Patents by Inventor Kuei-feng Chiang

Kuei-feng Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10356941
    Abstract: An air-cooling heat dissipation device includes a base, a swirling-airflow heatsink, an air pump and a passage connector. The base is located beside an electronic component while the air pump is fixed on the base. The swirling-airflow heatsink is attached on the electronic component and includes a swirling passage defined by a conductive line and a thermal conduction plate collaboratively. An airflow-guiding chamber is defined by the air pump and the base collaboratively, and the airflow-guiding chamber is in communication with the swirling passage by the passage connector. When the air pump is enabled, an ambient air is introduced into the airflow-guiding chamber of the base and transferred to the swirling passage of the swirling-airflow heatsink through a discharge opening of the base and the passage connector. Consequently, a fast swirling air flow is produced to cool the electronic component.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: July 16, 2019
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Zhen-Chun Xu, Kuei-Liang Chiang, Yung-Kang Lin, Chi-Feng Huang, Yung-Lung Han
  • Publication number: 20190186842
    Abstract: A method for manufacturing a heat dissipation device is disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed and manufactured in a more flexible manner.
    Type: Application
    Filed: December 11, 2018
    Publication date: June 20, 2019
    Inventor: Kuei-Feng Chiang
  • Publication number: 20190186840
    Abstract: A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.
    Type: Application
    Filed: December 11, 2018
    Publication date: June 20, 2019
    Inventor: Kuei-Feng Chiang
  • Publication number: 20180369971
    Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Application
    Filed: June 22, 2017
    Publication date: December 27, 2018
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Publication number: 20180372431
    Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Application
    Filed: June 22, 2017
    Publication date: December 27, 2018
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Publication number: 20180369896
    Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Application
    Filed: October 25, 2017
    Publication date: December 27, 2018
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Publication number: 20180372418
    Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Application
    Filed: October 25, 2017
    Publication date: December 27, 2018
    Inventors: Kuei-Feng CHIANG, Chih-Yeh LIN
  • Publication number: 20180361460
    Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.
    Type: Application
    Filed: October 25, 2017
    Publication date: December 20, 2018
    Inventors: Kuei-Feng CHIANG, Chih-Yeh LIN
  • Publication number: 20180361505
    Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.
    Type: Application
    Filed: June 19, 2017
    Publication date: December 20, 2018
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Patent number: 9504185
    Abstract: A loop heat pipe structure includes a transport pipe, an evaporator, a first wick layer, a second wick layer, and a plurality of grooves. The transport pipe communicates with the evaporator. The evaporator has a bottom and internally defines a first chamber and a second chamber, and has a working fluid filled therein. The first wick layer is located on the bottom, and the second wick layer is located on and covers the first wick layer. The grooves can be selectively provided on the first wick layer or the bottom. The first and second wick layers are so designed that the situation of very high vapor pressure would not occur in the second chamber, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: November 22, 2016
    Assignee: Asia Vital Components (Shen Zhen) Co., Ltd.
    Inventors: Jun Xiang, Xiao-Xiang Zhou, Kuei-Feng Chiang
  • Patent number: 9441888
    Abstract: A loop type pressure-gradient-driven low-pressure thermosiphon device includes a case sealed by a cover to define a chamber with a vaporizing section. The vaporizing section includes a plurality of spaced flow-guiding members and first flow passages formed between adjacent flow-guiding members. The flow passages respectively have at least one free end communicating with a free zone in the chamber. A pipeline is connected at two ends to two opposite sides of the case, and has a second flow passage communicable with the vaporizing section. The pipeline extends through at least one heat-dissipating element, so that the pipeline and the heat-dissipating element together define a condensing section. In the thermosiphon device, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can be driven to circulate and transfer heat in the pipeline and the case without any wick structure.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: September 13, 2016
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
  • Patent number: 9353996
    Abstract: A pressure difference driven heat spreader includes a chamber defined in a main body; a vaporizing section arranged in the chamber and including a plurality of first flow-guiding members spaced from one another to define first flow passages therebetween, the first flow passages each having at least one free end communicating with a free zone; a condensing section arranged in the chamber opposite to the vaporizing section and including a plurality of second flow-guiding members spaced from one another to define second flow passages therebetween; and an interconnecting section arranged between the vaporizing and condensing sections and having first and second communicating holes for communicating the vaporizing section with the condensing section. The condensing section functions as a low-pressure end, so that a pressure gradient is produced in the pressure difference driven heat spreader to drive steam-water circulation therein, and no wick structure is needed for driving the working fluid.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: May 31, 2016
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
  • Publication number: 20160081226
    Abstract: A heat dissipation structure for mobile device includes an element holding member internally defining a first receiving space, in which a plurality of electronic elements of a mobile device is mounted; and a heat dissipation layer formed on at least one side of each of the electronic elements. The heat dissipation layer is formed on one side of each of the electronic elements through a micro arc oxidation (MAO) process, a plasma electrolytic oxidation (PEO) process, an anodic spark deposition (ASD) process, or an anodic oxidation by spark deposition (ANOF) process. Therefore, heat produced by the electronic elements in the mobile device can be quickly removed away from the electronic elements via the heat dissipation layer.
    Type: Application
    Filed: September 11, 2014
    Publication date: March 17, 2016
    Inventor: Kuei-Feng Chiang
  • Publication number: 20160073553
    Abstract: A heat dissipation structure of handheld device includes a carrier body. The carrier body has a first receiving space. The first receiving space has a heat absorption section and a heat dissipation section. The heat dissipation section is adjacent to the heat absorption section and formed with a heat dissipation layer. The heat absorption section is able to quickly absorb the heat generated by the electronic components carried by the carrier body and transfer the heat to the heat dissipation layer of the heat dissipation section so as to quickly dissipate the heat.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 10, 2016
    Inventor: Kuei-Feng Chiang
  • Publication number: 20150308436
    Abstract: A thin fan structure includes a case, a fan impeller, a circuit board, a silicon steel sheet and a winding assembly. The case has a receiving space and a bearing cup protruding into the receiving space. The bearing cup is formed with a bearing hole. The fan impeller has a hub section, multiple blades and a shaft extending from a center of the hub section. A magnetic member is annularly disposed on inner circumference of the hub section. The circuit board is disposed in the receiving space. The silicon steel sheet disposed on the circuit board has a base section and multiple first magnetic conductive sections, which together define a receiving space. The winding assembly is fixedly disposed in the receiving space. The winding assembly has a bottom section attached to the base section and a side section attached to the first magnetic conductive sections.
    Type: Application
    Filed: April 23, 2014
    Publication date: October 29, 2015
    Applicant: Asia Vital Components Co., Ltd.
    Inventor: Kuei-Feng Chiang
  • Patent number: 9074823
    Abstract: A thermal siphon structure includes a main body, a chamber disposed therein, an evaporation section, a condensation section and a connection section positioned between the evaporation section and condensation section. The evaporation section and condensation section are respectively arranged in the chamber on two sides thereof. The connection section has a set of first communication holes and a set of second communication holes in communication with the evaporation section and condensation section. The evaporation section and condensation section respectively have multiple first and second flow guide bodies, which are arranged at intervals to define therebetween first and second flow ways. Each of the first and second flow ways has a narrower end and a wider end. The first flow ways communicate with a free area. The condensation section is designed with a low-pressure end to create a pressure gradient for driving a working fluid to circulate without any capillary structure.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: July 7, 2015
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
  • Patent number: 9071100
    Abstract: A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: June 30, 2015
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
  • Patent number: 9071098
    Abstract: A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: June 30, 2015
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
  • Patent number: 9065313
    Abstract: A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: June 23, 2015
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
  • Patent number: 8973646
    Abstract: A slim type pressure-gradient-driven low-pressure thermosiphon plate includes a main body closed by a cover. The main body includes a central heat receiving zone, a pressure accumulating zone and a first flow passage unit separately located at two opposite sides of the heat receiving zone, a free zone communicating with the pressure accumulating zone, a first and a second condensing zone communicating with the free zone, a third and a fourth condensing zone communicating with the first flow passage unit, a second flow passage unit located between and communicating with the first and the third condensing zone, and a third flow passage unit located between and communicating with the second and the fourth condensing zone. In the thermosiphon plate, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can transfer heat without any wick structure.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: March 10, 2015
    Assignee: Asisa Vital Components Co., Ltd.
    Inventors: Shyy-Woei Chang, Kuei-Feng Chiang, Yun-Jun Gu