having on the surface thereof, a photo-alignment layer having excellent adhesion force and containing photo-responsive molecules capable of responding to light.Type: ApplicationFiled: September 29, 2015Publication date: February 8, 2018Applicant: DIC CorporationInventors: Yoshitaka Saito, Kazuki Obi, Hiroyuki Itou, Kouji Sato, Hiroshi Hasebe, Masanao Takashima, Fumiaki Kodera
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Publication number: 20160041703Abstract: A character string selecting apparatus is provided with a menu display unit for setting a plurality of menu display areas, displaying, in a first column of the menu display area, selection target character strings extracted at intervals from selection target character strings provided with a display order, and displaying, in an i-th column, selection target character strings extracted at intervals smaller than intervals of extraction in an i-1-th column; a slide operation processing unit for scrolling display of selection target character strings of a j-th column in response to slide operation in the j-th column and display of the selection target character strings of the other columns in conjunction with each other based on amounts of scrolling according to the intervals of extraction; and a character string selection unit for specifying a selection target character string selected in one of the columns as an input character string.Type: ApplicationFiled: August 3, 2015Publication date: February 11, 2016Inventors: Tatsuo Kakuta, Masahiro Nishibori, Kouji Sato
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Patent number: 9159663Abstract: A semiconductor device comprises a substrate, pluralities of first and second external electrodes formed in two end portions of one surface of the substrate, a first semiconductor chip mounted on the other surface of the substrate, the first semiconductor chip having an electrode pad row formed in one end portion of one surface of the first semiconductor chip and electrically connected to the first external electrodes, the first semiconductor chip being disposed so that the one end portion of the first semiconductor chip is positioned on an end portion on which the first external electrodes of the substrate are formed, and a second semiconductor chip mounted on the first semiconductor chip, the second semiconductor chip having an electrode pad row formed in one end portion of one surface of the second semiconductor chip and electrically connected to the second external electrode, the second semiconductor chip being disposed so that the one end portion of the second semiconductor chip is positioned on an end pType: GrantFiled: May 23, 2011Date of Patent: October 13, 2015Assignee: PS4 Luxco S.a.r.l.Inventors: Satoshi Isa, Hiromasa Takeda, Kouji Sato
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Publication number: 20140252613Abstract: The present invention reduces the occurrence of fracture in external terminal connecting sections and improves the reliability of secondary packaging of a semiconductor device. Specifically, the present invention provides a semiconductor device including a wiring board, a semiconductor chip mounted on one surface of the wiring board via a bonding member, and external electrodes formed on the other surface of the wiring board and electrically connected to the semiconductor chip. In the semiconductor device, a peripheral end of the bonding member is arranged in a position where the peripheral end does not overlap the external electrodes.Type: ApplicationFiled: May 16, 2014Publication date: September 11, 2014Inventors: Yoshinori IWAMOTO, Kouji SATO, Yutaka NAKAJIMA, Ken HAYAKAWA
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Publication number: 20120086111Abstract: The present invention reduces the occurrence of fracture in external terminal connecting sections and improves the reliability of secondary packaging of a semiconductor device. Specifically, the present invention provides a semiconductor device including a wiring board, a semiconductor chip mounted on one surface of the wiring board via a bonding member, and external electrodes formed on the other surface of the wiring board and electrically connected to the semiconductor chip. In the semiconductor device, a peripheral end of the bonding member is arranged in a position where the peripheral end does not overlap the external electrodes.Type: ApplicationFiled: December 22, 2010Publication date: April 12, 2012Inventors: Yoshinori IWAMOTO, Kouji Sato, Yutaka Nakajima, Ken Hayakawa
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Patent number: 8146924Abstract: A low-compression force metal gasket includes a coating layer containing a polymer material on at least a sealing surface of the gasket, and the coating layer satisfies the following conditions (1) to (3): (1) the layer comprises a resin, a rubber or a mixture thereof having an oxygen gas permeability coefficient at 25° C. of 10×10?12 to 0.1×10?12 (m2/s); (2) when the layer is compression deformed, the storage elastic modulus (E?) at 200° C. is in the range of 1.0×107 to 1.0×102 Pa; and (3) the coating layer has a thickness of 1 to 40 ?m. The gasket provides a high seal at a low clamping force.Type: GrantFiled: June 11, 2008Date of Patent: April 3, 2012Assignees: Tohoku University, Nippon Valqua Industries, Ltd.Inventors: Tadahiro Ohmi, Yasuyuki Shirai, Yasushi Aburatani, Akira Muramatsu, Masayuki Noguchi, Kouji Sato, Satoshi Kumaki
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Publication number: 20110291295Abstract: A semiconductor device comprises a substrate, pluralities of first and second external electrodes formed in two end portions of one surface of the substrate, a first semiconductor chip mounted on the other surface of the substrate, the first semiconductor chip having an electrode pad row formed in one end portion of one surface of the first semiconductor chip and electrically connected to the first external electrodes, the first semiconductor chip being disposed so that the one end portion of the first semiconductor chip is positioned on an end portion on which the first external electrodes of the substrate are formed, and a second semiconductor chip mounted on the first semiconductor chip, the second semiconductor chip having an electrode pad row formed in one end portion of one surface of the second semiconductor chip and electrically connected to the second external electrode, the second semiconductor chip being disposed so that the one end portion of the second semiconductor chip is positioned on an end pType: ApplicationFiled: May 23, 2011Publication date: December 1, 2011Inventors: Satoshi ISA, Hiromasa Takeda, Kouji Sato
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Patent number: 7808086Abstract: The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.Type: GrantFiled: May 29, 2008Date of Patent: October 5, 2010Assignees: NEC Electronics Corporation, Hitachi Cable Precision Co., Ltd.Inventors: Akimi Saiki, Hiroyuki Shoji, Gousuke Takahashi, Noriyuki Hasegawa, Fumio Takano, Kouji Sato
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Publication number: 20080309028Abstract: A low-compression force metal gasket includes a coating layer containing a polymer material on at least a sealing surface of the gasket, and the coating layer satisfies the following conditions (1) to (3): (1) the layer comprises a resin, a rubber or a mixture thereof having an oxygen gas permeability coefficient at 25° C. of 10×10?12 to 0.1×10?12 (m2/s); (2) when the layer is compression deformed, the storage elastic modulus (E?) at 200° C. is in the range of 1.0×107 to 1.0×102 Pa; and (3) the coating layer has a thickness of 1 to 40 ?m. The gasket provides a high seal at a low clamping force.Type: ApplicationFiled: June 11, 2008Publication date: December 18, 2008Applicants: Tohoku University, Nippon Valqua Industries, Ltd.Inventors: Tadahiro Ohmi, Yasuyuki Shirai, Yasushi Aburatani, Akira Muramatsu, Masayuki Noguchi, Kouji Sato, Satoshi Kumaki
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Publication number: 20080296746Abstract: The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.Type: ApplicationFiled: May 29, 2008Publication date: December 4, 2008Applicants: NEC ELECTRONICS CORPORATION, HITACHI CABLE PRECISION CO., LTD.Inventors: Akimi SAIKI, Hiroyuki SHOJI, Gousuke TAKAHASHI, Noriyuki HASEGAWA, Fumio TAKANO, Kouji SATO
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Publication number: 20080022000Abstract: A communication network includes a plurality of user networks that accommodates IP terminals and does not perform a call control function, a core network (a call control network) that is located among the user networks and performs a call control function and a call management function, and a gateway that connects the user networks to the core network. The gateway receives a communication request packet from the user network or a data packet that is initially transmitted, and analyzes the packet. Thus, the gateway establishes a necessary call in the core network to allow an IP packet to pass through the core network.Type: ApplicationFiled: November 11, 2004Publication date: January 24, 2008Inventors: Shinji Furuya, Tetsuya Yokotani, Kouji Sato, Kazuyuki Kashima
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Patent number: 7217560Abstract: Treatment of a lactic acid ester derivative with an enzyme or the like, which has asymmetric ester-hydrolyzing ability, can specifically hydrolyze the ester moiety of an isomer existing as the pair to the racemic derivative.Type: GrantFiled: March 6, 2002Date of Patent: May 15, 2007Assignee: Daiichi Pharmaceutical Co., Ltd.Inventors: Kouji Sato, Tsutomu Yagi, Kazuo Kubota, Akihiro Imura
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Patent number: 7189847Abstract: Processes for producing antibacterial agents and intermediates useful in producing antibacterial agents are provided and include producing compound (VI-a) in accordance with the following reaction schema, as well as production intermediates thereofType: GrantFiled: September 14, 2005Date of Patent: March 13, 2007Assignee: Daiichi Pharmaceutical Co., Ltd.Inventors: Kouji Sato, Yoshihiro Takayanagi, Katsuhiko Okano, Keiji Nakayama, Akihiro Imura, Mikihiro Itoh, Tsutomu Yagi, Yukinari Kobayashi, Tomoyuki Nagai
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Patent number: 7126003Abstract: A process for producing a compound represented by the following formula (II) which comprises treating a compound represented by the following formula (I) (wherein R1, R2 and R3 represent each a specific substituent) with an enzyme capable of asymmetrically hydrolyzing an ester and the novel compound (II).Type: GrantFiled: March 4, 2002Date of Patent: October 24, 2006Assignee: Daiichi Pharmaceutical Co., Ltd.Inventors: Kouji Sato, Tsutomu Yagi, Yutaka Kitagawa, Shigeru Ichikawa, Akihiro Imura
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Patent number: 7087778Abstract: Processes for producing antibacterial agents and intermediates useful in producing antibacterial agents are provided and include producing compound (VI-a) in accordance with the following reaction schema, as well as production intermediates thereofType: GrantFiled: August 23, 2004Date of Patent: August 8, 2006Assignee: Daiichi Pharmaceutical Co., Ltd.Inventors: Kouji Sato, Yoshihiro Takayanagi, Katsuhiko Okano, Keiji Nakayama, Akihiro Imura, Mikihiro Itoh, Tsutomu Yagi, Yukinari Kobayashi, Tomoyuki Nagai
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Publication number: 20060110296Abstract: The invention relates to an automatic separator/extractor and a method of controlling same, with the object, particularly in all manner of fields such as medical science, agricultural science, scientific fields, or pharmaceuticals, of being able to achieve at high speed and accuracy, extraction or separation of precipitate or supernatant at a high quality, accuracy and reliability, above that which can be achieved by manual means.Type: ApplicationFiled: January 4, 2006Publication date: May 25, 2006Applicant: Precision Systems Science Co., Ltd.Inventors: Hideji Tajima, Norihisa Sagawa, Toyosaku Sato, Masataka Morita, Hiroshi Hayasaka, Kouji Sato, Kahoru Takahashi