Patents by Inventor Kuen Chang

Kuen Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154027
    Abstract: A high voltage semiconductor device includes a semiconductor substrate, a first drift region, a gate structure, a first sub gate structure, a first spacer structure, a second spacer structure, and a first insulation structure. The first drift region is disposed in the semiconductor substrate. The gate structure is disposed on the semiconductor substrate and separated from the first sub gate structure. The first sub gate structure and the first insulation structure are disposed on the first drift region. The first spacer structure is disposed on a sidewall of the gate structure. The second spacer structure is disposed on a sidewall of the first sub gate structure. At least a part of the first insulation structure is located between the first spacer structure and the second spacer structure. The first insulation structure is directly connected with the first drift region located between the first spacer structure and the second spacer structure.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hsin-Han Wu, Kai-Kuen Chang, Ping-Hung Chiang
  • Patent number: 11979479
    Abstract: A packet sorting and reassembly circuit module, including a header parser, an information processing circuit, at least one state tracking and reassembly circuit, and an output arbiter, is provided. The header parser is configured to analyze multiple first packet segments to obtain header information corresponding to a first network packet, wherein the first network packet is transmitted based on a transmission control protocol (TCP) communication protocol. The information processing circuit is configured to transmit the first packet segments and sideband information corresponding to the first packet segments to a first state tracking and reassembly circuit among the at least one state tracking and reassembly circuit according to the header information. The first state tracking and reassembly circuit is configured to reassemble and sort the first packet segments according to the sideband information. The output arbiter is configured to output the first packet segments according to a sorting result.
    Type: Grant
    Filed: January 16, 2023
    Date of Patent: May 7, 2024
    Assignees: Chung Yuan Christian University, KGI Securities Co. Ltd.
    Inventors: Yu-Kuen Lai, Chao-Lin Wang, He-Ping Li, Cheng-Han Chuang, Kai-Po Chang
  • Publication number: 20240137431
    Abstract: A packet sorting and reassembly circuit module, including a header parser, an information processing circuit, at least one state tracking and reassembly circuit, and an output arbiter, is provided. The header parser is configured to analyze multiple first packet segments to obtain header information corresponding to a first network packet, wherein the first network packet is transmitted based on a transmission control protocol (TCP) communication protocol. The information processing circuit is configured to transmit the first packet segments and sideband information corresponding to the first packet segments to a first state tracking and reassembly circuit among the at least one state tracking and reassembly circuit according to the header information. The first state tracking and reassembly circuit is configured to reassemble and sort the first packet segments according to the sideband information. The output arbiter is configured to output the first packet segments according to a sorting result.
    Type: Application
    Filed: January 16, 2023
    Publication date: April 25, 2024
    Applicants: Chung Yuan Christian University, KGI Securities Co. Ltd.
    Inventors: Yu-Kuen Lai, Chao-Lin Wang, He-Ping Li, Cheng-Han Chuang, Kai-Po Chang
  • Patent number: 11939432
    Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 26, 2024
    Assignee: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia Chang, Yunn-Kuen Chang, Wen-Yen Huang, Ging-Ho Hsiue, Hsieh-Chih Tsai, Shuian-Yin Lin, Nai-Sheng Hsu, Tzu-Yu Lin
  • Patent number: 11939431
    Abstract: The present invention relates to a composition comprising an amino acid-modified polymer, a carboxypolysaccharide, and may further include a metal ion for anti-adhesion and vector application. More specifically, the invention relates to a thermosensitive composition having enhanced mechanical and improved water-erosion resistant properties for efficiently preventing tissue adhesions and can serve as a vector with bio-compatible, bio-degradable/absorbable, and in-vivo sustainable properties.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 26, 2024
    Assignee: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia Chang, Yunn-Kuen Chang, Wen-Yen Huang, Ging-Ho Hsiue, Hsieh-Chih Tsai, Shuian-Yin Lin, Nai-Sheng Hsu, Tzu-Yu Lin
  • Patent number: 11921307
    Abstract: The present disclosure provides an optical element driving mechanism, which includes a movable part, a fixed assembly, and a driving assembly. The movable part is configured to be connected to an optical element. The movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the movable part to move relative to the fixed assembly. The movable part includes a connecting assembly configured to position the optical element.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: March 5, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Hsi Wang, Chao-Chang Hu, Chih-Wei Weng, Kuen-Wang Tsai, Tzu-Ying Chen
  • Patent number: 11923435
    Abstract: A high voltage semiconductor device includes a semiconductor substrate, a first drift region, a gate structure, a first sub gate structure, a first spacer structure, a second spacer structure, and a first insulation structure. The first drift region is disposed in the semiconductor substrate. The gate structure is disposed on the semiconductor substrate and separated from the first sub gate structure. The first sub gate structure and the first insulation structure are disposed on the first drift region. The first spacer structure is disposed on a sidewall of the gate structure. The second spacer structure is disposed on a sidewall of the first sub gate structure. At least a part of the first insulation structure is located between the first spacer structure and the second spacer structure. The first insulation structure is directly connected with the first drift region located between the first spacer structure and the second spacer structure.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: March 5, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hsin-Han Wu, Kai-Kuen Chang, Ping-Hung Chiang
  • Publication number: 20240069299
    Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Chao-Chang HU, Kuen-Wang TSAI, Liang-Ting HO, Chao-Hsi WANG, Chih-Wei WENG, He-Ling CHANG, Che-Wei CHANG, Sheng-Zong CHEN, Ko-Lun CHAO, Min-Hsiu TSAI, Shu-Shan CHEN, Jungsuck RYOO, Mao-Kuo HSU, Guan-Yu SU
  • Publication number: 20230320607
    Abstract: A method of evaluating core muscles by bioimpedance technology, includes the steps of: (a) measuring the resistance and reactance of a subject by a bioimpedance measuring instrument, and obtaining the subject's age, gender, and impedance factor (h2/Z), and (b) calculating the subject's core muscles by the following formula: BIA=a?b×age+c×h2/Z+d×Sex. Thereby, the present invention measures the cross-sectional area of the core muscles by means of bioimpedance analysis. The core muscles can be evaluated by the cross-sectional area of the core muscles, which can effectively reduce the measurement cost, reduce the measurement time and improve the convenience of measurement.
    Type: Application
    Filed: May 26, 2022
    Publication date: October 12, 2023
    Inventors: CHUAN-CHUNG TSAI, KUEN-CHANG HSIEH
  • Publication number: 20230307524
    Abstract: A high voltage semiconductor device includes a semiconductor substrate, a first drift region, a gate structure, a first sub gate structure, a first spacer structure, a second spacer structure, and a first insulation structure. The first drift region is disposed in the semiconductor substrate. The gate structure is disposed on the semiconductor substrate and separated from the first sub gate structure. The first sub gate structure and the first insulation structure are disposed on the first drift region. The first spacer structure is disposed on a sidewall of the gate structure. The second spacer structure is disposed on a sidewall of the first sub gate structure. At least a part of the first insulation structure is located between the first spacer structure and the second spacer structure. The first insulation structure is directly connected with the first drift region located between the first spacer structure and the second spacer structure.
    Type: Application
    Filed: April 18, 2022
    Publication date: September 28, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hsin-Han Wu, Kai-Kuen Chang, Ping-Hung Chiang
  • Publication number: 20230253481
    Abstract: A fabricating method of a high voltage transistor includes providing a high voltage transistor. The high voltage transistor includes a substrate. A gate structure is disposed on the substrate. A source drift region and a drain drift region are respectively disposed at two sides of the gate structure and embedded within the substrate. A source is disposed in the source drift region. A drain is disposed within the drain drift region. The steps of fabricating the drain drift region include defining a drain drift region predetermined region on the substrate by using a photo mask. The photo mask includes a first comb-liked pattern. The first comb-liked pattern includes a first rectangle and numerous first tooth structures. Then, an ion implantation process is performed to implant dopants into the drain drift region predetermined region. Then, dopants in the drain drift region predetermined region are diffused to form the drain drift region.
    Type: Application
    Filed: March 7, 2022
    Publication date: August 10, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventor: Kai-Kuen Chang
  • Publication number: 20230240620
    Abstract: A data integration system of a body composition analyzer includes a high-precision body composition analyzer, a low-precision body composition analyzer, and a computing device. The computing device is used to calculate a deviation value between the high-precision body composition analyzer and the low-precision body composition analyzer, and correct the data generated by the low-precision body composition analyzer through the deviation value so as to obtain more accurate body composition data.
    Type: Application
    Filed: January 25, 2023
    Publication date: August 3, 2023
    Inventors: KUEN-CHANG HSIEH, CHIH-CHING TSAI, SHIN-TA LIN
  • Publication number: 20230129145
    Abstract: A body composition analysis system having image scanning function includes an image capturing device, a body composition analyzer having a stand platform with two first electrode sets, two handrails and a calculating unit electrically connected with the image capturing device, and a control panel. Each handrail has a telescopic rod and a handle having a second electrode set. An end of each telescopic rod is pivotably attached to the stand platform. Each handle is disposed at another end of each telescopic rod. The calculating unit includes a body shape module database and a calculational logic, receives resistance and reactance measured by the first and second electrode sets and image data obtained by the image capturing device, and after comparing the image data with the body shape module database, calculates by the calculational logic to obtain a body composition data to be shown on the control panel.
    Type: Application
    Filed: October 26, 2022
    Publication date: April 27, 2023
    Inventors: Kuen-Chang Hsieh, Chih-Ching Tsai
  • Publication number: 20220280059
    Abstract: A method of bioimpedance technology to evaluate local or whole body bone mineral density includes the steps of (a) measuring the resistance and reactance of a subject by a bioimpedance measuring instrument and obtaining the height of the subject, and (b) calculating the bone mineral density of the local or whole body of the subject by the formula: BMD=a+b R/H+d Xc/H, where a, b, and d are weighting coefficients, R is the resistance of the subject; Xc is the reactance of the subject; H is the height of the subject. This can achieve the advantages of reducing measurement costs and rapid measurement.
    Type: Application
    Filed: March 4, 2022
    Publication date: September 8, 2022
    Inventor: Kuen-Chang HSIEH
  • Publication number: 20220280103
    Abstract: A method of bioimpedance vector analysis technology to evaluate local or whole body bone mineral density includes the steps of (a) measuring the resistance and reactance of a subject with a bioimpedance measuring instrument, obtaining the height of the subject, and then dividing the height of the subject by the resistance to obtain a first value and dividing the height of the subject by the reactance to obtain a second value, and (b) comparing the first value and the second value with a bioimpedance vector analysis chart to evaluate the local or whole body bone mineral density of the subject. This method is convenient to use.
    Type: Application
    Filed: March 4, 2022
    Publication date: September 8, 2022
    Inventor: Kuen-Chang Hsieh
  • Publication number: 20210330867
    Abstract: The present invention relates to a composition comprising an amino acid-modified polymer, a carboxypolysaccharide, and may further include a metal ion for anti-adhesion and vector application. More specifically, the invention relates to a thermosensitive composition having enhanced mechanical and improved water-erosion resistant properties for efficiently preventing tissue adhesions and can serve as a vector with bio-compatible, bio-degradable/absorbable, and in-vivo sustainable properties.
    Type: Application
    Filed: April 23, 2021
    Publication date: October 28, 2021
    Applicant: PRO-VIEW BIOTECH CO., LTD.
    Inventors: Yu-Chia CHANG, Yunn-Kuen CHANG, Wen-Yen HUANG, Ging-Ho HSIUE, Hsieh-Chih TSAI, Shuian-Yin LIN, Nai-Sheng HSU, Tzu-Yu LIN
  • Publication number: 20210332193
    Abstract: Synthetic amino acid-modified polymers and methods of making the same and using the same are disclosed. The synthetic amino acid-modified polymers possess distinct thermosensitive, improved water-erosion resistant, and enhanced mechanical properties, and are suitable of reducing or preventing formation of postoperative tissue adhesions. Additionally, the amino acid-modified polymers can also be used as a vector to deliver pharmaceutically active agents.
    Type: Application
    Filed: April 23, 2021
    Publication date: October 28, 2021
    Applicant: PRO-VIEW BIOTECH CO., LTD.
    Inventors: Yu-Chia CHANG, Yunn-Kuen CHANG, Wen-Yen HUANG, Ging-Ho HSIUE, Hsieh-Chih TSAI, Shuian-Yin LIN, Nai-Sheng HSU, Tzu-Yu LIN
  • Patent number: D999765
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: September 26, 2023
    Assignee: HTC CORPORATION
    Inventors: Shu-Kuen Chang, Natalia Amijo, Ian James McGillivray, Chin-Wei Chou, Yi-Shen Wang, Chih-Sung Fang, Hung-Yu Chen
  • Patent number: D1009034
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: December 26, 2023
    Assignee: HTC Corporation
    Inventors: Shu-Kuen Chang, Natalia Amijo, Ian James McGillivray, Chin-Wei Chou, Yi-Shen Wang, Chih-Sung Fang, Hung-Yu Chen
  • Patent number: D1018537
    Type: Grant
    Filed: November 7, 2023
    Date of Patent: March 19, 2024
    Assignee: HTC CORPORATION
    Inventors: Shu-Kuen Chang, Natalia Amijo, Ian James McGillivray, Chin-Wei Chou, Yi-Shen Wang, Chih-Sung Fang, Hung-Yu Chen