Patents by Inventor Kris Bhaskar
Kris Bhaskar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9576861Abstract: Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a region containing one or more of the universal targets with an inspection tool, identifying one or more anomalistic universal targets in the inspected region with an inspection tool and, responsive to the identification of one or more anomalistic universal targets in the inspected region, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.Type: GrantFiled: November 18, 2013Date of Patent: February 21, 2017Assignee: KLA-Tencor CorporationInventors: Allen Park, Ellis Chang, Michael Adel, Kris Bhaskar, Ady Levy, Amir Widmann, Mark Wagner, Songnian Rong
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Patent number: 9355208Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes determining locations of all instances of a weak geometry in a design for a wafer. The locations include random, aperiodic locations. The weak geometry includes one or more features that are more prone to defects than other features in the design. The method also includes scanning the wafer with a wafer inspection system to thereby generate output for the wafer with one or more detectors of the wafer inspection system. In addition, the method includes detecting defects in at least one instance of the weak geometry based on the output generated at two or more instances of the weak geometry in a single die on the wafer.Type: GrantFiled: July 1, 2014Date of Patent: May 31, 2016Assignee: KLA-Tencor Corp.Inventors: Eugene Shifrin, Ashok Kulkarni, Kris Bhaskar, Graham Michael Lynch, John Raymond Jordan, III, Chwen-Jiann Fang
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Publication number: 20160150191Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a storage medium configured for storing images for a physical version of a specimen generated by an inspection system. At least two dies are formed on the specimen with different values of one or more parameters of a fabrication process performed on the specimen. The system also includes computer subsystem(s) configured for comparing portions of the stored images generated at locations on the specimen at which patterns having the same as-designed characteristics are formed with at least two of the different values. The portions of the stored images that are compared are not constrained by locations of the dies on the specimen, locations of the patterns within the dies, or locations of the patterns on the specimen. The computer subsystem(s) are also configured for detecting defects at the locations based on results of the comparing.Type: ApplicationFiled: November 20, 2015Publication date: May 26, 2016Inventors: Laurent Karsenti, Kris Bhaskar, Mark Wagner, Brian Duffy, Vijayakumar Ramachandran
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Patent number: 9262821Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.Type: GrantFiled: May 8, 2015Date of Patent: February 16, 2016Assignee: KLA-Tencor Corp.Inventors: Eugene Shifrin, Chetana Bhaskar, Ashok V. Kulkarni, Chien-Huei (Adam) Chen, Kris Bhaskar, Brian Duffy
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Patent number: 9222771Abstract: Systems and methods for acquiring information for a construction site are provided. One system includes a base unit positioned within a construction site by a user. A computer subsystem of the base unit determines a position of the base unit with respect to the construction site. The system also includes a measurement unit moved within the construction site by a user. The measurement unit includes one or more elements configured to interact with light in a known manner. An optical subsystem of the base unit directs light to the element(s) and detects the light after interacting with the element(s). The computer subsystem is configured to determine a position and pose of the measurement unit with respect to the base unit based on the detected light. The measurement unit includes a measurement device used by the measurement unit or the base unit to determine information for the construction site.Type: GrantFiled: October 15, 2012Date of Patent: December 29, 2015Assignee: KLA-Tencor Corp.Inventors: Eliezer Rosengaus, Ady Levy, Kris Bhaskar
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Patent number: 9222895Abstract: Generalized virtual inspectors are provided. One system includes two or more actual systems configured to perform one or more processes on specimen(s) while the specimen(s) are disposed within the actual systems. The system also includes one or more virtual systems coupled to the actual systems to thereby receive output generated by the actual systems and to send information to the actual systems. The virtual system(s) are configured to perform one or more functions using at least some of the output received from the actual systems. The virtual system(s) are not capable of having the specimen(s) disposed therein.Type: GrantFiled: February 19, 2014Date of Patent: December 29, 2015Assignee: KLA-Tencor Corp.Inventors: Brian Duffy, Kris Bhaskar
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Publication number: 20150324964Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.Type: ApplicationFiled: May 8, 2015Publication date: November 12, 2015Inventors: Eugene Shifrin, Chetana Bhaskar, Ashok V. Kulkarni, Chien-Huei (Adam) Chen, Kris Bhaskar, Brian Duffy
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Patent number: 9176072Abstract: A dark field inspection system that minimizes the speckle noise due to sample surface roughness can include a plurality of beam shaping paths for generating a composite, focused illumination line on a wafer. Each beam shaping path can illuminate the wafer at an oblique angle. The plurality of beam shaping paths can form a ring illumination. This ring illumination can reduce the speckle effect, thereby improving SNR. An objective lens can capture scattered light from the wafer and an imaging sensor can receive an output of the objective lens. Because the wafer illumination occurs at oblique angles, the objective lens can have a high NA, thereby improving optical resolution of the imaging sensor, and the resulting signal level.Type: GrantFiled: July 16, 2010Date of Patent: November 3, 2015Assignee: KLA-Tencor CorporationInventors: Guoheng Zhao, Mehdi Vaez-Iravani, Scott Young, Kris Bhaskar
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Publication number: 20150012900Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes determining locations of all instances of a weak geometry in a design for a wafer. The locations include random, aperiodic locations. The weak geometry includes one or more features that are more prone to defects than other features in the design. The method also includes scanning the wafer with a wafer inspection system to thereby generate output for the wafer with one or more detectors of the wafer inspection system. In addition, the method includes detecting detects in at least one instance of the weak geometry based on the output generated at two or more instances of the weak geometry in a single die on the wafer.Type: ApplicationFiled: July 1, 2014Publication date: January 8, 2015Inventors: Eugene Shifrin, Ashok Kulkarni, Kris Bhaskar, Graham Michael Lynch, John Raymond Jordan, III, Chwen-Jiann Fang
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Publication number: 20140241610Abstract: Generalized virtual inspectors are provided. One system includes two or more actual systems configured to perform one or more processes on specimen(s) while the specimen(s) are disposed within the actual systems. The system also includes one or more virtual systems coupled to the actual systems to thereby receive output generated by the actual systems and to send information to the actual systems. The virtual system(s) are configured to perform one or more functions using at least some of the output received from the actual systems. The virtual system(s) are not capable of having the specimen(s) disposed therein.Type: ApplicationFiled: February 19, 2014Publication date: August 28, 2014Applicant: KLA-Tencor CorporationInventors: Brian Duffy, Kris Bhaskar
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Publication number: 20140199791Abstract: Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a region containing one or more of the universal targets with an inspection tool, identifying one or more anomalistic universal targets in the inspected region with an inspection tool and, responsive to the identification of one or more anomalistic universal targets in the inspected region, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.Type: ApplicationFiled: November 18, 2013Publication date: July 17, 2014Applicant: KLA-Tencor CorporationInventors: Allen Park, Ellis Chang, Michael Adel, Kris Bhaskar, Ady Levy, Amir Widmann, Mark Wagner, Songnian Rong
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Patent number: 8422010Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.Type: GrantFiled: September 12, 2012Date of Patent: April 16, 2013Assignee: KLA-Tencor Technologies Corp.Inventors: Michael D. Kirk, Christopher F. Bevis, David Adler, Kris Bhaskar
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Publication number: 20130035877Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.Type: ApplicationFiled: September 12, 2012Publication date: February 7, 2013Applicant: KLA-TENCOR TECHNOLOGIES CORPORATIONInventors: Michael D. Kirk, Christopher F. Bevis, David Adler, Kris Bhaskar
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Patent number: 8284394Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.Type: GrantFiled: February 9, 2007Date of Patent: October 9, 2012Assignee: KLA-Tencor Technologies Corp.Inventors: Michael D. Kirk, Christopher F. Bevis, David Adler, Kris Bhaskar
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Patent number: 8204296Abstract: Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.Type: GrantFiled: September 14, 2010Date of Patent: June 19, 2012Assignee: KLA-Tencor Corp.Inventors: Kris Bhaskar, Mark McCord, Santosh Bhattacharyya, Ardis Liang, Richard Wallingford, Hubert Altendorfer, Kais Maayah
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Patent number: 8126255Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.Type: GrantFiled: September 19, 2008Date of Patent: February 28, 2012Assignee: KLA-Tencor Corp.Inventors: Kris Bhaskar, Chetana Bhaskar, Ashok Kulkarni, Eliezer Rosengaus, Cecelia Campochiaro, Chris Maher, Brian Duffy, Aneesh Khullar, Alpa Kohli, Lalita A. Balasubramanian, Santosh Bhattacharyya, Mohan Mahadevan
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Publication number: 20110169944Abstract: A dark field inspection system that minimizes the speckle noise due to sample surface roughness can include a plurality of beam shaping paths for generating a composite, focused illumination line on a wafer. Each beam shaping path can illuminate the wafer at an oblique angle. The plurality of beam shaping paths can form a ring illumination. This ring illumination can reduce the speckle effect, thereby improving SNR. An objective lens can capture scattered light from the wafer and an imaging sensor can receive an output of the objective lens. Because the wafer illumination occurs at oblique angles, the objective lens can have a high NA, thereby improving optical resolution of the imaging sensor, and the resulting signal level.Type: ApplicationFiled: July 16, 2010Publication date: July 14, 2011Inventors: Guoheng Zhao, Mehdi Vaez-Iravani, Scott Young, Kris Bhaskar
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Publication number: 20100329540Abstract: Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.Type: ApplicationFiled: September 14, 2010Publication date: December 30, 2010Applicant: KLA-TENCOR CORPORATIONInventors: Kris Bhaskar, Mark McCord, Santosh Bhattacharyya, Ardis Liang, Richard Wallingford, Hubert Altendorfer, Kais Maayah
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Patent number: 7796804Abstract: Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.Type: GrantFiled: July 18, 2008Date of Patent: September 14, 2010Assignee: KLA-Tencor Corp.Inventors: Kris Bhaskar, Mark McCord, Santosh Bhattacharyya, Ardis Liang, Richard Wallingford, Hubert Altendorfer, Kais Maayah
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Publication number: 20090080759Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.Type: ApplicationFiled: September 19, 2008Publication date: March 26, 2009Applicant: KLA-TENCOR CORPORATIONInventors: Kris Bhaskar, Chetana Bhaskar, Ashok Kulkarni, Eliezer Rosengaus, Cecilia Campochiaro, Chris Maher, Brian Duffy, Aneesh Khullar, Alpa Kohli, Lalita A. Balasubramanian, Santosh Bhattacharyya, Mohan Mahadevan