Abstract: A half-bridge driver drives a half-bridge circuit. The half-bridge driver includes a switch selection circuit and at least one slew rate adjustment circuit, wherein the slew rate adjustment circuit includes a pulse-width control unit, an adjustment pulling unit and a halt adjustment pulling unit. The switch selection circuit generates a source current or a sink current to correspondingly pull up or pull down the gate-source voltage of the upper switch or the lower switch, thereby turning-on or turning-off the upper switch or the lower switch. The adjustment pulling unit is for adjusting the pulling-up or pulling-down of the gate-source voltage of the upper switch or the lower switch. The stop-adjustment pulling unit is for stopping adjusting the pulling-up or pulling-down of the gate-source voltage of the upper switch or the lower switch.

Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: A class-D amplifier circuit includes an amplifier circuit, a PWM circuit, a power stage circuit, a pair of feedback circuits, and a common-mode control circuit. The amplifier circuit receives a differential input signal at differential input ends to generate a differential intermediate signal. The PWM circuit generates a PWM signal according to the differential intermediate signal. The power stage circuit generates a differential output signal at differential output ends according to the PWM signal. The common-mode control circuit controls first and second high bandwidth transconductance circuits according to the output common-mode voltage of the differential output signal, so as to generate first and second common-mode control currents, thereby providing a common-mode control signal at the differential input ends to regulate the input common-mode voltage of the differential input signal at a predetermined input common-mode level.

Abstract: A transmission device includes a daisy chain structure composed of at least three daisy chain units arranged periodically and continuously. Each of the daisy chain units includes first, second and third conductive lines, and first and second conductive pillars. The first and second conductive lines at a first layer extend along a first direction and are discontinuously arranged. The third conductive line at a second layer extends along the first direction and is substantially parallel to the first and second conductive lines. The first conductive pillar extends in a second direction. The second direction is different from the first direction. A first part of the first conductive pillar is connected to the first and third conductive lines. The second conductive pillar extends in the second direction. A first part of the second conductive pillar is connected to the second and third conductive lines.

Abstract: The present disclosure provides a connecting device and a lamp system. The connecting device is used to connect multiple lamps to form the lamp system. The connecting device includes a connecting element, a cover, and a shell. The cover is mounted on the connecting element and includes at least two first assembling members. The shell is detachably mounted on the cover. The shell includes a side wall, an opening, multiple gateways, and at least two second assembling members. The side wall surrounds a space. The opening and the gateways all are formed on a top of the side wall and communicate with the space. A portion of each of the lamps is received in one of the gateways. The second assembling members are disposed on the side wall and face each other in a radial line of the shell, and respectively engage with the first assembling members.

Abstract: A microfluidic detection unit comprises at least one fluid injection section, a fluid storage section and a detection section. Each fluid injection section defines a fluid outlet; the fluid storage section is in gas communication with the atmosphere and defines a fluid inlet; the detection section defines a first end in communication with the fluid outlet and a second end in communication with the fluid inlet. A height difference is defined between the fluid outlet and the fluid inlet along the direction of gravity. When a first fluid is injected from the at least one fluid injection section, the first fluid is driven by gravity to pass through the detection section and accumulate to form a droplet at the fluid inlet, such that a state of fluid pressure equilibrium of the first fluid is established.

Abstract: A semiconductor structure is provided and includes a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region. The semiconductor structure further includes a first separation spacer disposed on the first gate structure and first vias on the first gate structure. The first vias are arranged on opposite sides of the first separation spacer are isolated from each other and apart from the first separation spacer by different distances.

Abstract: An electronic package of which the manufacturing method is to dispose an electronic element on a circuit portion, encapsulate the electronic element with an Ajinomoto build-up film (ABF) used as an encapsulating layer, form a wiring layer on the encapsulating layer, and form a conductive via in the encapsulating layer. Therefore, the wiring layer can be well bonded onto the encapsulating layer as the ABF material is used as the encapsulating layer.

Abstract: An omnidirectional feed ejecting device includes a feed supply unit disposed on a periphery of a cultivation pool. The feed supply unit includes a conveying tube for supplying feed. A supporting portion is coupled with an end portion of the conveying tube and is fixed relative to the cultivation pool. A rotary seat above the cultivation pool is rotatably connected to the end portion of the conveying tube. The rotary seat includes an outlet intercommunicating with the conveying tube. At least one feed ejecting tube includes a connecting section and a bent section. The connecting section is connected to the at least one outlet of the rotary seat and extends in a radial direction of the rotary seat. The bent section is disposed on another end of the connecting section and is at an angle to the connecting section in a horizontal plane and in a vertical plane.

Abstract: A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.

Abstract: A shower head structure and a plasma processing apparatus are provided. The shower head structure includes a plate body with a first zone and a second zone on a first surface. A plurality of first through holes are in the first zone, each of the first through holes having a diameter uniform with others of the first through holes. A plurality of second through holes are in the second zone. The first zone is in connection with the second zone, and the diameter of each of the first through holes is greater than a diameter of each of the second through holes. A plasma processing apparatus includes the shower head structure is also provided.

Abstract: A method of using NC-MRA to generate pelvic veins images and measure rate of blood flow includes subjecting a lay patient to undergo magnetic resonance scan in cooperation with an ECG monitor and a respiration monitor; scanning coronary sections and transverse sections of kidney veins, lower cavity veins, common iliac veins, and external iliac veins to generate two-dimensional images wherein the two-dimensional images use balanced turbo field echo wave sequence; scanning coronary sections of common cardinal veins of abdominal cavity to generate three-dimensional images wherein the three-dimensional images use fast spin-echo short tau inversion recovery wave sequence and sample signals when the ECG monitor monitors myocardial contractility; and using quantification phase-contrast analysis to measure blood flowing through the transverse sections of the veins in a two-dimensional scan.

Abstract: An automatic dispensing device for use in storing and selectively dispensing electronic transmission devices, for example tire pressure monitoring system (TPMS) tire sensors. The dispensing device assists a user in determining the proper transmission device to be dispensed and programs or configures the transmission device in the dispenser prior to dispensing the programmed or configured transmission device to the user. When used for TPMS tire sensors, the dispenser determines the type of TPMS sensor to be programmed, programs the sensor with the proper communication protocol, and dispenses the programmed or configured sensor to the user for installation in the vehicle wheel and tire.

Abstract: A conductive mechanism includes two bases, an inner conductive spring and an outer conductive spring. The two bases are opposite to each other. Each of the bases includes a surface and a partition wall protruding relative to the surface. The inner conductive spring is disposed at inner sides of the two partition walls of the two bases. The outer conductive spring is disposed at outer sides of the two partition walls of the two bases. At least one of two ends of each of the inner conductive spring and the outer conductive spring rotatably abuts against the surface of one of the bases.

Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.

Abstract: A method, system, and article provide image processing with power reduction while using universal serial bus cameras.

Abstract: A power converter includes a high side switch, a low side switch, a low side driver, a loading detector, a configurable regulator and a high side driver. The low side driver generates a low side drive signal to control the low side switch. The configurable regulator generates a regulation voltage, a magnitude of which is greater when the loading detector detects that the power converter has light loading than when the loading detector detects that the power converter has heavy loading. The high side driver generates a high side drive signal that switches between the input voltage and the regulation voltage to control the high side switch.

Abstract: Integrated circuit packages and methods of forming the same are discussed. In an embodiment, a device includes: a package substrate; a semiconductor device attached to the package substrate; an underfill between the semiconductor device and the package substrate; and a package stiffener attached to the package substrate, the package stiffener includes: a main body extending around the semiconductor device and the underfill in a top-down view, the main body having a first coefficient of thermal expansion; and pillars in the main body, each of the pillars extending from a top surface of the main body to a bottom surface of the main body, each of the pillars physically contacting the main body, the pillars having a second coefficient of thermal expansion, the second coefficient of thermal expansion being less than the first coefficient of thermal expansion.