Abstract: A low friction horizontal probing fixture includes two rails of a base unit and two slide units respectively disposed on and being slidable along the rails. Each slide unit has a slide seat that is disposed adjacent to a respective one of the rails, rolling members that are connected to the slide seat and that are rollable on the respective rail so that the slide seat is movable along the respective rail, and a lock mechanism that is disposed on the slide seat and that is operable to position the slide seat relative to the respective rail. A guiding member is connected co-movably to the slide units.

Abstract: A method for system profiling and controlling and a computer system performing the same are provided. In the method, an operating system is operated after the computer system is booted, in which a profiling-controlling system is operated. When the operating system loads and executes a system profiling-controlling program, the profiling-controlling system that simultaneously operates a profiling routine and a controlling routine is initiated. The profiling routine is used to retrieve system kernel data that is generated during operation of the operating system and analyze the system kernel data through a kernel tracing tool. When it is determined that controlling is required, the profiling routine notifies the controlling routine. The controlling routine controls operating parameters of the operating system in real time according to an analysis result generated by the profiling routine.

Abstract: A memory circuit includes a control circuit configured to receive a clock signal including a clock cycle and output control signals based on the clock signal, an input circuit arrangement configured to, responsive to the control signals, pass a latched address to an output of the input circuit arrangement, the latched address including, during a first half of the clock cycle, a read address received at a first input port, and, during a second half of the clock cycle, a write address received at a second input port, an array of single-port memory cells, the memory circuit being configured to perform read and write operations during the respective first and second halves of the clock cycle, and a decoding circuit arrangement configured to, based on the latched address at the output, activate a row of memory cells of the array during each of the first and second clock cycle halves.

Abstract: A method for fabricating a semiconductor device includes providing a fin in a first region of a substrate. The fin includes a plurality of a first type of epitaxial layers and a plurality of a second type of epitaxial layers. A portion of a layer of the second type of epitaxial layers in a channel region of the first fin is removed to form a first gap between a first layer of the first type of epitaxial layers and a second layer of the first type of epitaxial layers. A first portion of a first gate structure is formed within the first gap and extending from a first surface of the first layer of the first type of epitaxial layers to a second surface of the second layer of the first type of epitaxial layers. A first source/drain feature is formed abutting the first portion of the first gate structure.

Abstract: A semiconductor device includes a semiconductor channel region, a source/drain region, and a contact structure. The semiconductor channel region is over a substrate. The source/drain region is adjacent the semiconductor channel region. The source/drain region has a notched corner. The contact structure has a portion inlaid in the notched corner in the source/drain region.

Abstract: The disclosure provides an electronic device including a substrate, a first vibrating unit, and a supporting unit. The substrate has a first surface. The first vibrating unit is disposed on the first surface and has a second surface. The second surface faces the first surface. The supporting unit is disposed between the substrate and the first vibrating unit. The first surface and the second surface are separated by a distance through the supporting unit. This distance ranges from equal to or greater than 0.06 mm to equal to or less than 65.4 mm.

Abstract: Aspects of the disclosure provide a method for forming a fin field effect transistor (FinFET) incorporating a fin top hardmask on top of a channel region of a fin. Because of the presence of the fin top hardmask, a gate height of the FinFET can be reduced without affecting proper operations of vertical gate channels on sidewalls of the fin. Consequently, parasitic capacitance between a gate stack and source/drain contacts of the FinFET can be reduced by lowering the gate height of the FinFET.

Abstract: A semiconductor image-sensing structure includes a reflective grid and a reflective shield disposed over a substrate. The reflective grid is disposed in a first region, and the reflective shield is disposed in a second region separated from the first region. A thickness of the reflective shield is greater than a thickness of the reflective grid.

Abstract: A voice call management method is provided. The voice call management method may be applied to an apparatus. The voice call management method may include the following steps. The apparatus may determine the current scenario associated with the operation environment of the apparatus. Then, the apparatus may determine to perform a voice call through a modem (MD) voice engine or through an application processor (AP) voice engine according to the current scenario.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes multiple semiconductor nanostructures and a gate stack wrapped around the semiconductor nanostructures. The semiconductor device structure also includes a first epitaxial structure and a second epitaxial structure sandwiching one or more of the semiconductor nanostructures. The semiconductor device structure further includes an isolation structure continuously extending across edges of the semiconductor nanostructures.

Abstract: An electrostatic discharge protection structure includes a semiconductor substrate, a gate structure disposed on the semiconductor substrate, a first well region of a first conductivity type disposed in the semiconductor substrate, a first doped region of the first conductivity type, a second doped region of a second conductivity type, a third doped region of the first conductivity type, and a fourth doped region of the second conductivity type. The first and second doped regions are disposed in the first well region and connected with each other. The second doped region is an emitter of a first bipolar junction transistor. The third and fourth doped regions are disposed in the semiconductor substrate and connected with each other. The third and second doped regions are located at two opposite sides of the gate structure in a first horizontal direction. The third doped region is an emitter of a second bipolar junction transistor.

Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary method comprises forming a first stack structure and a second stack structure in a first area over a substrate, wherein each of the stack structures includes semiconductor layers separated and stacked up; depositing a first interfacial layer around each of the semiconductor layers of the stack structures; depositing a gate dielectric layer around the first interfacial layer; forming a dipole oxide layer around the gate dielectric layer; removing the dipole oxide layer around the gate dielectric layer of the second stack structure; performing an annealing process to form a dipole gate dielectric layer for the first stack structure and a non-dipole gate dielectric layer for the second stack structure; and depositing a first gate electrode around the dipole gate dielectric layer of the first stack structure and the non-dipole gate dielectric layer of the second stack structure.

Abstract: A semiconductor structure includes a stack of semiconductor layers disposed over a substrate, a metal gate structure disposed over and interleaved with the stack of semiconductor layers, the metal gate structure including a gate electrode disposed over a gate dielectric layer, a first isolation structure disposed adjacent to a first sidewall of the stack of semiconductor layers, where the gate dielectric layer fills space between the first isolation structure and the first sidewall of the stack of semiconductor layers, and a second isolation structure disposed adjacent to a second sidewall of the stack of semiconductor layers, where the gate electrode fills the space between the second isolation structure and the second sidewall of the stack of semiconductor layers.

Abstract: An analysis system connects to a set of data sources and perform natural language questions based on the data sources. The analysis system connects with the data sources and retrieves metadata describing data assets stored in each data source. The analysis system generates an execution plan for the natural language question. The analysis system finds data assets that match the received question based on the metadata. The analysis system ranks the data assets and presents the ranked data assets to users for allowing users to modify the execution plan. The analysis system may use execution plans of previously stored questions for executing new questions. The analysis system supports selective preprocessing of data to increase the data quality.

Abstract: Provided are an aromatic compound represented by Chemical Formula 1 and an electroluminescent device including the same. In Chemical Formula 1, R1, R2, R3, Ar1, and Ar2 are the same as described in the detailed description.

Abstract: Self-aligned gate cutting techniques are disclosed herein that provide dielectric gate isolation fins for isolating gates of multigate devices from one another. An exemplary device includes a first multigate device having first source/drain features and a first metal gate that surrounds a first channel layer and a second multigate device having second source/drain features and a second metal gate that surrounds a second channel layer. A dielectric gate isolation fin separates the first metal gate from the second metal gate. The dielectric gate isolation fin includes a first dielectric layer having a first dielectric constant and a second dielectric layer having a second dielectric constant disposed over the first dielectric layer. The second dielectric constant is greater than the first dielectric constant. The first metal gate and the second metal gate physically contact the first channel layer and the second channel layer, respectively, and the dielectric gate isolation fin.

Abstract: A device includes a substrate, a first semiconductor channel over the substrate, and a second semiconductor channel over the substrate laterally offset from the first semiconductor channel. A first gate structure and a second gate structure are over and laterally surround the first and second semiconductor channels, respectively. A first inactive fin is between the first gate structure and the second gate structure. A dielectric feature over the inactive fin includes multiple layers of dielectric material formed through alternating deposition and etching steps.

Abstract: A device includes a first transistor, a second transistor, an interlayer dielectric (ILD) layer, and a backside gate rail. The first and second transistors are arranged along a first direction in a top view. The first transistor includes a first channel layer, a gate structure surrounding the first channel layer, a first source/drain epitaxial structure and a second source/drain epitaxial structure connected to the first channel layer. The second transistor includes a second channel layer, the gate structure surrounding the second channel layer, a third source/drain epitaxial structure and a fourth source/drain epitaxial structure connected to the second channel layer. A portion of the ILD layer is sandwiched between the first and third source/drain epitaxial structures. The backside gate rail is under the ILD layer and is electrically connected to the gate structure. The portion of the ILD layer is directly above the backside gate rail.

Abstract: The disclosure describes embodiments of an apparatus including a first gas chromatograph including a fluid inlet, a fluid outlet, and a first temperature control. A controller is coupled to the first temperature control and includes logic to apply a first temperature profile to the first temperature control to heat, cool, or both heat and cool the first gas chromatograph. Other embodiments are disclosed and claimed.

Abstract: A circuit comprises a memory array, a tracking bit line and a timing control circuit. The memory array comprises a plurality of tracking cells. The tracking bit line is coupled between a first node and the plurality of tracking cells. The timing control circuit is coupled to the first node and comprises a Schmitt trigger. The Schmitt trigger generates a negative bit line enable signal in response to that a voltage level on the first node being below a low threshold voltage value of the Schmitt trigger. The timing control circuit generates a negative bit line trigger signal according to the negative bit line enable signal for adjusting voltage levels of a plurality of bit lines of the memory array.