Patents by Inventor Kuang-Hua Lin
Kuang-Hua Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11968800Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.Type: GrantFiled: May 23, 2023Date of Patent: April 23, 2024Assignee: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Sheng-Yan Chen
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Publication number: 20240120294Abstract: A chip package includes a substrate, a semiconductor chip, and a thermal conductive structure. The chip package includes a first and a second support structures below the thermal conductive structure. The first and the second support structures connect the substrate and corners of the thermal conductive structure. The thermal conductive structure has a side edge connecting the first and the second support structures. The first and the second support structures and the side edge together define of an opening exposing a space surrounding the semiconductor chip. The first and the second support structures are disposed along a side of the substrate. The first support structure is laterally separated from the side of the substrate by a first lateral distance. The side edge of the thermal conductive structure is laterally separated from the side of the substrate by a second lateral distance different than the first lateral distance.Type: ApplicationFiled: December 21, 2023Publication date: April 11, 2024Inventors: Shu-Shen YEH, Chin-Hua WANG, Kuang-Chun LEE, Po-Yao LIN, Shyue-Ter LEU, Shin-Puu JENG
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Publication number: 20240055417Abstract: Provided is an electronic package structure, including a substrate, a first electronic component disposed on the substrate, at least one second electronic component disposed on the substrate, an insulating film disposed on the second electronic component and the substrate, an insulating glue filled onto the second electronic component and the substrate to cover at least part of the insulating film, a liquid metal disposed on the first electronic component, and a heat-dissipating plate disposed on the first electronic component to squeeze the liquid metal. The insulating film and the insulating glue prevent the overflowing liquid metal from contacting the second electronic component and the substrate.Type: ApplicationFiled: August 10, 2023Publication date: February 15, 2024Applicant: Acer IncorporatedInventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen
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Patent number: 11852158Abstract: A fan including a frame and an impeller is disclosed. The frame has an air inlet and an air outlet. The impeller is disposed in the frame and includes a hub and multiple blades. Each blade has a negative pressure surface facing the air inlet, a positive pressure surface facing the air outlet, a blade root, and a blade tip opposite to the blade root. In a first region extending from the blade root to the blade tip by a first length, the negative pressure surface and the positive pressure surface are respectively a convex arc surface and a plane. In a second region extending from the blade tip to the blade root by a second length smaller than the first length, the negative pressure surface and the positive pressure surface are respectively a convex arc surface and a concave arc surface or both are convex arc surfaces.Type: GrantFiled: May 3, 2023Date of Patent: December 26, 2023Assignee: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Jau-Han Ke, Kuang-Hua Lin, Yu-Ming Lin, Chun-Chieh Wang
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Publication number: 20230349386Abstract: A centrifugal heat dissipation fan including a hub, a frame, and double-layer fan blade sets is provided. The double-layer fan blade sets surround the hub and are arranged along a radial direction at an inner layer and an outer layer. A gap is maintained along the radial direction between the fan blade set located at the inner layer and the fan blade set located at the outer layer. The frame is connected to the hub and the fan blade set located at the outer layer.Type: ApplicationFiled: April 25, 2023Publication date: November 2, 2023Applicant: Acer IncorporatedInventors: Cheng-Wen Hsieh, Wen-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen, Tsung-Ting Chen
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Patent number: 11775034Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.Type: GrantFiled: January 11, 2022Date of Patent: October 3, 2023Assignee: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
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Publication number: 20230301017Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.Type: ApplicationFiled: May 23, 2023Publication date: September 21, 2023Applicant: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Sheng-Yan Chen
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Patent number: 11629725Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one flow inlet. The impeller assembled in the housing and rotating about an axial direction includes a hub and a plurality blades disposed around the hub. The flow inlet is located in the axial direction and faces the hub. Each of the blades has a wing tab next to the flow inlet, and the wing tab extends from a main surface of the blade to another blade. The wing tab has an inclined surface facing toward a periphery of the flow inlet along a radial direction of the impeller.Type: GrantFiled: April 5, 2021Date of Patent: April 18, 2023Assignee: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Jau-Han Ke, Kuang-Hua Lin
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Patent number: 11530707Abstract: A fan including a hub and a plurality metal blades is provided. Each of the blades extends from the hub and is inclined relative to a radial direction of the hub. Each blade has a distal edge away from the hub, and has a pair of wingtips at the distal edge.Type: GrantFiled: April 12, 2021Date of Patent: December 20, 2022Assignee: Acer IncorporatedInventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
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Publication number: 20220400582Abstract: Provided is a heat dissipation structure, including a conductive member disposed on and thermally coupled to a heat source, a heat pipe including evaporating and condensing parts, a fan disposed in correspondence to the condensing part, and a heat storage component disposed on a circuit board. The evaporating part is disposed on and thermally coupled to the conductive member. The heat source is located between the conductive member and the circuit board. The conductive member is located between the heat pipe and the heat source. The circuit board is located between the heat source and the heat storage component, and is thermally coupled to the heat source. The heat storage component is thermally coupled to the circuit board and is filled with a working medium absorbing heat conducted from the heat source to the circuit board by latent heat of absorption during phase change. An electronic device is also provided.Type: ApplicationFiled: June 6, 2022Publication date: December 15, 2022Applicant: Acer IncorporatedInventors: Kuang-Hua Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Tsung-Ting Chen
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Publication number: 20220316493Abstract: A cooling fan includes a hub, a plurality of blades, and a plurality of flow disturbing elements. The blades are arranged on a peripheral surface of the hub; each of the blades has a leading edge and a trailing edge opposite to the leading edge, and each of the blades has at least one flow disturbing element arranged at the trailing edge. Each of the flow disturbing elements includes an engaging part and an extending part opposite to the engaging part; the engaging part of each of the flow disturbing elements is connected to the trailing edge of the corresponding blade, and the extending part of each of the flow disturbing elements extends outwardly toward a direction away from the trailing edge of the corresponding blade.Type: ApplicationFiled: April 1, 2022Publication date: October 6, 2022Applicant: Acer IncorporatedInventors: Cheng-Wen Hsieh, Wen-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen
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Publication number: 20220229477Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.Type: ApplicationFiled: January 11, 2022Publication date: July 21, 2022Applicant: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
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Publication number: 20220132700Abstract: A heat dissipation system of portable electronic device includes a body, at least one fan and at least one spacing member. At least one heat source of the portable electronic device is arranged in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet located in the axial direction and at least one flow outlet located in the radial direction. The spacing member is disposed on at least one of the body or the fan to form a stratified air flow in the body along the axial direction. The stratified air flows into the fan through the flow inlet and out of the fan through the flow outlet respectively.Type: ApplicationFiled: September 10, 2021Publication date: April 28, 2022Applicant: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
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Patent number: 11208897Abstract: A heat dissipation fan including a hub and a plurality of fan assemblies are provided. The fan assemblies are disposed around the hub, and each of the fan assemblies includes at least two blades. A runner is formed between the at least two blades. A width of the runner gradually reduces along a rotating axis of the hub.Type: GrantFiled: August 1, 2019Date of Patent: December 28, 2021Assignee: Acer IncorporatedInventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
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Patent number: 11209014Abstract: An axial flow fan includes a hub and a plurality of fan sets disposed around the hub. The hub rotates around a center axis and has a positive pressure side and a negative pressure side opposite to each other. Each of the fan sets includes at least two blades, and each blade has a wind inlet end, a wind outlet end opposite to the wind inlet end, a negative pressure surface, and a positive pressure surface opposite to the negative pressure surface. The wind outlet end of one of the adjacent two blades corresponds to the wind inlet end of the other one of the adjacent two blades. A gap is provided between the negative pressure surface of one of the adjacent two blades and the positive pressure surface of the other one of the adjacent two blades.Type: GrantFiled: February 20, 2020Date of Patent: December 28, 2021Assignee: Acer IncorporatedInventors: Kuang-Hua Lin, Tsung-Ting Chen, Cheng-Wen Hsieh, Wen-Neng Liao
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Publication number: 20210364238Abstract: A vapor chamber structure for heat dissipation of a heat source is provided. The vapor chamber structure includes a housing having a heat absorption side and a heat dissipation side, a first capillary structure disposed in the housing, and a working fluid filled in the housing. The first capillary structure is formed into cavities isolated from each other, and each of the cavities is connected between the heat absorption side and the heat dissipation side. Heat generated by the heat source is absorbed by the heat absorption side, thereby transforming the working fluid from liquid state to vapor state. The working fluid in the vapor state is transmitted to the heat dissipation side via the cavities, and is transformed to the liquid state while the heat is dissipated. The working fluid in the liquid state returns to the heat absorption side via the first capillary structure.Type: ApplicationFiled: May 20, 2021Publication date: November 25, 2021Applicant: Acer IncorporatedInventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Jau-Han Ke
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Publication number: 20210324873Abstract: A fan including a hub and a plurality metal blades is provided. Each of the blades extends from the hub and is inclined relative to a radial direction of the hub. Each blade has a distal edge away from the hub, and has a pair of wingtips at the distal edge.Type: ApplicationFiled: April 12, 2021Publication date: October 21, 2021Applicant: Acer IncorporatedInventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
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Publication number: 20210321533Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.Type: ApplicationFiled: March 30, 2021Publication date: October 14, 2021Applicant: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Sheng-Yan Chen
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Publication number: 20210317839Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one flow inlet. The impeller assembled in the housing and rotating about an axial direction includes a hub and a plurality blades disposed around the hub. The flow inlet is located in the axial direction and faces the hub. Each of the blades has a wing tab next to the flow inlet, and the wing tab extends from a main surface of the blade to another blade. The wing tab has an inclined surface facing toward a periphery of the flow inlet along a radial direction of the impeller.Type: ApplicationFiled: April 5, 2021Publication date: October 14, 2021Applicant: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Jau-Han Ke, Kuang-Hua Lin
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Patent number: 11048309Abstract: A heat dissipation module including a first fan and a second fan is provided. The first fan has a first hub and a plurality of first fan blades disposed on the first hub. The second fan has a second hub and a plurality of second fan blades disposed on the second hub. Herein the first hub and the second hub are movably connected to each other in an axial direction such that the first fan and the second fan coincide or are separated from each other.Type: GrantFiled: June 29, 2019Date of Patent: June 29, 2021Assignee: Acer IncorporatedInventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao