Patents by Inventor Kuan Yang
Kuan Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250096841Abstract: This application is applied to an ultra-wideband (UWB)-based wireless personal area network system, including 802.15 series protocols, for example, the 802.15.4a protocol, the 802.15.4z protocol, or the 802.15.4ab protocol; a wireless local area network system that can support 802.11 series protocols such as a next-generation Wi-Fi protocol of IEEE 802.11ax, for example, 802.11be, Wi-Fi 7, or EHT, and for another example, a next generation protocol of 802.11be, and Wi-Fi 8; a sensing system; or the like. This application provides a signaling transmission method, including receiving a UWB test signal, determining indication information of a number of fragment signals of a UWB measurement signal based on the UWB test signal, and sending the indication information. The number of fragment signals of the UWB measurement signal is determined based on the UWB test signal. This reduces a probability of incorrectly configuring the number of fragment signals.Type: ApplicationFiled: December 4, 2024Publication date: March 20, 2025Inventors: Kuan WU, Jia JIA, Bin QIAN, Xun YANG
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Publication number: 20250087532Abstract: A method includes forming a metal layer over a dielectric layer; forming hard masks over the metal layer; etching the metal layer using the hard masks as etch mask to form metal features; selectively forming dielectric liners on opposite sidewalls of each of the metal features, while leaving surfaces of the hard masks and the dielectric layer exposed by the dielectric liners; and forming an inter-metal dielectric layer laterally surrounding the metal features.Type: ApplicationFiled: September 12, 2023Publication date: March 13, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kuang-Wei YANG, Cheng-Chin LEE, Shao-Kuan LEE, Jing Ting SU, Hsin-Ning HUNG, Hsin-Yen HUANG, Hsiao-Kang CHANG
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Publication number: 20250081356Abstract: The present disclosure describes a storage device including a top panel, a bottom panel, a back panel, a front panel, and two side panels configured to form an enclosed volume. The storage device further includes multiple slots disposed at inner surfaces of the two side panels and configured to hold a substrate, a gas diffuser disposed at an inner surface of the back panel and configured to provide a purge gas to the enclosed volume, an isolation gas device disposed on an inner surface of the top panel and adjacent to a top portion of the front panel, and an isolation gas line configured to connect the isolation gas device to the gas diffuser. The isolation gas device is configured to inject the purge gas into a front portion of the storage device and in a direction from the top panel toward the bottom panel.Type: ApplicationFiled: November 20, 2024Publication date: March 6, 2025Applicant: Semiconductor Manufacturing Co., Lid.Inventors: Shen-Min YANG, Pu Kuan FANG, Jyh-Shiou HSU, Mu-Tsang LIN
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Publication number: 20250070092Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.Type: ApplicationFiled: November 12, 2024Publication date: February 27, 2025Inventors: Harry-Hak-Lay Chuang, Wei-Cheng Wu, Wen-Tuo Huang, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang, Chung-Jen Huang, Shun-Kuan Lin, Chien Lin Liu, Ping-Tzu Chen, Yung Chun Tu
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Publication number: 20250062184Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.Type: ApplicationFiled: November 4, 2024Publication date: February 20, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen
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Publication number: 20250053161Abstract: A manufacturing control method is applied to a computer system comprising a processor, a storage device, and a display device. The manufacturing control method includes: dividing a plurality of outlier-filtered data into a plurality of data subgroups based on a group division reference value; calculating a plurality of standard deviations for each of these data subgroups; calculating a warning line upper limit and a warning line lower limit based on the group division reference value, a predetermined multiple, and the standard deviations; adjusting either the warning line upper limit or the warning line lower limit based on the predetermined multiple and the standard deviations; and when a sensing data exceeds the warning line upper limit or the warning line lower limit, the computing system triggers a warning signal.Type: ApplicationFiled: August 24, 2023Publication date: February 13, 2025Inventors: Yung-Yu YANG, Chih-Kuan CHANG, Chung-Chih HUNG, Yu-Hsien TSAI, Chen-Hui HUANG
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Publication number: 20250048625Abstract: A memory array includes a continuous active region extending along a direction. The memory array includes a first bit cell, which includes a first programming device and a pair of first reading devices defined on the continuous active region. The memory array includes a first programing word line coupled to a gate of the first programing device. The memory array includes a first reading word line coupled to gates of the pair of first reading devices. The memory array includes a bit line, wherein a first one of the pair of first reading devices is coupled between a first source/drain node of the first programing device and the bit line.Type: ApplicationFiled: November 27, 2023Publication date: February 6, 2025Applicant: Taiwan Semiconductor Manufacturing Company Ltd.Inventors: Yuhsiang Chen, Yao-Jen Yang, Ji Kuan Lee
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Publication number: 20250047527Abstract: A method for feeding back a sensing measurement result based on UWB and an apparatus are applied to a UWB-based WPAN system, for example, the 802.15.4a protocol, the 802.15.4z protocol, or the 802.15.4ab protocol in 802.15 series protocols, or may be applied to a wireless local area network system, a sensing system, or the like in 802.11 series protocols such as a next-generation Wi-Fi protocol of IEEE 802.11ax, for example, 802.11be, Wi-Fi 7, or EHT, and a next generation protocol of 802.11be, for example, Wi-Fi 8. The method includes: A transmitter sends control information; and correspondingly, a receiver receives the control information. Then, the receiver sends feedback information, and correspondingly, the transmitter receives the feedback information. According to the technical solutions provided in this application, signaling overheads can be effectively reduced.Type: ApplicationFiled: October 18, 2024Publication date: February 6, 2025Inventors: Xiaohui PENG, Bin QIAN, Yunbo LI, Kuan WU, Xun YANG, Min YAN, Lei HUANG
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Publication number: 20250040183Abstract: A method includes: forming a stack of semiconductor nanostructures on a semiconductor fin; forming a source/drain opening adjacent the stack; forming a bottom dielectric layer on the semiconductor fin; forming a source/drain region in the source/drain opening, a void being present between the source/drain region and the bottom dielectric layer; forming a dielectric layer on the source/drain region; forming a hardened portion of the dielectric layer by treating the dielectric layer, the hardened portion having higher etch selectivity than other portions of the dielectric layer; removing the other portions of the dielectric layer, exposing the void; forming a source/drain contact opening that extends to and connects with the void, the source/drain contact opening exposing sidewalls of the source/drain region; forming a liner layer on exposed surfaces of the source/drain region; and forming a conductive core layer on the liner layer, the conductive core layer being in contact with the liner layer on a top surfacType: ApplicationFiled: July 28, 2023Publication date: January 30, 2025Inventors: Chih-Hao CHANG, Wei-Yang LEE, Kuan-Hao CHENG, Cheng-Yi PENG
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Publication number: 20250023443Abstract: A feedback circuit is used for a power supply device. The power supply device includes a primary side circuit and a secondary side circuit. The feedback circuit includes a feedback voltage generation circuit, a base voltage generation circuit, and a compensation signal generation circuit. The feedback voltage generation circuit is electrically connected to the secondary side circuit. The feedback voltage generation circuit generates a feedback voltage according to a bias voltage and an output voltage of the power supply device. The base voltage generation circuit generates a base voltage according to the feedback voltage. The compensation signal generation circuit generates a compensation signal according to the feedback voltage and the base voltage and provides the compensation signal to a controller in the primary side circuit. A voltage value of the feedback voltage is lower than a voltage value of the bias voltage. The voltage value of the feedback voltage varies with the change of the output voltage.Type: ApplicationFiled: August 8, 2023Publication date: January 16, 2025Applicant: Power Forest Technology CorporationInventors: Yu-Chao Lin, Kuan-Chun Fang, Zhi-Yang Zhang, Chien-Wei Kuan
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Patent number: 12191895Abstract: A Bluetooth transmitter, a Bluetooth device, and a transmitter are provided. After being received by the transmitter, a transmission bitstream is modulated to generate a first-path modulated signal and a second-path modulated signal, which are up-converted to a first first-path up-converted signal, a second first-path up-converted signal, a first second-path up-converted signal, and a second second-path up-converted signal. The first first-path and the second first-path up-converted signals are corresponding to a first broadcast channel, and the first second-path and the second second-path up-converted signals correspond to a second broadcast channel. A first-path baseband signal is generated based on the first first-path and the second first-path up-converted signals, and a second-path baseband signal is generated based on the first second-path and the second second-path up-converted signals. A broadcast signal is generated based on the first-path and the second-path baseband signals.Type: GrantFiled: April 25, 2022Date of Patent: January 7, 2025Assignee: AIROHA TECHNOLOGY CORP.Inventors: Tzu-Kuan Yang, Yun-Xuan Zhang
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Publication number: 20240396389Abstract: A synchronous reluctance motor includes magnetic barriers in each magnetic barrier group of a rotor core, each having a shape which protrudes toward a radial inner side and is symmetrical about a q-axis. A portion closer to a circumferential side than the q-axis includes a first portion extending perpendicular to the q-axis and a second portion extending farther toward the circumferential side from a circumferential side of the first portion and radially outward, and the first portions of the magnetic barriers in each magnetic barrier group have the same radial dimension. The first portions of the magnetic barriers other than the radial outermost magnetic barrier have the same circumferential dimension, which is the same as or twice a circumferential dimension of the first portion of the radial outermost magnetic barrier.Type: ApplicationFiled: December 11, 2023Publication date: November 28, 2024Inventors: Pei-Chun SHIH, Ta-Yin LUO, Kuan YANG, Sheng-Chan YEN, Guo-Jhih YAN, Cheng-Tsung LIU
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Publication number: 20240364156Abstract: One aspect of a rotor of the present disclosure is a rotor that includes a rotor core extending along the axial direction and a plurality of auxiliary magnets disposed in the rotor core. The rotor core includes a slit group including a plurality of first slits aligned in a radial direction, and a second slit disposed radially inside the slit group when viewed from the axial direction. The first slit extends along the circumferential direction in a shape protruding radially inward when viewed from the axial direction. The second slit includes a magnet housing portion extending along the radial direction, and a pair of outer flux barrier portions. The auxiliary magnet is disposed in the magnet housing portion with the circumferential direction as the magnetization direction.Type: ApplicationFiled: April 26, 2024Publication date: October 31, 2024Inventors: Ta-Yin LUO, Yu-Wei HSU, Kuan YANG, Pei-Chun SHIH, Sheng-Chan YEN, Guo-Jhih YAN, Cheng-Tsung LIU
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Patent number: 12087548Abstract: A plasma reactor includes: a process chamber, at the inner bottom of the process chamber being provided a base, the base being connected to a RF power source via a RF match network, wherein a to-be-processed wafer is held above the base, an upper electrode assembly is provided at the inner top of the process chamber, and a plasma processing space is arranged between the base and the upper electrode assembly; a first conductive ground ring surrounding the outer periphery of the base; a second conductive ground ring connected between the outer sidewall of the first conductive ground ring and the inner sidewall of the process chamber, a plurality of gas channels being provided on the second conductive ground ring such that gas in the plasma processing space can be exhausted through the plurality of gas channels; an insulating ring provided between the base and the first conductive ground ring, wherein dielectric constant of the insulating ring is less than 3.5.Type: GrantFiled: December 17, 2021Date of Patent: September 10, 2024Assignee: ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINAInventors: Leyi Tu, Rubin Ye, Kuan Yang
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Publication number: 20240113575Abstract: A hybrid permanent magnet motor rotor rotates around a central axis, and includes: a rotor core provided with a plurality of magnet installation slots; and a plurality of magnet parts embedded inside a plurality of magnet installation slots respectively, wherein the rotor is provided with a plurality of first magnetic pole parts and a plurality of second magnetic pole parts, the magnetic poles of the first magnetic pole part and the second magnetic pole part are arranged in opposite and alternately in the circumferential direction, and the magnetic placement of the first magnetic pole part is different from that of the second magnetic pole part, the amount of magnets used in the second magnetic pole part is greater than that used in the first magnetic pole part.Type: ApplicationFiled: August 25, 2023Publication date: April 4, 2024Inventors: Kuan YANG, Pei-Chun SHIH, Ta-Yin LUO, Guo-Jhih YAN, Sheng-Chan YEN, Cheng-Tsung LIU
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Publication number: 20230362609Abstract: A Bluetooth transmitter, a Bluetooth receiver, and a receiver are provided. The Bluetooth transmitter includes modulation modules, up-conversion modules, and an RF transmitting circuit. The modulation modules modulate transmission bitstreams to generate multiple pairs of modulated signals. The up-conversion modules up-convert the pairs of modulated signals to multiple pairs of up-converted signals. The RF transmitting circuit transmits an output signal based on the pairs of up-converted signals. The Bluetooth receiver includes an RF receiving circuit, down-conversion modules, and de-modulators. The RF receiving circuit transforms an input signal into a pair of analog filtered signals. The down-conversion modules generate pairs of down-converted signals based on the pair of analog filtered signals. The de-modulators generate received bitstreams by demodulating the pairs of down-converted signals.Type: ApplicationFiled: May 5, 2022Publication date: November 9, 2023Inventors: Yun-Xuan ZHANG, Tzu-Kuan YANG
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Publication number: 20230344453Abstract: A Bluetooth transmitter, a Bluetooth device, and a transmitter are provided. After being received by the transmitter, a transmission bitstream is modulated to generate a first-path modulated signal and a second-path modulated signal, which are up-converted to a first first-path up-converted signal, a second first-path up-converted signal, a first second-path up-converted signal, and a second second-path up-converted signal. The first first-path and the second first-path up-converted signals are corresponding to a first broadcast channel, and the first second-path and the second second-path up-converted signals correspond to a second broadcast channel. A first-path baseband signal is generated based on the first first-path and the second first-path up-converted signals, and a second-path baseband signal is generated based on the first second-path and the second second-path up-converted signals. A broadcast signal is generated based on the first-path and the second-path baseband signals.Type: ApplicationFiled: April 25, 2022Publication date: October 26, 2023Inventors: Tzu-Kuan YANG, Yun-Xuan ZHANG
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Publication number: 20230006588Abstract: A method for starting a motor having a stator and a rotor is provided. The method includes starting a motor with field coils of the stator being in Y connection, switching the connection of the field coils to ? connection when the speed of the rotor does not fall within a predetermined range from a rated speed within a predetermined time (t2), and switching the connection of the field coils to the Y connection when the speed of the rotor falls within the predetermined range from the rated speed.Type: ApplicationFiled: June 10, 2022Publication date: January 5, 2023Inventors: Pei-Chun SHIH, Hsin-Nan LIN, Yu-Wei HSU, Ta-Yin LUO, Kuan YANG, Guo-Jhih YAN, Sheng-Chan YEN, Cheng-Tsung LIU
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Publication number: 20220351933Abstract: Disclosed is a plasma treatment apparatus, a lower electrode assembly and a forming method thereof, wherein the lower electrode assembly includes: a base for carrying a substrate to be treated; a focus ring encircling a periphery of the base; a coupling loop disposed below the focus ring; a conductive layer disposed in the coupling loop; and a wire for electrically connecting the conductive layer and the base so that the base and the conducting layer are equipotential. The lower electrode assembly is less prone to cause arc discharge.Type: ApplicationFiled: February 24, 2022Publication date: November 3, 2022Inventors: Tuqiang NI, Sheng GUO, Xiang SUN, Guangwei FAN, Kuan YANG, Hongqing WANG, Xingjian CHEN, Ruoxin DU
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Publication number: 20220208521Abstract: A plasma reactor includes: a process chamber, at the inner bottom of the process chamber being provided a base, the base being connected to a RF power source via a RF match network, wherein a to-be-processed wafer is held above the base, an upper electrode assembly is provided at the inner top of the process chamber, and a plasma processing space is arranged between the base and the upper electrode assembly; a first conductive ground ring surrounding the outer periphery of the base; a second conductive ground ring connected between the outer sidewall of the first conductive ground ring and the inner sidewall of the process chamber, a plurality of gas channels being provided on the second conductive ground ring such that gas in the plasma processing space can be exhausted through the plurality of gas channels; an insulating ring provided between the base and the first conductive ground ring, wherein dielectric constant of the insulating ring is less than 3.5.Type: ApplicationFiled: December 17, 2021Publication date: June 30, 2022Inventors: Leyi TU, Rubin YE, Kuan YANG