Patents by Inventor Krishna Seshan

Krishna Seshan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrasonic adhesion/dehesion monitoring apparatus with power feedback measuring means
    Patent number: 5213249
    Abstract: An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the adhesion/dehesion between first and second substrates comprising: a. an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; b. means for measuring the instantaneous AC current and instantaneous AC supplied to said ultrasonic source; c. means for multiplying the instantaneous AC voltage and the instantaneous AC current to determine the instantaneous power supplied to said ultrasonic source; and d. monitor means coupled to said ultrasonic source and said power determining means for monitoring the instantaneous power supplied to said ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: May 25, 1993
    Assignee: International Business Machines Corporation
    Inventors: David C. Long, Krishna Seshan
  • Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means
    Patent number: 5170929
    Abstract: An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the quality and/or adhesion/dehesion between first and second substrates comprising: (a) an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; (b) acoustic transducer means proximate to the ultrasonic source and/or the substrates; and (c) monitor means coupled to the acoustic transducer means for monitoring the ultrasonic signal from the ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: December 15, 1992
    Assignee: International Business Machines Corporation
    Inventors: David C. Long, Krishna Seshan
  • On-chip temperature sensor utilizing a Schottky barrier diode structure
    Patent number: 5154514
    Abstract: A temperature sensor, comprising: a diode structure including, a) a silicon substrate, b) a first region of a metal silicide in the silicon substrate, c) a second region of a metal-oxide semiconductor material on the first region, d) a third region of a metal over the second region; and, means for using the diode structure as a temperature sensitive device to measure an ambient temperature. The metal-oxide semiconductor material is preferably selected to have a bandgap of not less than about 3.0 eV.
    Type: Grant
    Filed: August 29, 1991
    Date of Patent: October 13, 1992
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey P. Gambino, Louis L. Hsu, Michael A. Lee, Krishna Seshan, Alvin Sugerman, Francis E. Turene
  • Method and apparatus for causing an open circuit in a conductive line
    Patent number: 4962294
    Abstract: A method for causing an open circuit in an electrical conductor is provided, including the steps of: conducting a direct current through the conductor; and applying heat at a selected location on the conductor whereat it is desired to cause the open circuit of the conductor.
    Type: Grant
    Filed: March 14, 1989
    Date of Patent: October 9, 1990
    Assignee: International Business Machines Corporation
    Inventors: Keith F. Beckham, David C. Challener, Arunava Gupta, Joseph M. Harvilchuck, James M. Leas, James R. Lloyd, David C. Long, Horatio Quinones, Krishna Seshan, Morris Shatzkes