Abstract: Present disclosure provides a semiconductor structure, including a semiconductor fin having a first portion and a second portion over the first portion, a first conductive region abutting a first lateral surface of the first portion and a first lateral surface of the second portion, a metal gate having a bottom portion and an upper portion, the bottom portion being between the first portion and the second portion of the semiconductor fin, and the upper portion being over the second portion of the semiconductor fin, and a first spacer between the bottom portion of the metal gate and the first conductive region. A method for manufacturing the semiconductor structure described herein is also provided.

Abstract: A communication device includes a housing (20) and an antenna (10). The housing comprises a retaining portion (22). The retaining portion defines a hole (24) surrounded by an inner wall (21). The inner wall includes a plurality of rib portions (28) parallel to a center axis (220) of the hole. A length of each of the rib portions is shorter than an overall length of the inner wall. Ends of the rib portions cooperatively form a step (27), and a pair of stop walls (29) is formed at opposite ends of the step respectively. The rib portions define a plurality of slots (26) therebetween. The antenna is rotatably attached to the retaining portion. The antenna includes a protrusion (166), and a width of each of the slot is slightly smaller than that of the protrusion. The stop wall and the protrusion cooperatively prevent the antenna from rotating excessively.

Abstract: A circuit board includes a first circuit board section which is configured to support a set of light emitting diodes, a second circuit board section which is configured to support high-speed electronic circuitry, and a boundary section which defines an EMI boundary between the first circuit board section and the second circuit board section. The boundary section includes a set of outer surface elongated ground strips configured to form an EMI seal onto which a set of EMI shields is capable of mounting. In some arrangements, the set of outer surface elongated ground strips take the form of metallic bands (e.g., layers of copper). Such bands can be integrated into the circuit board itself (e.g., during PCB fabrication), or added onto one or more of the circuit board surfaces (e.g., after PCB fabrication).

Abstract: A chassis utilizes spring fingers having contact portions and mid portions where each spring finger forms multiple cantilevers to provide different spring constants. Accordingly, the increase in force resulting from displacement can be better controlled and even minimized for certain ranges of displacement. In particular, each spring finger can be configured to perform in an operating range characterized by a smaller spring constant. As a result, the force increase in this operating range is slower thus accommodating circuit boards with large connector height variations without significantly changing the normal contact force. Such operation enables the chassis to consistently pass EMI and ESD testing, as well as provide more reliable device operation.

Abstract: A communication device includes a housing (20) and an antenna (10). The housing comprises a retaining portion (22). The retaining portion defines a hole (24) surrounded by an inner wall (21). The inner wall includes a plurality of rib portions (28) parallel to a center axis (220) of the hole. A length of each of the rib portions is shorter than an overall length of the inner wall. Ends of the rib portions cooperatively form a step (27), and a pair of stop walls (29) is formed at opposite ends of the step respectively. The rib portions define a plurality of slots (26) therebetween. The antenna is rotatably attached to the retaining portion. The antenna includes a protrusion (166), and a width of each of the slot is slightly smaller than that of the protrusion. The stop wall and the protrusion cooperatively prevent the antenna from rotating excessively.