Patents by Inventor Kousaku Matsuno
Kousaku Matsuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6983756Abstract: A substrate treatment apparatus comprises a treatment vessel, a substrate holder for rotating the substrate in a horizontal plane in the treatment vessel, a nozzle unit arranged in an upper part of the treatment vessel such that a liquid is downwardly fed, a feed line for feeding the liquid to the nozzle unit, and a chamber enclosing therein the apparatus in its entirety. The nozzle unit is constructed in a form of a bar such that as viewed in plan, the liquid ejected from the nozzle unit reaches the substrate with an area range having a length not smaller than a diameter of the substrate and a width smaller than the diameter of the substrate.Type: GrantFiled: April 20, 2004Date of Patent: January 10, 2006Assignee: m - FSI Ltd.Inventors: Kousaku Matsuno, Masao Iga
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Publication number: 20050183749Abstract: A substrate cleaning apparatus comprises an outer shell constructed such that the outer shell is selectively openable or hermetically closable to form a sealed space, an inner shell enclosed within the outer shell and having a holding member for holding a substrate, and a dispenser unit for feeding at least one of gas and liquid into the inner shell. Within the sealed space formed by the outer shell, a highly gas-tight space is formed by the inner shell to permit cleaning of the substrate within the highly gas-tight space. Also disclosed are a dispenser, a substrate holding mechanism and a substrate cleaning chamber, which are suitable for use with the substrate cleaning apparatus, and substrate cleaning processes making use of these dispenser, substrate holding mechanism and substrate cleaning chamber, respectively.Type: ApplicationFiled: March 2, 2005Publication date: August 25, 2005Applicant: m-FSI LTD.Inventors: Kousaku Matsuno, Masao Iga, Takeji Ueda, Jun Kanayasu, Satoshi Shikami
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Publication number: 20050183750Abstract: A substrate cleaning apparatus comprises an outer shell constructed such that the outer shell is selectively openable or hermetically closable to form a sealed space, an inner shell enclosed within the outer shell and having a holding member for holding a substrate, and a dispenser unit for feeding at least one of gas and liquid into the inner shell. Within the sealed space formed by the outer shell, a highly gas-tight space is formed by the inner shell to permit cleaning of the substrate within the highly gas-tight space. Also disclosed are a dispenser, a substrate holding mechanism and a substrate cleaning chamber, which are suitable for use with the substrate cleaning apparatus, and substrate cleaning processes making use of these dispenser, substrate holding mechanism and substrate cleaning chamber, respectively.Type: ApplicationFiled: March 2, 2005Publication date: August 25, 2005Applicant: m-FSI LTD.Inventors: Kousaku Matsuno, Masao Iga, Takeji Ueda, Jun Kanayasu, Satoshi Shikami
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Publication number: 20050150530Abstract: A substrate cleaning apparatus comprises an outer shell constructed such that the outer shell is selectively openable or hermetically closable to form a sealed space, an inner shell enclosed within the outer shell and having a holding member for holding a substrate, and a dispenser unit for feeding at least one of gas and liquid into the inner shell. Within the sealed space formed by the outer shell, a highly gas-tight space is formed by the inner shell to permit cleaning of the substrate within the highly gas-tight space. Also disclosed are a dispenser, a substrate holding mechanism and a substrate cleaning chamber, which are suitable for use with the substrate cleaning apparatus, and substrate cleaning processes making use of these dispenser, substrate holding mechanism and substrate cleaning chamber, respectively.Type: ApplicationFiled: March 2, 2005Publication date: July 14, 2005Applicant: m-FSI LTD.Inventors: Kousaku Matsuno, Masao Iga, Takeji Ueda, Jun Kanayasu, Satoshi Shikami
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Patent number: 6874516Abstract: A substrate cleaning apparatus comprises an outer shell constructed such that the outer shell is selectively openable or hermetically closable to form a sealed space, an inner shell enclosed within the outer shell and having a holding member for holding a substrate, and a dispenser unit for feeding at least one of gas and liquid into the inner shell. Within the sealed space formed by the outer shell, a highly gas-tight space is formed by the inner shell to permit cleaning of the substrate within the highly gas-tight space. Also disclosed are a dispenser, a substrate holding mechanism and a substrate cleaning chamber, which are suitable for use with the substrate cleaning apparatus, and substrate cleaning processes making use of these dispenser, substrate holding mechanism and substrate cleaning chamber, respectively.Type: GrantFiled: May 30, 2002Date of Patent: April 5, 2005Assignee: m•FSI Ltd.Inventors: Kousaku Matsuno, Masao Iga, Takeji Ueda, Jun Kanayasu, Satoshi Shikami
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Publication number: 20040194812Abstract: A substrate treatment process is disclosed to remove organic matter existing on a substrate such as a wafer, glass substrate or ceramic. The process comprises treating the substrate with ozone water and then with hydrogen water, or treating the substrate with ozone-hydrogen water or treating the substrate with ozone water and hydrogen water at the same time. A substrate treatment apparatus is also disclosed for a substrate. The apparatus comprises a treatment vessel, a substrate holder for rotating the substrate in a horizontal plane in the treatment vessel, a nozzle unit arranged in an upper part of the treatment vessel such that a liquid is downwardly fed, a feed line for feeding the liquid to the nozzle unit, and a chamber enclosing therein the apparatus in its entirety.Type: ApplicationFiled: April 20, 2004Publication date: October 7, 2004Applicant: m. FSI LTD.Inventors: Kousaku Matsuno, Masao Iga
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Patent number: 6743301Abstract: A substrate treatment process is disclosed to remove organic matter existing on a substrate such as a wafer, glass substrate or ceramic. The process comprises treating the substrate with ozone water and then with hydrogen water, or treating the substrate with ozone-hydrogen water or treating the substrate with ozone water and hydrogen water at the same time.Type: GrantFiled: December 22, 2000Date of Patent: June 1, 2004Assignee: m&Circlesolid;FSI Ltd.Inventors: Kousaku Matsuno, Masao Iga
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Publication number: 20030005948Abstract: A substrate cleaning apparatus comprises an outer shell constructed such that the outer shell is selectively openable or hermetically closable to form a sealed space, an inner shell enclosed within the outer shell and having a holding member for holding a substrate, and a dispenser unit for feeding at least one of gas and liquid into the inner shell. Within the sealed space formed by the outer shell, a highly gas-tight space is formed by the inner shell to permit cleaning of the substrate within the highly gas-tight space. Also disclosed are a dispenser, a substrate holding mechanism and a substrate cleaning chamber, which are suitable for use with the substrate cleaning apparatus, and substrate cleaning processes making use of these dispenser, substrate holding mechanism and substrate cleaning chamber, respectively.Type: ApplicationFiled: May 30, 2002Publication date: January 9, 2003Applicant: m-FSI LTD.Inventors: Kousaku Matsuno, Masao Iga, Takeji Ueda, Jun Kanayasu, Satoshi Shikami
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Publication number: 20010053585Abstract: Disclosed herein is a cleaning process for a substrate surface on which a high-density film and a low-density film lower in density than the high-density film are carried in combination. According to the cleaning process, a mixed gas of anhydrous hydrogen fluoride gas and a heated inert gas is brought into contact with the substrate surface such that at least a portion of the low-density film is removed without impairing the high-density film beyond a tolerance. The substrate is, for example, a semiconductor substrate.Type: ApplicationFiled: May 2, 2001Publication date: December 20, 2001Applicant: m-FSI LTD.Inventors: Satoshi Kikuchi, Kousaku Matsuno, Haruru Watatsu
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Publication number: 20010009155Abstract: A substrate treatment process is disclosed to remove organic matter existing on a substrate such as a wafer, glass substrate or ceramic. The process comprises treating the substrate with ozone water and then with hydrogen water, or treating the substrate with ozone-hydrogen water or treating the substrate with ozone water and hydrogen water at the same time. A substrate treatment apparatus is also disclosed for a substrate. The apparatus comprises a treatment vessel, a substrate holder for rotating the substrate in a horizontal plane in the treatment vessel, a nozzle unit arranged in an upper part of the treatment vessel such that a liquid is downwardly fed, a feed line for feeding the liquid to the nozzle unit, and a chamber enclosing therein the apparatus in its entirety.Type: ApplicationFiled: December 22, 2000Publication date: July 26, 2001Applicant: m . FSI LTD.Inventors: Kousaku Matsuno, Masao Iga