Abstract: A method for fabricating isolation device is disclosed. The method includes the steps of: providing a substrate; forming a shallow trench isolation (STI) in the substrate, the STI includes a first STI and a second STI, and the first STI surrounds a first device region and the second STI surrounds a second device region; forming a first doped region between and contact the first STI and the second STI; and forming a first gate structure on the first doped region, the first STI and the second STI.

Abstract: A bonding chuck is discussed with methods of using the bonding chuck and tools including the bonding chuck. A method includes loading a first wafer on first surface of a first bonding chuck, loading a second wafer on a second bonding chuck, and bonding the first wafer to the second wafer. The first surface is defined at least in part by a first portion of a first spherical surface and a second portion of a second spherical surface. The first spherical surface has a first radius, and the second spherical surface has a second radius. The first radius is less than the second radius.

Abstract: A method for fabricating isolation device is disclosed. The method includes the steps of: providing a substrate; forming a shallow trench isolation (STI) in the substrate, the STI includes a first STI and a second STI, and the first STI surrounds a first device region and the second STI surrounds a second device region; forming a first doped region between and contact the first STI and the second STI; and forming a first gate structure on the first doped region, the first STI and the second STI.

Abstract: A bonding chuck is discussed with methods of using the bonding chuck and tools including the bonding chuck. A method includes loading a first wafer on first surface of a first bonding chuck, loading a second wafer on a second bonding chuck, and bonding the first wafer to the second wafer. The first surface is defined at least in part by a first portion of a first spherical surface and a second portion of a second spherical surface. The first spherical surface has a first radius, and the second spherical surface has a second radius. The first radius is less than the second radius.

Abstract: A bonding chuck is discussed with methods of using the bonding chuck and tools including the bonding chuck. A method includes loading a first wafer on first surface of a first bonding chuck, loading a second wafer on a second bonding chuck, and bonding the first wafer to the second wafer. The first surface is defined at least in part by a first portion of a first spherical surface and a second portion of a second spherical surface. The first spherical surface has a first radius, and the second spherical surface has a second radius. The first radius is less than the second radius.

Abstract: An acoustic camera comprises a first sound pick-up device, a second sound pick-up device, and a switch. The switch is respectively connected to the first sound pick-up device and the second pick-up device and used to select the first sound pick-up device or the second sound pick-up device to reconstruct the sound field of the sound source of a detected object. The first sound pick-up device has a first microphone array, and the first microphone array is a near-field uniform microphone array. The second sound pick-up device has a second microphone array, and the second microphone array is a far-field non-uniform microphone array.

Abstract: An acoustic camera comprises a first sound pick-up device, a second sound pick-up device, and a switch. The switch is respectively connected to the first sound pick-up device and the second pick-up device and used to select the first sound pick-up device or the second sound pick-up device to reconstruct the sound field of the sound source of a detected object. The first sound pick-up device has a first microphone array, and the first microphone array is a near-field uniform microphone array. The second sound pick-up device has a second microphone array, and the second microphone array is a far-field non-uniform microphone array.