Module assembly

- Cisco Technology, Inc.
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Description

FIG. 1 is a top plan view of a module assembly, showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a side elevation view thereof;

FIG. 5 is a side elevation view of the opposite side shown in FIG. 4;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a top, front and side perspective view thereof.

The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for a module assembly, as shown and described.

Referenced Cited
U.S. Patent Documents
D303246 September 5, 1989 Freeman et al.
D392645 March 24, 1998 Wakabayashi
D421964 March 28, 2000 Nagasawa et al.
D432991 October 31, 2000 Taguchi
6299480 October 9, 2001 Xu et al.
D503384 March 29, 2005 Weatherley
D526616 August 15, 2006 Nakashima et al.
20050277339 December 15, 2005 Caveney et al.
Patent History
Patent number: D553572
Type: Grant
Filed: Oct 14, 2004
Date of Patent: Oct 23, 2007
Assignee: Cisco Technology, Inc. (San Jose, CA)
Inventors: George Youhzi Yi (Fremont, CA), William J. Lewis (Mountain View, CA), Hsi-sheng Chen (Panchiao), Hung-Ting Lin (Taipei), Kuang Hsin Hsu (Tu-cheng Industrial Area)
Primary Examiner: Daniel Bui
Attorney: Trellis Intellectual Property Law Group, PC
Application Number: 29/215,156