Patents by Inventor Kuang-Chih Wang

Kuang-Chih Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Al-based contact formation process using Ti glue layer to prevent nodule-induced bridging
    Patent number: 5604155
    Abstract: A contact metallization process which includes a Ti glue layer has been disclosed. The Ti glue layer is formed between a barrier metal layer and an Al-based layer. The Ti glue layer prevents formation of etch resistant precipitants in or on the Al-based layer. The Ti glue layer reacts with the aluminum based layer to form TiAl.sub.3 which dissolves the precipitates. The inventive process allows proper etching of the Al-based layer and eliminates bridging.
    Type: Grant
    Filed: July 17, 1995
    Date of Patent: February 18, 1997
    Assignee: Winbond Electronics Corp.
    Inventor: Kuang-Chih Wang