Patents by Inventor Kuei-feng Chiang
Kuei-feng Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9353996Abstract: A pressure difference driven heat spreader includes a chamber defined in a main body; a vaporizing section arranged in the chamber and including a plurality of first flow-guiding members spaced from one another to define first flow passages therebetween, the first flow passages each having at least one free end communicating with a free zone; a condensing section arranged in the chamber opposite to the vaporizing section and including a plurality of second flow-guiding members spaced from one another to define second flow passages therebetween; and an interconnecting section arranged between the vaporizing and condensing sections and having first and second communicating holes for communicating the vaporizing section with the condensing section. The condensing section functions as a low-pressure end, so that a pressure gradient is produced in the pressure difference driven heat spreader to drive steam-water circulation therein, and no wick structure is needed for driving the working fluid.Type: GrantFiled: August 30, 2010Date of Patent: May 31, 2016Assignee: Asia Vital Components Co., Ltd.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Publication number: 20160081226Abstract: A heat dissipation structure for mobile device includes an element holding member internally defining a first receiving space, in which a plurality of electronic elements of a mobile device is mounted; and a heat dissipation layer formed on at least one side of each of the electronic elements. The heat dissipation layer is formed on one side of each of the electronic elements through a micro arc oxidation (MAO) process, a plasma electrolytic oxidation (PEO) process, an anodic spark deposition (ASD) process, or an anodic oxidation by spark deposition (ANOF) process. Therefore, heat produced by the electronic elements in the mobile device can be quickly removed away from the electronic elements via the heat dissipation layer.Type: ApplicationFiled: September 11, 2014Publication date: March 17, 2016Inventor: Kuei-Feng Chiang
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Publication number: 20160073553Abstract: A heat dissipation structure of handheld device includes a carrier body. The carrier body has a first receiving space. The first receiving space has a heat absorption section and a heat dissipation section. The heat dissipation section is adjacent to the heat absorption section and formed with a heat dissipation layer. The heat absorption section is able to quickly absorb the heat generated by the electronic components carried by the carrier body and transfer the heat to the heat dissipation layer of the heat dissipation section so as to quickly dissipate the heat.Type: ApplicationFiled: September 5, 2014Publication date: March 10, 2016Inventor: Kuei-Feng Chiang
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Publication number: 20150308436Abstract: A thin fan structure includes a case, a fan impeller, a circuit board, a silicon steel sheet and a winding assembly. The case has a receiving space and a bearing cup protruding into the receiving space. The bearing cup is formed with a bearing hole. The fan impeller has a hub section, multiple blades and a shaft extending from a center of the hub section. A magnetic member is annularly disposed on inner circumference of the hub section. The circuit board is disposed in the receiving space. The silicon steel sheet disposed on the circuit board has a base section and multiple first magnetic conductive sections, which together define a receiving space. The winding assembly is fixedly disposed in the receiving space. The winding assembly has a bottom section attached to the base section and a side section attached to the first magnetic conductive sections.Type: ApplicationFiled: April 23, 2014Publication date: October 29, 2015Applicant: Asia Vital Components Co., Ltd.Inventor: Kuei-Feng Chiang
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Patent number: 9074823Abstract: A thermal siphon structure includes a main body, a chamber disposed therein, an evaporation section, a condensation section and a connection section positioned between the evaporation section and condensation section. The evaporation section and condensation section are respectively arranged in the chamber on two sides thereof. The connection section has a set of first communication holes and a set of second communication holes in communication with the evaporation section and condensation section. The evaporation section and condensation section respectively have multiple first and second flow guide bodies, which are arranged at intervals to define therebetween first and second flow ways. Each of the first and second flow ways has a narrower end and a wider end. The first flow ways communicate with a free area. The condensation section is designed with a low-pressure end to create a pressure gradient for driving a working fluid to circulate without any capillary structure.Type: GrantFiled: August 16, 2010Date of Patent: July 7, 2015Assignee: Asia Vital Components Co., Ltd.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Patent number: 9071100Abstract: A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance.Type: GrantFiled: April 23, 2014Date of Patent: June 30, 2015Assignee: Asia Vital Components Co., Ltd.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Patent number: 9071098Abstract: A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance.Type: GrantFiled: July 11, 2011Date of Patent: June 30, 2015Assignee: Asia Vital Components Co., Ltd.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Patent number: 9065313Abstract: A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance.Type: GrantFiled: April 23, 2014Date of Patent: June 23, 2015Assignee: Asia Vital Components Co., Ltd.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Patent number: 8973646Abstract: A slim type pressure-gradient-driven low-pressure thermosiphon plate includes a main body closed by a cover. The main body includes a central heat receiving zone, a pressure accumulating zone and a first flow passage unit separately located at two opposite sides of the heat receiving zone, a free zone communicating with the pressure accumulating zone, a first and a second condensing zone communicating with the free zone, a third and a fourth condensing zone communicating with the first flow passage unit, a second flow passage unit located between and communicating with the first and the third condensing zone, and a third flow passage unit located between and communicating with the second and the fourth condensing zone. In the thermosiphon plate, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can transfer heat without any wick structure.Type: GrantFiled: August 30, 2010Date of Patent: March 10, 2015Assignee: Asisa Vital Components Co., Ltd.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang, Yun-Jun Gu
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Publication number: 20140265669Abstract: A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance.Type: ApplicationFiled: April 23, 2014Publication date: September 18, 2014Applicant: Asia Vital Components Co., Ltd.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Publication number: 20140232221Abstract: A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance.Type: ApplicationFiled: April 23, 2014Publication date: August 21, 2014Applicant: Asia Vital Components Co., Ltd.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Patent number: 8479805Abstract: A heat-dissipating assembly includes a body and a bottom plate. The body has a heat-absorbing portion. The interior of the heat-absorbing portion is provided with a chamber covered by the bottom plate. The chamber has an evaporating region for generating a high pressure, and a condensing region for generating a low pressure. The pressure gradient between the evaporating region and the condensing region is used to drive the circulation of liquid/vapor phase of a working fluid. With this structure, heat can be conducted rapidly without providing any wick structure.Type: GrantFiled: August 31, 2010Date of Patent: July 9, 2013Assignee: Asia Vital Components Co., Ltd.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Publication number: 20120248907Abstract: A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance.Type: ApplicationFiled: July 11, 2011Publication date: October 4, 2012Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Publication number: 20120247736Abstract: A loop heat pipe structure includes a transport pipe, an evaporator, a first wick layer, a second wick layer, and a plurality of grooves. The transport pipe communicates with the evaporator. The evaporator has a bottom and internally defines a first chamber and a second chamber, and has a working fluid filled therein. The first wick layer is located on the bottom, and the second wick layer is located on and covers the first wick layer. The grooves can be selectively provided on the first wick layer or the bottom. The first and second wick layers are so designed that the situation of very high vapor pressure would not occur in the second chamber, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.Type: ApplicationFiled: July 11, 2011Publication date: October 4, 2012Applicant: ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD.Inventors: Jun Xiang, Xiao-Xiang Zhou, Kuei-Feng Chiang
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Patent number: 8191614Abstract: A heat radiating unit is provided on a front face with at least one raised strip having a curved head portion and a neck portion, the neck portion being located at a joint of the raised strip and the heat radiating unit and having a width smaller than that of the curved head portion; and on a reverse face with at least one receiving groove opposite to the raised strip, the receiving groove having a curved recess portion and an engaging shoulder portion, and the engaging shoulder portion being located at a joint of the receiving groove and the heat radiating unit. A plurality of the heat radiating units can be assembled to provide a heat sink by engaging the curved head portion and the neck portion of one heat radiating unit with the curved recess portion and the engaging shoulder portion, respectively, of another heat radiating unit.Type: GrantFiled: September 9, 2009Date of Patent: June 5, 2012Assignee: Asia Vital Components Co., Ltd.Inventor: Kuei-Feng Chiang
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Publication number: 20120024499Abstract: A loop type pressure-gradient-driven low-pressure thermosiphon device includes a case sealed by a cover to define a chamber with a vaporizing section. The vaporizing section includes a plurality of spaced flow-guiding members and first flow passages formed between adjacent flow-guiding members. The flow passages respectively have at least one free end communicating with a free zone in the chamber. A pipeline is connected at two ends to two opposite sides of the case, and has a second flow passage communicable with the vaporizing section. The pipeline extends through at least one heat-dissipating element, so that the pipeline and the heat-dissipating element together define a condensing section. In the thermosiphon device, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can be driven to circulate and transfer heat in the pipeline and the case without any wick structure.Type: ApplicationFiled: December 15, 2010Publication date: February 2, 2012Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Publication number: 20120018137Abstract: A heat-dissipating assembly includes a body and a bottom plate. The body has a heat-absorbing portion. The interior of the heat-absorbing portion is provided with a chamber covered by the bottom plate. The chamber has an evaporating region for generating a high pressure, and a condensing region for generating a low pressure. The pressure gradient between the evaporating region and the condensing region is used to drive the circulation of liquid/vapor phase of a working fluid. With this structure, heat can be conducted rapidly without providing any wick structure.Type: ApplicationFiled: August 31, 2010Publication date: January 26, 2012Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Shyy-Woei CHANG, Kuei-Feng CHIANG
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Publication number: 20120018130Abstract: A thermal siphon structure includes a main body, a chamber disposed therein, an evaporation section, a condensation section and a connection section positioned between the evaporation section and condensation section. The evaporation section and condensation section are respectively arranged in the chamber on two sides thereof. The connection section has a set of first communication holes and a set of second communication holes in communication with the evaporation section and condensation section. The evaporation section and condensation section respectively have multiple first and second flow guide bodies, which are arranged at intervals to define therebetween first and second flow ways. Each of the first and second flow ways has a narrower end and a wider end. The first flow ways communicate with a free area. The condensation section is designed with a low-pressure end to create a pressure gradient for driving a working fluid to circulate without any capillary structure.Type: ApplicationFiled: August 16, 2010Publication date: January 26, 2012Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Publication number: 20120018131Abstract: A pressure difference driven heat spreader includes a chamber defined in a main body; a vaporizing section arranged in the chamber and including a plurality of first flow-guiding members spaced from one another to define first flow passages therebetween, the first flow passages each having at least one free end communicating with a free zone; a condensing section arranged in the chamber opposite to the vaporizing section and including a plurality of second flow-guiding members spaced from one another to define second flow passages therebetween; and an interconnecting section arranged between the vaporizing and condensing sections and having first and second communicating holes for communicating the vaporizing section with the condensing section. The condensing section functions as a low-pressure end, so that a pressure gradient is produced in the pressure difference driven heat spreader to drive steam-water circulation therein, and no wick structure is needed for driving the working fluid.Type: ApplicationFiled: August 30, 2010Publication date: January 26, 2012Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
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Publication number: 20120018128Abstract: A slim type pressure-gradient-driven low-pressure thermosiphon plate includes a main body closed by a cover. The main body includes a central heat receiving zone, a pressure accumulating zone and a first flow passage unit separately located at two opposite sides of the heat receiving zone, a free zone communicating with the pressure accumulating zone, a first and a second condensing zone communicating with the free zone, a third and a fourth condensing zone communicating with the first flow passage unit, a second flow passage unit located between and communicating with the first and the third condensing zone, and a third flow passage unit located between and communicating with the second and the fourth condensing zone. In the thermosiphon plate, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can transfer heat without any wick structure.Type: ApplicationFiled: August 30, 2010Publication date: January 26, 2012Applicant: ASIA VITAL COMPONENTS CO., LTD.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang, Yun-Jun Gu