Abstract: The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, a cover for an electronic device comprising: a metal cover substrate having at least a top surface and a bottom surface; a transparent passivation layer on the top surface of the metal cover substrate; a water-borne graphene coating layer on the transparent passivation layer; and an electrophoretic deposition coating layer on the water-borne graphene coating layer.

Abstract: A coated metal alloy substrate, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises a passivation layer deposited on the metal alloy substrate, a porous conductive water borne carbon nanotube layer on the passivation layer, and an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer.

Abstract: An image-capture device is positioned behind a display device. A hardware display controller interleaves image frames and black frames for display on the display device. A hardware timing controller synchronizes image capture by the image-capture device with display of the black frames so that the image capture occurs a specified delay after the display device has started displaying each black frame.

Abstract: The present disclosure is drawn to thin-film transistors, electronic displays that include thin-film transistors, and methods of making thin-film transistors. In one example, a thin-film transistor can include a nonconductive substrate, a semiconductor layer on the nonconductive substrate, a source electrode adjacent a first side of the semiconductor layer and partially overlapping a first peripheral portion of the semiconductor layer, a drain electrode adjacent a second side of the semiconductor layer and partially overlapping a second peripheral portion of the semiconductor layer, an etch stop layer on the semiconductor layer, a gat insulator layer on the etch stop layer, and a gate electrode on the gate insulator layer. The source electrode and the drain electrode do not overlap the etch stop layer.

Abstract: Examples described herein relate to flexible antenna belts. For instance, a system may comprise a flexible antenna belt, where the flexible antenna belt is to transition between a closed position and an open position, and a flexible display coupled to the flexible antenna belt.

Abstract: In example implementations, a display is provided. The display includes a piezo electric layer coupled to a power source, a plurality of light emitting diodes arranged on the piezo electric layer, an aperture layer, a thin film transistor layer, a liquid crystal layer formed over the thin film transistor layer, and a color filter layer. The aperture layer is located above the plurality of light emitting diodes such that light emitted from the plurality of light emitting diodes travels through respective apertures in the aperture layer. The color filter layer is formed over the liquid crystal layer to control a color of the light emitted from the plurality of light emitting diodes.

Abstract: A lighting system may include a light guide to receive light from a light source; and a reflector plate including a frustrum structure formed on the surface of the reflector plate to receive refracted light from the light guide.

Abstract: The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.

Abstract: In example implementations, a housing is provided. The housing includes a display housing portion, an input housing portion, and an energy absorbing material that is inserted along an edge of the input housing portion. The input housing portion is movably coupled to the display portion. A top surface of the energy absorbing material lies on a same plane as a top surface of the input housing portion.

Abstract: Semiconductor materials can include from about 11 at % to about 50 at % of a carrier mobility contributor selected from a period 6 metal or a period 5 metal, wherein the period 6 metal is lead and the period 5 metal is indium, tin, cadmium, or a combination thereof, and wherein the carrier mobility contributor is not a combination of the period 6 metal and the period 5 metal; from about 0.6 at % to about 25 at % of an amorphous phase stabilizer, wherein the amorphous phase stabilizer is selected from indium, tin, cadmium, zinc, gallium, or a combination thereof when the carrier mobility contributor is the period 6 metal, or the amorphous phase stabilizer is selected from zinc, gallium, or a combination thereof when the carrier mobility contributor is the period 5 metal; from about 0.3 at % to about 18 at % of a semiconductivity controller including an element having a standard electrode potential from about ?0.8 to about ?3.05; and from about 45 at % to about 67 at % oxygen.

Abstract: A panel for a touch screen of an electronic device is described. The panel comprises a substrate having a central area for operating the touch screen and a border area at an edge of the central area. The border area comprises a decorative image on the substrate and an outer surface coating overlying the decorative image. The decorative image comprises a non-conductive metallic coating. The outer surface coating comprises a non-conductive, printed layer. A method for manufacturing the panel and an electronic device comprising a touch screen having the panel are also described.

Abstract: Examples include an apparatus comprising a laptop housing, an elastomer layer fixed on a surface of the laptop housing, and a fabric layer fixed on the elastomer layer.

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.

Abstract: An example display device includes a display panel to display an image; a backlight unit to provide light to the display panel, the backlight unit including a light emitting unit to emit the light; a light guide plate to transmit the light emitted from the light emitting unit; a pair of electrodes adjacent to the light guide plate; and a polymer layer including liquid crystal molecules within the light guide plate. The liquid crystal molecules are to change orientation upon being introduced to an electric field created by the pair of electrodes to change an opacity of the light guide plate. The display device includes at least one film to collimate and direct light from the backlight unit to the display panel; and a processor to switch voltage being applied on/off to the pair of electrodes.

Abstract: Examples of slot antennas are described herein. In an example, the slot antenna includes a substrate and an antenna element disposed on the substrate to transmit and receive signals. The substrate is porous.

Abstract: Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.

Abstract: In one example, an electronic device is described, which may include an enclosure having at least two openings, and at least two air flow devices disposed in the enclosure and corresponding to the at least two openings. The at least two air flow devices may be movable between a retracted position and an extended position. The at least two air flow devices can be within the enclosure in the retracted position and can be at least partially outside the enclosure through the at least two openings in the extended position.

Abstract: In one example, a dual-axis hinge assembly for an electronic device is disclosed, which may include a casing defining a pair of slots and an elastic member disposed in the casing. The elastic member may include mounting features at opposite ends. The dual-axis hinge assembly may include a pair of shafts received through a respective one of the mounting features and the slots, and engaged with display housing and a main housing of the electronic device to pivotably connect the display housing to the man housing. The elastic member may enable at least one of the shafts to slide along the slots to variably adjust a distance between a pivot axis of the display housing and a pivot axis of the main housing.

Abstract: In one example, a display is described, which may include a plurality of spaced light emitting device packages, a privacy gate having partition walls to partition each of the plurality of spaced light emitting device packages, and a control unit to selectively move the partition walls up or down relative to the plurality of spaced light emitting device packages to control a viewing angle of the display.

Abstract: The present disclosure is drawn to covers for electronic devices, coating sets for covers of electronic devices, and methods for making these covers. In one example, described herein is a cover for an electronic device comprising: a substrate; an adhesive layer on a surface of the substrate; a first thermally conductive layer on the adhesive layer; a first oxide layer on the first thermally conductive layer; an aluminum foil layer on the first oxide layer; a second oxide layer on the aluminum foil layer; and a second thermally conductive layer on the second oxide layer.