Patents by Inventor Kuan-Ting Wu

Kuan-Ting Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRIVACY FILMS FOR ELECTRONIC DISPLAYS
    Publication number: 20210208450
    Abstract: The present disclosure is drawn to privacy films for electronic displays. In one example, a privacy film for an electronic display can include a first transparent electrode layer, a second transparent electrode layer, and a light-directing layer positioned between the first transparent electrode layer and the second transparent electrode layer. The light-directing layer can include multiple light-blocking barriers spaced apart across the light-directing layer as well as polymer-dispersed liquid crystal occupying spaces between the multiple light-blocking barriers.
    Type: Application
    Filed: September 18, 2018
    Publication date: July 8, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Hsing-Hung Hsieh, Super Liao
  • MAGNESIUM ALLOY LAYERED COMPOSITES FOR ELECTRONIC DEVICES
    Publication number: 20210207272
    Abstract: A magnesium alloy layered composite for an electronic device can include a magnesium alloy substrate, a passivation layer positioned on the magnesium alloy substrate, and a sol-gel layer positioned on the passivation layer. The passivation layer can include a molybdate, a vanadate, a phosphate, a chromate, a stannate, or a manganese salt. The sol-gel layer can include a silicate, a silane, a siloxane, or a metal C1-C5 alkoxide.
    Type: Application
    Filed: September 25, 2018
    Publication date: July 8, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Chalam Kashyap
  • FOLDABLE HINGE FOR ELECTRONIC DEVICES
    Publication number: 20210207648
    Abstract: A foldable hinge is described herein that includes a plurality of interconnected sliding links, wherein each of the interconnected sliding links comprise at least one curved extruding prong and at least one curved rail. The at least one curved rail of a first interconnected sliding link can be coupled to the at least one curved extruding prong of a second interconnected sliding link to form a torque engine. Additionally, the interconnected sliding links can be rotatable based on a pressure applied to the interconnected sliding links. The foldable hinge can also include a plurality of shafts coupled to the plurality of interconnected sliding links, wherein each shaft is coupled to a separate interconnected sliding link.
    Type: Application
    Filed: April 20, 2017
    Publication date: July 8, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wei-Chung CHEN, Kuan-Ting WU, Chi-Hao CHANG
  • INSULATIVE LAYERS
    Publication number: 20210199150
    Abstract: A thermally resistant coupling device coupled to an electronic device may include a screw to threadingly engage with a boss hole formed in the electronic device and an elastic insulative layer encapsulating a portion of the screw. An electronic device may include a screw hole, an elastic insulative layer placed within the screw hole, and a screw to threadingly engage with the screw hole and elastic insulative layer.
    Type: Application
    Filed: August 10, 2018
    Publication date: July 1, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chien Tu Cheng, Al-Tsung LI, Sung Hsueh Tsai, Jamil Abdul Wakil
  • Composite material
    Patent number: 11046058
    Abstract: Examples of the present disclosure present a composite material. In an example, the composite material may comprise: a carbon fiber composite and a surface treatment layer. The carbon fiber composite may comprise a core layer having a first side and a second side opposite to the first side, and a first set of two carbon fiber layers disposed over at least a portion of the core layer respectively on the first side and the second side. Each of the first set of the two carbon fiber layers may comprise carbon fibers aligned in a first direction in a plane. The surface treatment layer may be disposed on the carbon fiber composite.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: June 29, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Cheng-Feng Liao, Wei-Chung Chen, Chung-Hua Ku
  • ETCHED GLASS SURFACES WITH HYDROPHOBIC ALKOXYORGANOSILANES
    Publication number: 20210188702
    Abstract: The present disclosure relates to an electronic display that can include a glass panel, an optically clear adhesive, and a backlight unit. The glass panel can have a glass surface that can be etched and can include a hydrophobic alkoxyorganosilane having a C10 to C18 alkyl chain covalently attached thereto. The optically clear adhesive can adhere the glass panel to the backlight unit.
    Type: Application
    Filed: September 14, 2018
    Publication date: June 24, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Hang Yan Yuen, Hui He
  • ENERGY DAMPENERS FOR ELECTRONIC DEVICES
    Publication number: 20210190166
    Abstract: An energy dampener for use in an electronic device can include a carbon nanotube-aerogel matrix, including carbon nanotubes embedded in an aerogel and a rubber composited with the carbon nanotube-aerogel matrix.
    Type: Application
    Filed: September 4, 2018
    Publication date: June 24, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chung-Hua Ku, Chi Hao Chang
  • ELECTRONIC DEVICES WITH EMI PROTECTION FILMS
    Publication number: 20210195814
    Abstract: The present disclosure is drawn to an electronic device including a substrate, an electronic component carried by the substrate, an EMI protection film over-molded on the electronic component, and an adhesive layer directly adhering the EMI protection film to the electronic component. The EMI protection film includes a ferromagnetic material.
    Type: Application
    Filed: September 14, 2018
    Publication date: June 24, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Shih-Huang Wu, Kuan-Ting Wu
  • AXIS SHIFTING HINGE ASSEMBLIES
    Publication number: 20210173448
    Abstract: In one example, a hinge assembly is disclosed, which may include a first member and a second member rotatably connected to the first member through a mounting portion. The mounting portion may include a first surface having a first protrusion and a second surface, opposite the first surface, having a second protrusion. Further, the hinge assembly may include a first cam fixed to the first member and disposed adjacent to the first surface and a second cam fixed to the first member and disposed adjacent to the second surface. The first cam and second cam being engageable with the first protrusion and the second protrusion, respectively, to shift an axis of rotation of the second member.
    Type: Application
    Filed: February 6, 2017
    Publication date: June 10, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wei-Chung CHEN, Kuan-Ting WU, Kun-Hung LIN
  • VARIABLE TORQUE BARS
    Publication number: 20210173436
    Abstract: Examples herein relate to an apparatus. In some examples, an apparatus can include a first bracket connected to a first shaft, a second bracket connected to the first bracket, a variable torque bar connected to the first bracket and to a second shaft. The variable torque bar includes a plurality of notches to engage a tensioner mechanism and alter an amount of torque applied to the first shaft when the tensioner mechanism engages the respective notches of the plurality of notches.
    Type: Application
    Filed: November 30, 2017
    Publication date: June 10, 2021
    Inventors: Wei-Chung CHEN, Kuan-Ting WU, Kun-Hung LIN
  • Thermal interface materials with adhesive selant for electronic components
    Patent number: 11031319
    Abstract: In one example, an apparatus is described, which includes an electronic component, a thermal dissipation unit, a thermal interface material disposed between the electronic component and the thermal dissipation unit, and an adhesive sealant applied around the thermal interface material between the electronic component and the thermal dissipation unit.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: June 8, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, David A Pipho, Kevin Voss
  • GRIDS FOR LED DISPLAYS
    Publication number: 20210168349
    Abstract: In example implementations, an apparatus is provided. The apparatus includes a movable light emitting diode (LED) base. A plurality of LED arrays is coupled to the movable LED base. The apparatus includes a grid that includes a plurality of walls. The grid is positioned such that each LED array of the plurality of LED arrays is adjacent to a wall of the plurality of walls.
    Type: Application
    Filed: December 6, 2017
    Publication date: June 3, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Kuan-Ting Wu, Wei-Chung Chen, Hsing-Hung Hsieh
  • TREATING ANODIZED ALLOY SUBSTRATES
    Publication number: 20210164122
    Abstract: The present subject matter relates to treating anodized alloy substrates. An anodized alloy substrate is immersed in a titanium salt solution to deposit titanium ions in a surface of the anodized alloy substrate. The immersion results in the formation of a processed substrate. The processed substrate is anodized to form a finished substrate. The anodization oxidizes the titanium ions to titanium dioxide particles.
    Type: Application
    Filed: April 25, 2017
    Publication date: June 3, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chalam Kashyap, Yin-Yin Yang
  • ELECTRONIC DEVICES WITH MOVABLE AIR FLOW DEVICES
    Publication number: 20210165471
    Abstract: In one example, an electronic device is described, which may include an enclosure having at least two openings, and at least two air flow devices disposed in the enclosure and corresponding to the at least two openings. The at least two air flow devices may be movable between a retracted position and an extended position. The at least two air flow devices can be within the enclosure in the retracted position and can be at least partially outside the enclosure through the at least two openings in the extended position.
    Type: Application
    Filed: December 6, 2017
    Publication date: June 3, 2021
    Inventors: WEI-CHUNG CHEN, KUAN-TING WU
  • ANTENNA WINDOWS IN CARBON FIBER ENCLOSURES
    Publication number: 20210143524
    Abstract: In example implementations, an enclosure is provided. The enclosure includes a first layer of carbon fiber and a second layer of a carbon fiber pattern fabricated from a plastic. The first layer of carbon fiber is formed in a shape of a portable electronic device. An antenna window is formed in the first layer of the carbon fiber. The second layer of the carbon fiber pattern has a same shape and a same size as the first layer of carbon fiber.
    Type: Application
    Filed: April 24, 2018
    Publication date: May 13, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Ting Lin, Chi Hao Chang, Kuan-Ting Wu
  • MULTILAYER HOUSINGS
    Publication number: 20210136938
    Abstract: Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.
    Type: Application
    Filed: October 3, 2016
    Publication date: May 6, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Kuan-Ting WU, Kevin VOSS, AI-Tsung LI, Wei Kuang CHU, Wei-Chung CHEN
  • TREATING ALLOY SUBSTRATES HAVING OXIDIZED LAYERS
    Publication number: 20210130975
    Abstract: The present subject matter relates to treating alloy substrates having oxidized layers. An anodized alloy substrate is contacted with an alkaline mixture including titanium to form a processed substrate. The anodized alloy substrate includes an oxidized layer on its surface. The processed substrate is baked to form a finished substrate. The finished substrate includes titanium dioxide particles in the oxidized layer.
    Type: Application
    Filed: April 13, 2017
    Publication date: May 6, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chalam Kashyap
  • COVER FOR DEVICES
    Publication number: 20210121952
    Abstract: In an example, a device cover may comprise a substrate and a metal luster layer having a lustrous paint formulation applied to an outer surface of the substrate. The lustrous paint formulation may comprise base particles with surfaces partially coated with metal nanoparticles. The metal nanoparticles may be disposed in a non-continuous manner on the base particles.
    Type: Application
    Filed: June 6, 2017
    Publication date: April 29, 2021
    Inventors: CHI HAO CHANG, KUAN-TING WU, KUO CHIH HUANG, CHUNG HUA KU
  • ELECTRONIC DEVICE(S)
    Publication number: 20210126308
    Abstract: Electronic devices comprising a polymeric material at least partially enclosed by an anodized metal are disclosed herein. The polymeric material can comprise a polymer composite, a carbon fiber composite, or mixtures thereof. The anodized metal can be selected from the group consisting of anodized aluminum, anodized aluminum alloy, anodized titanium, anodized titanium alloy, anodized zinc, anodized zinc alloy, anodized magnesium, anodized magnesium alloy, anodized niobium, anodized niobium alloy, anodized zirconium, anodized zirconium alloy, anodized hafnium, anodized hafnium alloy, anodized tantalum, anodized tantalum alloy, and combinations thereof.
    Type: Application
    Filed: June 20, 2017
    Publication date: April 29, 2021
    Inventors: KUAN-TING WU, CHENG-FENG LIAO, CHI HAO CHANG
  • Touchpad assembly for electronic devices
    Patent number: 10990203
    Abstract: In one example, touchpad assembly is disclosed, which may include a bottom cover, a horizontal elastic member flexibly positioned on the bottom cover, a balancing bar disposed on the bottom cover and substantially parallel to the horizontal elastic member, and a metal dome. The metal dome may include a first end fixedly connected to the bottom cover via a first fixture, and a second end to hold the horizontal elastic member and the balancing bar such that the balancing bar is flexibly engaged with the bottom cover. The balancing bar, the metal dome, and the horizontal elastic member may control a flexure of a touchpad when the touchpad is pressed.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: April 27, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hung-Ming Chen, Chao-Wen Cheng, Kuan-Ting Wu