Patents by Inventor Kuan-Cheng Chen

Kuan-Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190114992
    Abstract: An RGB format adjustment method includes: obtaining subpixel values having interleaved positions from four pixels in unadjusted RGB format; obtaining subpixel values of a first pixel in an adjusted RGB format according to the obtained subpixel values, wherein the R subpixel value of the adjusted first pixel is equal to an R subpixel value of the unadjusted first pixel, the G subpixel value of the adjusted first pixel is equal to an R subpixel value of a fourth pixel in the unadjusted RGB format, and the B subpixel value of the adjusted first pixel is equal to a B subpixel value of the unadjusted first pixel; and obtaining R subpixel values, G subpixel values and B subpixel values of a second pixel, a third pixel and the fourth pixel according to the obtained subpixel values and the obtained R, G and B subpixel values of the adjusted first pixel.
    Type: Application
    Filed: February 28, 2018
    Publication date: April 18, 2019
    Inventors: Jar-Ferr YANG, Kuan-Cheng CHEN
  • Patent number: 9698721
    Abstract: AC motor driving system and driving method thereof are provided. The driving system and method are capable of increasing power factor, adjusting waveform of the DC ripple voltage for increasing driving efficiency. The driving system is basically constructed by connecting three circuits. The first circuit is a three-phase full wave rectifying circuit and is used to transfer commercial electricity to a first DC voltage. Then, the second circuit is used to transfer the first DC voltage to a second DC voltage that ripples voltage thereof having a semi-sinusoidal waveform. The third circuit is an AC driving circuit, and receives the second AC voltage for driving the AC motor. Thereby, the driving efficiency can be increased. The capacitance used in the present disclosure has low capacitance value, thus the power factor can be increased, and usage time of the AC motor driving apparatus can also be increased.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: July 4, 2017
    Assignee: RHYMEBUS CORPORATION
    Inventors: Ming-Shi Huang, Chang-Ming Wang, Kuan-Cheng Chen, Ming-Chang Chou
  • Patent number: 9554434
    Abstract: A light-emitting diode driver includes a power switch, a logic unit and a pulse adjustment signal generator. The power switch is used to control a charging level of a light-emitting diode voltage terminal, and controlled to be turned on or off by a pulse-width modulation signal. The logic unit is coupled to a control terminal of the power switch, and used to generate a frequency control signal. The pulse adjustment signal generator is coupled to the logic unit, and used to generate an operational wave according to the frequency control signal and update the pulse-width modulation signal according to the operational wave. When the duty cycle of the pulse-width modulation signal is smaller than a pulse-width modulation threshold, the operational wave has a first frequency. When the duty cycle of the pulse-width modulation signal is larger than the pulse-width modulation threshold, the operational wave has a second frequency higher than the first frequency.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: January 24, 2017
    Assignee: AU OPTRONICS CORP.
    Inventors: Kuan-Cheng Chen, Yung-Hsu Lin
  • Publication number: 20160294316
    Abstract: AC motor driving system and driving method thereof are provided. The driving system and method are capable of increasing power factor, adjusting waveform of the DC ripple voltage for increasing driving efficiency. The driving system is basically constructed by connecting three circuits. The first circuit is a three-phase full wave rectifying circuit and is used to transfer commercial electricity to a first DC voltage. Then, the second circuit is used to transfer the first DC voltage to a second DC voltage that ripples voltage thereof having a semi-sinusoidal waveform. The third circuit is an AC driving circuit, and receives the second AC voltage for driving the AC motor. Thereby, the driving efficiency can be increased. The capacitance used in the present disclosure has low capacitance value, thus the power factor can be increased, and usage time of the AC motor driving apparatus can also be increased.
    Type: Application
    Filed: October 8, 2015
    Publication date: October 6, 2016
    Inventors: Ming-Shi HUANG, Chang-Ming WANG, Kuan-Cheng CHEN, Ming-Chang CHOU
  • Publication number: 20160219663
    Abstract: A light-emitting diode driver includes a power switch, a logic unit and a pulse adjustment signal generator. The power switch is used to control a charging level of a light-emitting diode voltage terminal, and controlled to be turned on or off by a pulse-width modulation signal. The logic unit is coupled to a control terminal of the power switch, and used to generate a frequency control signal. The pulse adjustment signal generator is coupled to the logic unit, and used to generate an operational wave according to the frequency control signal and update the pulse-width modulation signal according to the operational wave. When the duty cycle of the pulse-width modulation signal is smaller than a pulse-width modulation threshold, the operational wave has a first frequency. When the duty cycle of the pulse-width modulation signal is larger than the pulse-width modulation threshold, the operational wave has a second frequency higher than the first frequency.
    Type: Application
    Filed: October 5, 2015
    Publication date: July 28, 2016
    Inventors: Kuan-Cheng Chen, Yung-Hsu Lin
  • Patent number: 6531762
    Abstract: A semiconductor package is proposed, in which a substrate is formed with a chip bonding area and a plurality of bond fingers surrounding the chip bonding area, and a plurality of bridging elements are disposed in a stagger manner between the chip bonding area and the bond fingers on the substrate. Multiple wire bonding processes are performed to bond first gold wires between the chip and the bridging elements, and bond second gold wires between the bridging elements and the bond fingers. This therefore significantly shortens a wire bonding distance as compared with only one time of wire bonding for electrically connecting the chip to the substrate. As a result, wire bond operability is improved, and the shortened wire bonding distance reduces wire length so as to enhance resistance of the gold wires to mold flow impact during molding, thereby preventing wire sweeping or wire sagging from occurrence.
    Type: Grant
    Filed: November 14, 2001
    Date of Patent: March 11, 2003
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Chin Liao, Kuan-Cheng Chen