Patents by Inventor Krishna Vasanth VALAVALA

Krishna Vasanth VALAVALA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • USING A THERMOELECTRIC COOLER TO REDUCE HEAT TRANSFER BETWEEN HEAT-CONDUCTING PLATES
    Publication number: 20200098664
    Abstract: Embodiments herein relate to systems, apparatuses, processing, and techniques related to a first heat-conducting plate to be thermally coupled to a first heat source, a thermoelectric cooler (TEC) thermally coupled to the first plate, a second heat-conducting plate thermally coupled to the TEC and to be thermally coupled to a second heat source where the TEC is to at least partially thermally isolate the first plate from the second plate to reduce heat transfer from the first plate to the second plate.
    Type: Application
    Filed: September 26, 2018
    Publication date: March 26, 2020
    Inventors: Krishna Vasanth VALAVALA, Kelly LOFGREEN, Chandra-Mohan JHA