Patents by Inventor Krishna R. Tunga
Krishna R. Tunga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11784160Abstract: An integrated circuit package substrate (ICPS) system includes a die including a first array of connectors and a substrate including a second array of connectors that is configured to be thermocompression bonded to the first array of connectors at a bonding temperature that is above a solder melting temperature. The first die is bonded to the substrate such that the first die is asymmetric with respect to a substrate center, and the second array of connectors is adjusted, at an alignment temperature that is below the solder melting temperature, for thermal expansion to the bonding temperature with respect to a reference point that is not a first die center.Type: GrantFiled: September 23, 2020Date of Patent: October 10, 2023Assignee: International Business Machines CorporationInventors: Katsuyuki Sakuma, Krishna R. Tunga, Shidong Li, Griselda Bonilla
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Patent number: 11744981Abstract: Systems, computer-implemented methods and/or computer program products that facilitate real-time response to defined symptoms are provided. In one embodiment, a computer-implemented method comprises: monitoring, by a system operatively coupled to a processor, a state of an entity; detecting, by the system, defined symptoms of the entity by analyzing the state of the entity; and transmitting, by the system, a signal that causes audio response or a haptic response to be provided to the entity, wherein transmission of the signal that causes the audio response or the haptic response is based on detection of the defined symptoms.Type: GrantFiled: October 18, 2021Date of Patent: September 5, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mahmoud Amin, Krishna R. Tunga, Lawrence A. Clevenger, Zhenxing Bi, Leigh Anne H. Clevenger
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Patent number: 11545444Abstract: A lidded chip package apparatus has reduced latent thermal stress in an under-chip high-CTE layer of the chip package because the lid of the package was adhered to a substrate of the package and cured during a same thermal excursion as when underfill was dispensed and cured under a chip of the package, and the chip package was cooled from the combined underfill and lidding process to room temperature with the lid adhered to the chip and the substrate, thereby reducing latent thermal stress in the under-chip high-CTE layer of the chip package.Type: GrantFiled: December 31, 2020Date of Patent: January 3, 2023Assignee: International Business Machines CorporationInventors: Mukta Ghate Farooq, Katsuyuki Sakuma, Krishna R. Tunga, Hilton T. Toy
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Publication number: 20220208693Abstract: A lidded chip package apparatus has reduced latent thermal stress in an under-chip high-CTE layer of the chip package because the lid of the package was adhered to a substrate of the package and cured during a same thermal excursion as when underfill was dispensed and cured under a chip of the package, and the chip package was cooled from the combined underfill and lidding process to room temperature with the lid adhered to the chip and the substrate, thereby reducing latent thermal stress in the under-chip high-CTE layer of the chip package.Type: ApplicationFiled: December 31, 2020Publication date: June 30, 2022Inventors: Mukta Ghate Farooq, Katsuyuki Sakuma, Krishna R. Tunga, Hilton T. Toy
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Patent number: 11302205Abstract: A computer-implemented method, a computer program product, and an incremental learning system are provided for language learning and speech enhancement. The method includes transforming acoustic utterances uttered by an individual into textual representations thereof, by a voice-to-language processor configured to perform speech recognition. The method further includes accelerating speech development in the individual, by an incremental learning system that includes the voice-to-language processor and that processes the acoustic utterances using natural language processing and analytics to determine and incrementally provide new material to the individual for learning. Responsive to the individual being a baby, the voice-to-language processor discretizes baby babbling to consonants, letters, and words.Type: GrantFiled: December 22, 2020Date of Patent: April 12, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mahmoud Amin, Zhenxing Bi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Krishna R. Tunga, Loma Vaishnav
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Patent number: 11302651Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.Type: GrantFiled: September 19, 2019Date of Patent: April 12, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti
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Publication number: 20220093556Abstract: An integrated circuit package substrate (ICPS) system includes a die including a first array of connectors and a substrate including a second array of connectors that is configured to be thermocompression bonded to the first array of connectors at a bonding temperature that is above a solder melting temperature. The first die is bonded to the substrate such that the first die is asymmetric with respect to a substrate center, and the second array of connectors is adjusted, at an alignment temperature that is below the solder melting temperature, for thermal expansion to the bonding temperature with respect to a reference point that is not a first die center.Type: ApplicationFiled: September 23, 2020Publication date: March 24, 2022Inventors: Katsuyuki Sakuma, Krishna R. Tunga, Shidong Li, Griselda Bonilla
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Patent number: 11282773Abstract: An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within the conductive pad array, and an enlarged conductive pad. The enlarged conductive pad is arranged on the insulating body and within the conductive pad array, wherein the enlarged conductive pad is spaced apart from the small conductive pad and is larger than the small conductive pad. C4 assemblies and methods of making C4 assemblies including the electrical device are also described.Type: GrantFiled: April 10, 2020Date of Patent: March 22, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Krishna R. Tunga, Thomas Weiss, Charles Leon Arvin, Bhupender Singh, Brian W. Quinlan
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Publication number: 20220032000Abstract: Systems, computer-implemented methods and/or computer program products that facilitate real-time response to defined symptoms are provided. In one embodiment, a computer-implemented method comprises: monitoring, by a system operatively coupled to a processor, a state of an entity; detecting, by the system, defined symptoms of the entity by analyzing the state of the entity; and transmitting, by the system, a signal that causes audio response or a haptic response to be provided to the entity, wherein transmission of the signal that causes the audio response or the haptic response is based on detection of the defined symptoms.Type: ApplicationFiled: October 18, 2021Publication date: February 3, 2022Inventors: Mahmoud Amin, Krishna R. Tunga, Lawrence A. Clevenger, Zhenxing Bi, Leigh Anne H. Clevenger
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Patent number: 11239183Abstract: A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.Type: GrantFiled: January 31, 2020Date of Patent: February 1, 2022Assignee: International Business Machines CorporationInventors: Tuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Charles Leon Arvin, Steven Paul Ostrander, Thomas Weiss
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Patent number: 11210968Abstract: A computer system interacts with a user with a behavioral state. An activity performed by an entity with a behavioral state is determined. A virtual character corresponding to the entity and performing the determined activity of the entity is generated and displayed. A mental state of the entity responsive to the virtual character is detected. In response to detection of a positive mental state of the entity, one or more natural language terms are provided to the entity corresponding to the activity performed by the virtual character. Embodiments of the present invention further include a method and program product for interacting with a user with a behavioral state in substantially the same manner described above.Type: GrantFiled: September 18, 2018Date of Patent: December 28, 2021Assignee: International Business Machines CorporationInventors: Lawrence A. Clevenger, Stefania Axo, Leigh Anne H. Clevenger, Krishna R. Tunga, Mahmoud Amin, Bryan Gury, Christopher J. Penny, Mark C. Wallen, Zhenxing Bi, Yang Liu
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Patent number: 11185658Abstract: Systems, computer-implemented methods and/or computer program products that facilitate real-time response to defined symptoms are provided. In one embodiment, a computer-implemented method comprises: monitoring, by a system operatively coupled to a processor, a state of an entity; detecting, by the system, defined symptoms of the entity by analyzing the state of the entity; and transmitting, by the system, a signal that causes audio response or a haptic response to be provided to the entity, wherein transmission of the signal that causes the audio response or the haptic response is based on detection of the defined symptoms.Type: GrantFiled: December 12, 2018Date of Patent: November 30, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mahmoud Amin, Krishna R. Tunga, Lawrence A. Clevenger, Zhenxing Bi, Leigh Anne H. Clevenger
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Publication number: 20210320056Abstract: An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within the conductive pad array, and an enlarged conductive pad. The enlarged conductive pad is arranged on the insulating body and within the conductive pad array, wherein the enlarged conductive pad is spaced apart from the small conductive pad and is larger than the small conductive pad. C4 assemblies and methods of making C4 assemblies including the electrical device are also described.Type: ApplicationFiled: April 10, 2020Publication date: October 14, 2021Inventors: Krishna R. Tunga, Thomas Weiss, Charles Leon Arvin, Bhupender Singh, Brian W. Quinlan
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Publication number: 20210242139Abstract: A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.Type: ApplicationFiled: January 31, 2020Publication date: August 5, 2021Inventors: Tuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Charles Leon Arvin, Steven Paul Ostrander, Thomas Weiss
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Patent number: 10985129Abstract: Multiple integrated circuit (IC) devices are connected to a top side metallization surface of a multi IC device carrier. The carrier includes resin based substrate layers and associated wiring line layers. To reduce stain of the resin layers, especially in region(s) within the carrier between the IC devices, a stiffener or stiffeners are applied to the back side metallization (BSM) surface of the IC device carrier. The stiffener(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the resin layer(s), thereby mitigating the risk for cracks forming and expanding within the resin layers.Type: GrantFiled: April 15, 2019Date of Patent: April 20, 2021Assignee: International Business Machines CorporationInventors: Thomas E. Lombardi, Steve Ostrander, Krishna R. Tunga, Thomas A. Wassick
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Publication number: 20210110727Abstract: A computer-implemented method, a computer program product, and an incremental learning system are provided for language learning and speech enhancement. The method includes transforming acoustic utterances uttered by an individual into textual representations thereof, by a voice-to-language processor configured to perform speech recognition. The method further includes accelerating speech development in the individual, by an incremental learning system that includes the voice-to-language processor and that processes the acoustic utterances using natural language processing and analytics to determine and incrementally provide new material to the individual for learning. Responsive to the individual being a baby, the voice-to-language processor discretizes baby babbling to consonants, letters, and words.Type: ApplicationFiled: December 22, 2020Publication date: April 15, 2021Inventors: Mahmoud Amin, Zhenxing Bi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Krishna R. Tunga, Loma Vaishnav
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Patent number: 10950573Abstract: Disclosed are interconnects in which one substrate having a high melting temperature, lead-free solder column is joined to a second substrate having openings filled with a low melting temperature, lead-free solder such that the high melting temperature, lead-free solder column penetrates into the low melting temperature, lead-free solder so as to obtain a short moment arm of solder.Type: GrantFiled: March 19, 2019Date of Patent: March 16, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Clement J. Fortin, Christopher D. Muzzy, Krishna R. Tunga, Thomas Weiss
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Patent number: 10916154Abstract: A computer-implemented method, a computer program product, and an incremental learning system are provided for language learning and speech enhancement. The method includes transforming acoustic utterances uttered by an individual into textual representations thereof, by a voice-to-language processor configured to perform speech recognition. The method further includes accelerating speech development in the individual, by an incremental learning system that includes the voice-to-language processor and that processes the acoustic utterances using natural language processing and analytics to determine and incrementally provide new material to the individual for learning.Type: GrantFiled: October 25, 2017Date of Patent: February 9, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mahmoud Amin, Zhenxing Bi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Krishna R. Tunga, Loma Vaishnav
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Patent number: 10832987Abstract: A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.Type: GrantFiled: March 24, 2018Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Marcus E. Interrante, Thomas E. Lombardi, Hilton T. Toy, Krishna R. Tunga, Thomas Weiss
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Publication number: 20200328177Abstract: Multiple integrated circuit (IC) devices are connected to a top side metallization surface of a multi IC device carrier. The carrier includes resin based substrate layers and associated wiring line layers. To reduce stain of the resin layers, especially in region(s) within the carrier between the IC devices, a stiffener or stiffeners are applied to the back side metallization (BSM) surface of the IC device carrier. The stiffener(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the resin layer(s), thereby mitigating the risk for cracks forming and expanding within the resin layers.Type: ApplicationFiled: April 15, 2019Publication date: October 15, 2020Inventors: Thomas E. Lombardi, Steve Ostrander, Krishna R. Tunga, Thomas A. Wassick