Abstract: A first aspect of the present invention is carbon fiber wherein the surface of a monofilament has a center line average roughness Ra of 6.0 nm or more and 13 nm or less, and the monofilament has a long diameter/short diameter ratio of 1.11 or more and 1.245 or less. A second aspect of the present invention is carbon fiber precursor acrylic fiber wherein the surface of a monofilament has a center line average roughness Ra of 18 nm or more and 27 nm or less, and the monofilament has a long diameter/short diameter ratio of 1.11 or more and 1.245 or less. The carbon fiber according to the first aspect is obtained by stabilizing and carbonizing under specific conditions the carbon fiber precursor acrylic fiber according to the second aspect.

Abstract: An optical wiring substrate includes an insulation layer including a resin, a first conductor layer formed on the insulation layer and including a metal, the first conductor layer including an inclined surface that is inclined relative to an optical axis of an optical fiber. The insulation layer further includes an end surface that faces a cladding of the optical fiber. The inclined surface of the first conductor layer is formed at a position that faces a core of the optical fiber.

Abstract: A photoelectric conversion module includes: a photoelectric conversion element and an IC chip mounted on a mounting surface of a substrate; and an electrode provided on a side surface of the substrate, electrically connected to the IC chip, and having a concave shape sunk deeper than other portions of the side surface of the substrate.

Abstract: A photoelectric composite wiring module includes a flexible first substrate including a conductive line and an optical fiber mounted thereon along a longitudinal direction thereof, a second substrate including a recessed portion formed thereon to receive the conductive line and the optical fiber that protrude from an end portion of the first substrate, and an optical device mounted on the second substrate and optically coupled to the optical fiber. The recessed portion includes an opening on a mounting surface side of the second substrate to mount the optical device.

Abstract: An optoelectrical composite cable includes an optical fiber; a resin inner cylinder that accommodates the optical fiber; a plurality of electrical lines arranged outside the inner cylinder so as to cover a surrounding of the inner cylinder, and a tubular outer cylinder that collectively covers the plurality of electrical lines. The plurality of electrical lines include pairs of electrical lines, and the electrical lines constitute at least one of the pairs of electrical lines have a larger outer diameter than the other electrical lines and are arranged at opposing positions, with the inner cylinder being interposed therebetween.

Abstract: A ferrule fixing member includes a fixing member configured to fix a ferrule to hold an optical fiber to a retaining member including a retaining hole to insert the ferrule, a locked portion configured to be locked to a locking portion formed on the retaining member and to be restricted from moving, with respect to the retaining member, in an insertion direction of the ferrule and in a direction orthogonal to the insertion direction, and a main body configured to elastically press the ferrule toward the bottom of the retaining hole by elastic deformation thereof.

Abstract: An optical wiring substrate includes an insulation layer including a resin, a first conductor layer formed on the insulation layer and including a metal, the first conductor layer including an inclined surface that is inclined relative to an optical axis of an optical fiber. The insulation layer further includes an end surface that faces a cladding of the optical fiber. The inclined surface of the first conductor layer is formed at a position that faces a core of the optical fiber.

Abstract: A photoelectric conversion module includes a circuit board including a plurality of first board-side electrodes and a plurality of second board-side electrodes that are alternately arranged on a mounting surface of the circuit board in an array direction and each extend into strips in a direction orthogonal to the array direction, a photoelectric conversion array element mounted on the circuit board and including, on a surface facing the mounting surface, a plurality of light receiving/emitting portions, first element-side electrodes connected to the first board-side electrodes and second element-side electrodes connected to the second board-side electrodes, and an IC chip mounted on the circuit board. The circuit board further includes, on the mounting surface, a connecting portion for connecting the first board-side electrodes to each other and a first electrode land portion connected to the first board-side electrode or the connecting portion to contact with a first test electrode probe.

Abstract: An optical wiring substrate includes an insulation layer including a resin, and a conductor layer formed on the insulation layer and including a metal and an inclined surface inclined relative to an optical axis of an optical fiber. A first wiring pattern and a second wiring pattern are formed in the conductor layer, the first wiring pattern including a first connecting part to which a first electrode of a photoelectric conversion element is connected, and the second wiring pattern including a second connecting part to which a second electrode of the photoelectric conversion element is connected. A distance between the first wiring pattern and the second wiring pattern is narrowest between the first connecting part and the second connecting part. A distance between the first connecting part and the second connecting part is less than a dimension of the conductor layer in a thickness direction thereof.

Abstract: An optical wiring substrate includes an insulation layer including a resin, an conductor layer formed on the insulation layer and including a metal, and an optical fiber accommodating part configured to accommodate an end part of an optical fiber. The conductor layer further includes a reflecting surface configured to be inclined relative to the insulation layer so as to reflect a light that propagates through the optical fiber. The optical fiber accommodating part includes at one end part thereof an abutting surface configured such that a tip of optical fiber inserted is abutted thereon.

Abstract: A connector supporting structure includes a substrate, a connector mounted on the substrate, and a casing covering at least a portion of the substrate and supporting the connector. The casing includes an opening to expose a part of the connector from an inside of the casing to an outside. Side surfaces of the connector are pressed by inner surfaces of the opening.

Abstract: An optical board including a substrate including a plate-shaped resin including a first main plane and a second main plane facing each other, and a slit-shaped optical fiber receiving portion which penetrates between the first main plane and the second main plane in a thickness direction, a metal layer provided on the second main plane, and a wiring pattern consisting of metal and provided on the first main plane. An inclined plane is provided at an end of the optical fiber receiving portion in the substrate, a tilt angle of the inclined plane with respect to the first main plane is an obtuse angle, and a reflective layer is provided on the inclined plane for reflecting a light output from an optical fiber received in the optical fiber receiving portion toward the first main plane.

Abstract: An optical module includes a circuit board, an optical element on the circuit board, a semiconductor circuit element thereon and electrically coupled with the optical element, an optical connection member formed on a back surface of the circuit board and including an optical fiber receiving groove, and a pressing plate disposed on a side opposite to the circuit board of the optical connection member so as to fix the optical fiber. The semiconductor circuit element is mounted nearer a tip side of the circuit board in relation to the optical element such that the circuit board, the optical connection member and a tip part of the optical fiber are sandwiched between the semiconductor circuit element and the pressing plate. The circuit board includes a plurality of electrodes to be electrically coupled with an equipment side circuit board formed on a tip part of a back surface of the circuit board.

Abstract: A ferrule fixing member for fixing a ferrule to a holding member with a holding hole into which the ferrule is inserted. The ferrule fixing member includes a first plate part and a second plate part configured to face each other while sandwiching an resilient member arranged on an outer periphery of the ferrule in a radial direction thereof, a pressing part configured to press the resilient member such that the ferrule is pressed against a bottom side of the holding hole by a resilient force of the resilient member, a locked part configured to be engaged with a locking part formed in the holding member, and an extending part configured to extend from the second plate part to the locked part. The locking of the locked part and the locking part is released by moving the first plate part and the second plate part close to each other.

Abstract: An optical module includes a circuit board including a mount surface and a non-mount surface opposite the mount surface, a photoelectric conversion element mounted on the mount surface of the circuit board, an optical coupling member for holding an optical fiber and optically coupling the optical fiber and the photoelectric conversion element, a semiconductor circuit element mounted on the mount surface of the circuit board, and electrically connected to the photoelectric conversion element, a plate-shaped supporting member arranged so as to sandwich the optical coupling member between the supporting member and the circuit board, and an electrically conductive body supported by the supporting member, extended in a thickness direction of the supporting member, and connected at one end to an electrode provided on the non-mount surface of the circuit board.

Abstract: A photoelectric conversion device includes an optical fiber, a molded portion covering an end portion and an end face of the optical fiber, the molded portion including a transparent resin transparent to light inputted and outputted through the optical fiber and a light input/output surface perpendicular to an optical axis of the optical fiber, electric wirings oppositely formed on the light input/output surface of the molded portion so as to sandwich a light input/output portion through which the light inputted and outputted through the optical fiber passes, and an optical device mounted on the electric wirings so as to stride over the light input/output portion. The optical device includes a surface light-emitting element or a surface light-receiving element optically coupled to the optical fiber through the molded portion.

Abstract: An optical module includes a substrate including a conductor pattern formed thereon, a photoelectric conversion element mounted on the substrate, and an optical coupling member for optically coupling the photoelectric conversion element to an optical fiber. A part of the conductor pattern on the substrate defines an engagement portion that engages with the optical coupling member so as to position the optical coupling member relative to the substrate.

Abstract: An optical module includes a substrate, an optical device including a surface-emitting or -receiving element mounted on a surface of the substrate with a light-emitting or -receiving portion, an optical fiber disposed parallel to the surface of the substrate and in a longitudinal direction of the substrate, a damming member provided between the optical device and the substrate to extend in a width direction of the substrate and dividing a gap between the optical device and the substrate in the longitudinal direction of the substrate into a first portion and a second portion, and a mirror provided at one side surface of the damming member a tip of the optical fiber. The first portion provided on an opposite side to the optical fiber is filled with an underfill resin, and the second portion provided on a side close to the optical fiber is filled with an optical fiber fixing resin.

Abstract: An optical module includes a circuit board having flexibility, a photoelectric conversion element mounted on a mounting surface of the circuit board, a semiconductor circuit element mounted on the mounting surface of the circuit board and electrically connected to the photoelectric conversion element, a plate-shaped optical connection member having a groove into which an end part of an optical fiber is pushed so as to be housed and optically connecting the optical fiber and the photoelectric conversion element, and a supporting member arranged so as to sandwich the optical connection member between the circuit board. The groove is formed between the semiconductor circuit element and the supporting member so as to have an opening into which the optical fiber is pushed at the supporting member side. The semiconductor circuit element has a height from the mounting surface of the circuit board higher than the photoelectric conversion element.

Abstract: An optical board a substrate includes a plate-shaped resin including a first main plane and a second main plane, and an optical fiber receiving portion to receive an optical fiber, a first metal layer provided on the first main plane, and a second metal layer provided on the second main plane. The optical fiber receiving portion has a cavity structure, which penetrates in a thickness direction of the substrate between the first main plane and the second main plane, and the optical fiber is prevented from slipping out of the first main plane and the second main plane.