Patents by Inventor KUAN WEI

KUAN WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240265643
    Abstract: A method, an electronic device, and a non-transitory computer readable storage medium of visual assistance for a user in an extended reality environment are provided. The method includes: outputting an extended reality scene including a first virtual object and an interactive object; detecting the user; calculating a first distance between the interactive object and the user; and disabling the first virtual object in the extended reality scene in response to the first distance being greater than a first threshold.
    Type: Application
    Filed: February 7, 2023
    Publication date: August 8, 2024
    Applicant: HTC Corporation
    Inventor: Kuan-Wei Li
  • Publication number: 20240257104
    Abstract: A non-fungible token generating system, method, and non-transitory computer readable storage medium thereof are provided. The system determines whether a control signal corresponds to a non-fungible token generating operation or a multimedia data generating operation. In response to the control signal corresponding to the non-fungible token generating operation, the system generates a first multimedia data through an image capturing device, and the system uploads the first multimedia data and an operator identity information to a blockchain to generate a non-fungible token corresponding to the first multimedia data based on a smart contract deployed on the blockchain. In response to the control signal corresponding to the multimedia data generating operation, the system generates a second multimedia data through the image capturing device.
    Type: Application
    Filed: February 1, 2023
    Publication date: August 1, 2024
    Inventor: Kuan-Wei LI
  • Publication number: 20240258121
    Abstract: An electronic structure is provided, in which a plurality of conductors are disposed on one surface of an electronic body, an epoxy molding compound is used as a protective layer to encapsulate the plurality of conductors, a circuit portion is bonded onto the other surface of the electronic body, and a plurality of external bumps and solder material are formed on the circuit portion. Therefore, with the design of the protective layer, heat energy can be effectively transferred from the protective layer to the solder material below during a process of heating the electronic structure so as to avoid a problem of non-wetting of the solder material.
    Type: Application
    Filed: May 1, 2023
    Publication date: August 1, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yi-Ling CHEN, Kuan-Wei CHUANG
  • Patent number: 12051755
    Abstract: Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first terminal coupled to a substrate of the semiconductor structure, with the first terminal including a first portion of a tunneling layer formed on the substrate, and a first gate formed on the first portion of the tunneling layer. The semiconductor structure includes a second terminal coupled to the substrate and adjacent to the first terminal, with the second terminal including a second portion of the tunneling layer formed on the substrate, a second gate formed on the second portion of the tunneling layer, and a dielectric structure formed on a top surface and side surfaces of the second gate. The semiconductor structure includes a third terminal coupled to an insulating structure and adjacent to the second terminal, with the third terminal including, a third gate formed on the insulating structure.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: July 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chu Lin, Wen-Chih Chiang, Chi-Chung Jen, Ming-Hong Su, Mei-Chen Su, Chia-Wei Lee, Kuan-Wei Su, Chia-Ming Pan
  • Patent number: 12043568
    Abstract: A process for making anti-reflective optical glass comprises the steps of: A. implementing an abrading tool including a carrier having a plurality of diamond cutting wires formed on the carrier; and B. centrifugally and resiliently abrading a substrate of optical glass by the abrading tool to form a plurality of microscopic protuberances or moth-eye like structures on the substrate to thereby reduce the light reflection from the substrate and increase the light transmission in the substrate.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: July 23, 2024
    Assignee: TACHI METAL MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Kuan-Wei Chen, Jason Shian-Ching Jang
  • Patent number: 12046506
    Abstract: In one example aspect, the present disclosure is directed to a method. The method includes receiving a workpiece having a conductive feature over a semiconductor substrate, forming a sacrificial material layer over the conductive feature, removing first portions of the sacrificial material layer to form line trenches and to expose a top surface of the conductive feature in one of the line trenches; forming line features in the line trenches, removing second portions of the sacrificial material layer to form gaps between the line features, and forming dielectric features in the gaps, the dielectric features enclosing an air gap.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: July 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Hsin Chan, Cai-Ling Wu, Chang-Wen Chen, Po-Hsiang Huang, Yu-Yu Chen, Kuan-Wei Huang, Jr-Hung Li, Jay Chiu, Ting-Kui Chang
  • Publication number: 20240238166
    Abstract: A tricalcium silicate kit includes a first reagent containing tricalcium silicate, and a second reagent containing a salt material and water. The salt material is selected from the group consisting of sodium carbonate, calcium chloride, and a combination thereof. A method for preparing a Portland cement-based dental material using the tricalcium silicate kit is also provided.
    Type: Application
    Filed: January 16, 2024
    Publication date: July 18, 2024
    Inventors: Yung-Ming YANG, Kuan-Wei LU, Chih-Chung HUANG, Wei-Ling GAO, Yen-Tzu Lin, An-Cheng SUN
  • Patent number: 12038379
    Abstract: A sanitary device for the urine glucose test includes a urine container formed on an inner wall of a main body, and a measuring module with an inner space mounted at a bottom of the urine container. Within the inner space, a lens attaches to the bottom of the urine container, a rail faces a bottom surface of the lens, and a driving module moves a light unit shooting a detection beam to a measuring surface of the lens along the rail. The measuring surface contacts urine in the urine container, and reflects the detection beam out of the bottom surface into a sensor. The sensor is electrically connected to a processor. The processor determines a urine glucose level and generates a urine glucose level data instantly from an angle of incidence of the detection beam on the measuring surface and from a beam intensity signal from the sensor.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: July 16, 2024
    Assignee: Taiwan RedEye Biomedical Inc.
    Inventors: Shuo-Ting Yan, Tsung-Jui Lin, Yu-Hsun Chen, Kuan-Wei Su
  • Publication number: 20240226861
    Abstract: The invention discloses a molecular sieve SCR catalyst and a preparation method, the preparation method comprising the steps of: (1) heating deionized water to 60-90° C., and adding a soluble copper salt and an additive to stir and dissolve the same to prepare a copper solution; (2) heating the deionized water to 20-90° ° C., adding a soluble yttrium salt to dissolve the same, and when maintaining the temperature, adding a molecular sieve with a silicon-aluminum ratio of ?24 and stirring the same; when maintaining the temperature, adding a copper solution and stirring to perform ion exchange; (3) cooling the solution after the ion exchange in step (2), adding an adhesive, stirring and ball-milling the mixture, and standing to obtain a slurry; (4) coating the slurry onto a support, drying and then calcining to obtain a molecular sieve SCR catalyst.
    Type: Application
    Filed: May 26, 2022
    Publication date: July 11, 2024
    Inventors: Xi FENG, Zhimin LIU, Rui SUN, Yun WANG, Yanhua ZHANG, Ruifang WANG, Kuan WEI, Haikun CHEN, Yineng LAI, Yaoqiang CHEN, Yun LI, Qizhang CHEN
  • Publication number: 20240222968
    Abstract: A multi-power supply system and a multi-power supply method are provided. The multi-power supply system includes power suppliers and a controller. The controller receives an information of a system power, increases a number of at least one output power supplier of the power suppliers according to a rise of the system power, and decreases the number of the at least one output power supplier of the power suppliers according to a drop of the system power. Each of the at least one output power supplier generates a first power and provides a supplying power with a preset power value according to the first power. At least one of the power suppliers other than the output power supplier as a non-output power supplier generates a second power and stops providing the supplying power according to the second power.
    Type: Application
    Filed: April 5, 2023
    Publication date: July 4, 2024
    Applicant: Wistron Corporation
    Inventor: Kuan-Wei Hsu
  • Publication number: 20240204433
    Abstract: A modular riser card, an electronic device having a modular riser card, and a method of determining a type of modular riser card pin connection are disclosed. The modular riser card includes a circuit board and a removable connector assembly. The circuit board includes a first receptacle having a plurality of first pins. The removable connector assembly includes a connector body defining a second receptacle having a plurality of second pins, and an opening formed in the connector body adjacent to the second receptacle. The connector body is mounted on the circuit board such that the first receptacle protrudes through the opening and is aligned with the second receptacle. The first and second receptacles form a riser card connector that is configured to removably receive an expansion card of an electronic device.
    Type: Application
    Filed: December 14, 2022
    Publication date: June 20, 2024
    Inventors: Kuan-Wei Chen, Vincent Nguyen, Ku-Hsu Nien, Jui Lin Chen, Hsueh Yu Chao
  • Patent number: 12002710
    Abstract: A semiconductor structure and method of forming the same are provided. The method includes: forming a plurality of mandrel patterns over a dielectric layer; forming a first spacer and a second spacer on sidewalls of the plurality of mandrel patterns, wherein a first width of the first spacer is larger than a second width of the second spacer; removing the plurality of mandrel patterns; patterning the dielectric layer using the first spacer and the second spacer as a patterning mask; and forming conductive lines laterally aside the dielectric layer.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: June 4, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Hsin Chan, Jiing-Feng Yang, Kuan-Wei Huang, Meng-Shu Lin, Yu-Yu Chen, Chia-Wei Wu, Chang-Wen Chen, Wei-Hao Lin, Ching-Yu Chang
  • Publication number: 20240139940
    Abstract: An apparatus for handling microelectronic devices comprises a pick arm having a pick surface configured for receiving a microelectronic device thereon, drives for moving the pick arm and reorienting the pick surface in the X, Y and Z planes and about a horizontal rotational axis and a vertical rotational axis, and a sensor device carried by the pick arm and configured to detect at least one of at least one magnitude of force and at least one location of force applied between the pick surface and a structure contacted by the pick surface or a structure and a microelectronic device carried on the pick surface.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Kuan Wei Tseng, Brandon P. Wirz
  • Patent number: 11927752
    Abstract: A control method for an immersive system includes following steps. A communication is established between a mobile device and a head-mounted display device. Pose data of the mobile device is captured. A touch event is detected by a touch screen on the mobile device. An interface layout is defined on the touch screen, and the interface layout includes a plurality of functional regions. A target function is selected from candidate functions by mapping a position of the touch event with one of the functional regions in the interface layout. The target function is executed and an immersive content displayed by the head-mounted display device is rendered according to the target function and the pose data.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: March 12, 2024
    Assignee: HTC Corporation
    Inventors: Yi-Hsin Chang, Kuan-Wei Li
  • Patent number: 11911904
    Abstract: An apparatus for handling microelectronic devices comprises a pick arm having a pick surface configured for receiving a microelectronic device thereon, drives for moving the pick arm and reorienting the pick surface in the X, Y and Z planes and about a horizontal rotational axis and a vertical rotational axis, and a sensor device carried by the pick arm and configured to detect at least one of at least one magnitude of force and at least one location of force applied between the pick surface and a structure contacted by the pick surface or a structure and a microelectronic device carried on the pick surface.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: February 27, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Kuan Wei Tseng, Brandon P. Wirz
  • Publication number: 20240064919
    Abstract: One aspect of the instant application describes a system that includes a plurality of stacked mezzanine boards communicatively coupled to a motherboard and a metal enclosure enclosing the motherboard and mezzanine boards. A respective mezzanine board can include a number of solder pads, and the metal enclosure can include a plurality of metal strips, a respective metal strip to make contact with a solder pad of a corresponding mezzanine board. The system can further include a logic module positioned on the respective mezzanine board to determine a location of the respective mezzanine board based on a contact pattern between the metal strips and solder pads of the respective mezzanine board.
    Type: Application
    Filed: August 16, 2022
    Publication date: February 22, 2024
    Inventors: Vincent Nguyen, Minh H. Nguyen, Kuan-Wei Chen
  • Publication number: 20240055323
    Abstract: A semiconductor device assembly including a through-silicon via (TSV) having an end region protruding from a back side of the substrate, the end region being surrounded by a conductive annulus disposed over the back side of the substrate; a dielectric layer disposed over the back side of the substrate, the dielectric layer having an upper surface flush with an upper surface of the end region of the TSV and flush with an upper surface of the conductive annulus; and a bond pad disposed over and electrically coupled to the end region of the TSV and the conductive annulus.
    Type: Application
    Filed: August 9, 2022
    Publication date: February 15, 2024
    Inventors: Ren Yuan Huang, Kuan Wei Tseng, Te Pao, Koji Torii
  • Patent number: 11892409
    Abstract: The present invention includes a shell, a light emitter, a beam splitter, a convergent lens, an optical filter, a collimation unit, a discrete light detection unit, and a processing unit. The shell includes a sample well to contain a sample. The light emitter generates a detection beam towards the beam splitter, the detection beam is reflected by the beam splitter before being converged by the convergent lens onto the sample, and a Raman scattered beam is scattered from the sample. The Raman scattered beam respectively passes through the convergent lens, the beam splitter, the optical filter, and the collimation unit, allowing the collimation unit to collimate the Raman scattered beam into a collimated beam. The discrete light detection unit generates multiple light intensity signals according to the collimated beam received, and the processing unit generates a detection result according to the light intensity signals to help detect toxins.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: February 6, 2024
    Assignee: Taiwan RedEye Biomedical Inc.
    Inventors: Tsung-Jui Lin, Shuo-Ting Yan, Kuan-Wei Su
  • Publication number: 20240021468
    Abstract: In one example aspect, the present disclosure is directed to a method. The method includes receiving a workpiece having a conductive feature over a semiconductor substrate, forming a sacrificial material layer over the conductive feature, removing first portions of the sacrificial material layer to form line trenches and to expose a top surface of the conductive feature in one of the line trenches; forming line features in the line trenches, removing second portions of the sacrificial material layer to form gaps between the line features, and forming dielectric features in the gaps, the dielectric features enclosing an air gap.
    Type: Application
    Filed: August 8, 2023
    Publication date: January 18, 2024
    Inventors: Yu-Hsin Chan, Cai-Ling Wu, Chang-Wen Chen, Po-Hsiang Huang, Yu-Yu Chen, Kuan-Wei Huang, Jr-Hung Li, Jay Chiu, Ting-Kui Chang
  • Patent number: 11859038
    Abstract: A block copolymer of polyamide acid includes a first polyamide acid and a second polyamide acid alternately connected. The first polyamide acid is made by first dianhydride monomers and second diamine monomers. The second polyamide acid is made by second dianhydride monomers and first diamine monomers. Each first dianhydride monomer is or comprises a liquid crystal structure. Each second dianhydride monomer and each second diamine monomer respectively include a first flexible structure. Each first diamine monomer includes a liquid crystal structure. Each liquid crystal structure includes a cyclic group selected from a chemical structural formula of and intermediate groups selected from a chemical structural formula of Each flexible structure includes a group selected from a group consist of ether bond, ketone group, sulphone group, aliphatic hydrocarbon group, and any combination thereof.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: January 2, 2024
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Kuan-Wei Lee, Szu-Hsiang Su, Shou-Jui Hsiang, Pei-Jung Wu, Wei-Hsin Huang