Abstract: A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of the substrate; a cover member fixed to the substrate via a solder layer constituted by solder and forming, cooperatively with the substrate, an airtight chamber housing the photoelectric conversion element; and a solder adsorbing film provided near an area fixed to the substrate by the solder layer, in a surface, of the cover member, facing the mounting surface, the solder having an adhesive property to the solder adsorbing film.

Abstract: An optical-electrical composite cable includes an optical fiber, a tubular resin inner cover to enclose the optical fiber, a plurality of electric wires disposed on an outside of the inner cover, and a tubular outer cover to collectively cover the plurality of electric wires. The plurality of electric wires are helically wound around an outer peripheral surface of the inner cover so as to be situated between the inner cover and the outer cover.

Abstract: A photoelectric conversion module includes: an IC chip and a photoelectric conversion element mounted on one surface of a circuit board having a light transmitting property and flexibility; an optical fiber having a tip portion disposed in a holding groove formed in a resin layer provided on another surface of the circuit board; a reinforcing member covering the holding groove; and an optical element optically coupling a tip of the optical fiber and the photoelectric conversion element via the circuit board. The holding groove has an open end at an end of the resin layer, the end of the resin layer being located on the IC chip side in terms of an arrangement direction of the IC chip and the photoelectric conversion element, and at least part of the tip portion of the optical fiber extends along the IC chip.

Abstract: A combined optical and electrical flexible wiring includes a first film substrate, a plurality of conductors aligned parallel on a surface of the first film substrate, an optical fiber provided on the surface of the first film substrate and aligned parallel to the plural conductors, a second film substrate with which the plural conductors and the optical fiber are covered in such a manner as to include an exposed portion, a resin mount provided over the exposed portion in such a manner as to cover the plural conductors and the optical fiber, the resin mount being formed with a light inlet or outlet groove including a mirror surface therein, an optical-electrical conversion component formed on a surface of the resin mount, and a wiring pattern formed on the surface of the resin mount.

Abstract: An optical wiring member according to the present invention includes: a substrate on which a light-emitting device and a light-receiving device are mounted; and an optical waveguide comprising a communication optical waveguide core and an optical waveguide clad that entirely covers the communication optical waveguide core, the optical waveguide being mounted on the substrate, in which the optical waveguide is equipped with a position-aligning light guiding portion for introducing position-aligning light into the communication optical waveguide core. By using, as a target light, the position-aligning light that is introduced into the communication optical waveguide core 3 and exits from the substrate, at least either the light-emitting device or the light-receiving device can be positioned.

Abstract: A photoelectric conversion module includes a substrate, a photoelectric conversion element optically coupled to an optical fiber, and a conductor pattern that is provided on a surface of the substrate and includes an electrode pattern mounting the photoelectric conversion element and a restriction pattern for restricting a position of the optical fiber.

Abstract: An optical fiber connection method for connecting an optical fiber to an optical waveguide on a circuit board, including arranging an end portion of the optical fiber along a groove such that an end face of the optical fiber contacts with a core end face of the optical waveguide, the groove being formed on the circuit board and extending to the core end face of the optical waveguide, wherein an extended portion of the optical fiber extending out of the groove is arranged being inclined at a predetermined inclination angle with respect to the circuit board, pressing an optical fiber hold-down member against the circuit board by a pressing member, the optical fiber hold-down member being arranged on the circuit board via an adhesive so as to cover the end portion of the optical fiber, and curing the adhesive while pressing the optical fiber hold-down member against the circuit board.

Abstract: A combined optical and electrical interconnection module includes a flat cable comprising an optical transmission line and an electrical wire, and a printed circuit board including a light receiving module for receiving optical signals and/or a light sending module for sending optical signals and an optical waveguide for the optical signals to be transmitted therethrough or an optical block for bending the optical paths of the optical signals. The printed circuit board is electrically and optically connected to both ends or one end of the flat cable.

Abstract: A mirror-embedded light transmission medium according to the present invention comprises: a light transmission medium including a light transmission layer, light being transmitted through the light transmission layer; a rough surface which terminates the light transmission layer, a direction of the rough surface being parallel or oblique to a light transmission direction of the light transmission layer; a reflection enhancing layer that adherently covers the rough surface; and a smooth surface formed over the reflection enhancing layer, the smooth surface reflecting the light transmitted through the light transmission layer.

Abstract: Provided is a cable with a connector (1) having a form in which a connector is fitted to a cable (6). A housing (2) of the connector is constituted by two case members (2a, 2b). A root portion of the cable (6) is covered with a boot (8) made of a resin, and a flange (8a) is formed in the boot (8). Inside the boot (8), a stop ring (10) made of a metal is arranged. The stop ring (10) allows a transmission line (6a) to be inserted through a main body thereof having a cylinder shape, and a jacket (6b) is covered on its outer side. A flange (10a) is also formed in the stop ring (10), and the flange (10a) and the flange (8a) are inserted into grooves (2c, 2d) in an overlapped state.

Abstract: A photoelectric transmission module being connected to a terminal of a composite cable including an optical fiber and an electrical cable, includes a substrate connected to the electrical cable drawn from the composite cable, a flexible printed circuit board including one end connected to a connector on the substrate and an other end connected to the optical fiber drawn from the composite cable, and an optical waveguide member formed along an outer surface of the flexible printed circuit board and connected to the optical fiber. The flexible printed circuit board further includes a displacement permitting area formed in a section from a connection end of the connector to a connection end of the optical fiber to allow the connection end of the connector and the connection end of the optical fiber to be relatively displaced in a direction along the substrate.

Abstract: A flexible flat optical cable includes two flexible base sheets, one or more optical fiber core wires arranged between the base sheets and each comprising at least an optical fiber, and an adhesive layer provided between the base sheets to bond the base sheets. A non-adhesive region is formed on a surface of the base sheets or the adhesive layer adjacent, in a thickness direction of the base sheets, to at least a portion of the optical fiber core wires for allowing a portion of the optical fiber core wires to move in a direction intersecting with an axial direction of the optical fiber core wires.

Abstract: A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of the substrate; a cover member fixed to the substrate via a solder layer constituted by solder and forming, cooperatively with the substrate, an airtight chamber housing the photoelectric conversion element; and a solder adsorbing film provided near an area fixed to the substrate by the solder layer, in a surface, of the cover member, facing the mounting surface, the solder having an adhesive property to the solder adsorbing film.

Abstract: A photoelectric conversion module includes: a photoelectric conversion element and an IC chip mounted on a mounting surface of a substrate; and an electrode provided on a side surface of the substrate, electrically connected to the IC chip, and having a concave shape sunk deeper than other portions of the side surface of the substrate.

Abstract: A photoelectric conversion module includes: an IC chip and a photoelectric conversion element mounted on one surface of a circuit board having a light transmitting property and flexibility; an optical fiber having a tip portion disposed in a holding groove formed in a resin layer provided on another surface of the circuit board; a reinforcing member covering the holding groove; and an optical element optically coupling a tip of the optical fiber and the photoelectric conversion element via the circuit board. The holding groove has an open end at an end of the resin layer, the end of the resin layer being located on the IC chip side in terms of an arrangement direction of the IC chip and the photoelectric conversion element, and at least part of the tip portion of the optical fiber extends along the IC chip.

Abstract: A photoelectric conversion module includes a circuit board including a plurality of first board-side electrodes and a plurality of second board-side electrodes that are alternately arranged on a mounting surface of the circuit board in an array direction and each extend into strips in a direction orthogonal to the array direction, a photoelectric conversion array element mounted on the circuit board and including, on a surface facing the mounting surface, a plurality of light receiving/emitting portions, first element-side electrodes connected to the first board-side electrodes and second element-side electrodes connected to the second board-side electrodes, and an IC chip mounted on the circuit board. The circuit board further includes, on the mounting surface, a connecting portion for connecting the first board-side electrodes to each other and a first electrode land portion connected to the first board-side electrode or the connecting portion to contact with a first test electrode probe.

Abstract: An optical fiber mounting waveguide device includes a substrate, an optical fiber mounting groove provided on a part of the substrate for mounting an optical fiber, an under cladding layer and a core sequentially formed on the substrate, and an over cladding layer formed on the core, the over cladding layer having an end surface facing to the optical fiber mounting groove, and wherein the core and the under cladding layer are protruded toward the optical fiber mounting groove with respect to the end surface of the over cladding layer.

Abstract: A combined optical and electrical flexible wiring includes a first film substrate, a plurality of conductors aligned parallel on a surface of the first film substrate, an optical fiber provided on the surface of the first film substrate and aligned parallel to the plural conductors, a second film substrate with which the plural conductors and the optical fiber are covered in such a manner as to include an exposed portion, a resin mount provided over the exposed portion in such a manner as to cover the plural conductors and the optical fiber, the resin mount being formed with a light inlet or outlet groove including a mirror surface therein, an optical-electrical conversion component formed on a surface of the resin mount, and a wiring pattern formed on the surface of the resin mount.