Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises mixing a polyamic acid resin having a CTE value after imidization of more than 20 ppm and a polyamic acid resin having a CTE value after imidization of less than 20 ppm in a certain ratio, and coating the mixture on a metal foil, then subjecting the polyamic acids to imidization, to obtain the polyimide composite flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a coefficient of thermal expansion (CTE) after imidization of more than 20 ppm and less than 20 ppm on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, to produce a polyimide composite flexible board, which is used as a printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a glass transition temperature of from 280 to 330° C. and from 190 to 280° C. after imidization on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with each other or with another metal foil under high temperature to produce a two-metal-side printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability without using an adhering agent.

Abstract: The present invention relates to a flame-retarding thermosetting resin composition, which comprises at least one silicate-copolymerized composite as filler and can be used as mechanical, electrical and electronic parts, molded and/or packaging resin for semiconductor and so on, etc. By adding such silicate-copolymerized composite, the resin composition of the present invention has improved flam retardance and heat resistance and has an excellent moldability and reliance under circumstances without adding any other flame-retarding material.

Abstract: A nonflammable resin composition comprises (A) at least an epoxy resin with biphenyl unit or naphthyl unit; (B) at least a phenolic resin used as a hardener, wherein the phenolic resin has a skeleton formed by phenyl rings bonding directly each other without interruption, and is in an amount of 30 to 100% by weight based on total hardeners; and (C) a curing catalyst. The said nonflammable resin has an excellent flame retardancy, a good heat resistance, and an improved moldability and reliability.

Abstract: This invention relates to a negative photoresist composition with multi-reaction models. When the photoresist composition according to the present invention is used in photolithography processes employing UV light to produce cross-link reactions and multi-reactions including radical polymerization and cationic polymerization also occur. The photoresist composition can be used to control light reaction efficiency and increase reaction thoroughness, thus obtaining a high resolution pattern.

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids each having a glass transition temperature of from 280 to 300° C., from 300 to 350° C., and from 190 to 280° C. after imidization on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, and then pressing the polyimide-containing metal foil with a metal foil under high temperature to produce a two-metal-side printed circuit flexible board. According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability without using an adhering agent.

Abstract: The present invention relates to a novel phenolic resin, which is characterized that the content of free bisphenol contained therein is not more than 5 wt %, and it has a narrow molecular weight distribution represented by Mw/Mn that is not more than 2.0. The present invention also relates to a method for preparing the novel phenolic resin described above and an epoxy resin composition in which the phenolic resin is used as a curing agent.

Abstract: The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a high heat-resistance and excellent adhesion and is useful as adhesive agent in flexible printed circuit board.

Abstract: Disclosed is an azaoxa heterocyclic compound represented by the following formula (I): (wherein, each symbol is defined the same as in the specification) and a method for preparing the same. This compound of the present invention is prepared by the reaction of a phenolic compound, an aromatic diamine compound and an aldehyde compound. The azaoxa heterocyclic compound of the present invention can be used as a hardening resin or a hardener for an epoxy resin, polyether and a resin containing active hydrogen atoms, wherein the composition formed by the azaoxa heterocyclic compound and the epoxy resin is useful in the application of laminates, adhesive, semiconductor packaging materials and phenolic resin forming materials.

Abstract: The present invention relates to a method for preparing amino phosphate flame retardants. Melamine and phosphoric acid substances are used as a starting material, AND then the starting material reacts in the absence of solvents at a temperature ranging from 40 to 200° C. to obtain powdery amino phosphate compounds used as flame retardants. Since the reaction free of solvents is carried out under a condition of lower temperature, the powdery amino phosphate compounds can be obtained without drying steps. Therefore, not only the contaminations caused by solvent volatilization can be avoided, but also the process of preparing the product is simplified and the cost of the product is reduced.

Abstract: The present invention relates to a polyamic acid resin composition, which is characterized by containing nanolayer silica sheet and/or nanometer silica powder. The present invention also relates to a polyimide film prepared from the composition, the resultant film exhibits improved dimension stability, low water-absorbability, high transparency, and low Coefficient of Thermal Expansion (CTE) value and is suitable used in flexible print wiring board and wiring board for liquid crystal display (LCD).

Abstract: The present invention provides a polyimide resin, which is prepared by epolycondensing a dianhydride monomer including at least a dianhydride represented by formula (I) wherein R is O or O(CH2)nO, n is an integer of 1 to 2 and a diamine monomer represented by formula (II) H2N—Ar—NH2 ??(II) wherein Ar is defined as in the text then imidizing the resulting polyamic acid resin to form a polyimide resin. Through using the dianhydride represented by formula (I) as the polymerizing unit, a biphenyl moiety and an ester moiety are introduced into the main chain of the polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller linear thermal expansion coefficient and therefore have satisfactory heat resistance and dimensional stability, in addition, become more soluble in organic solvents.

Abstract: The present invention provides a polyimide resin formed by polycondensating a dianhydride monomer including at least a dianhydride monomer represented by formula (I) and a diamine monomer to form a polyamic acid resin, and then cyclodehydrating the polyamic acid. Through using the dianhydride monomer of formula (I) as the polymerizing unit, a biphenyl moiety is introduced into the main chain of polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller thermal expansion coefficient, as well as satisfactory heat resistance and dimensional stability.

Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): wherein, each symbol is defined as in the specification. The halogen-free resin composition of the present invention has excellent thermal resistance and flame retardant property, and is thereby suitably useful in the application of adhesives, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials, and the like.

Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: (1) the phosphorus-containing epoxy resin, (2) a halogen-free hardener having a reactive hydrogen capable of reacting with the epoxy group in epoxy resin, and (3) a hardener promoter. The flame-retardant resin composition described above has improved excellent heat resistance and flame retardant property, and is especially suitable for adhesive laminates, composite materials, printed circuit boards, adhesive material for copper foils, and is suitable for IC packaging materials.

Abstract: A positive photoresist with uniform reactivity for use in a thick film lithography process, includes thermal curing during soft-baking and photo dissociation through UV exposure. The positive photoresist comprises a phenolic resin, a resin with acid labile groups, a photoacid generator (PAG), and a reactive monomer with vinyl ether or epoxy group. First, the resins react with the reactive monomer to perform a thermal curing step by soft-baking to form network polymers. In the UV lithography process, the exposed network polymers perform both deprotection and depolymerization simultaneously and are rendered alkali-soluble. The resulting photoresist patterns have a high aspect ratio and resolution profile, due to the good alkali dissolution contrast and uniform reactivity.

Abstract: A phosphorus-containing compound represented by formula (I) and a preparation method thereof are provided. An addition reaction is performed for an organic cyclic phosphorus compound with an aryl aldehyde compound, and then a condensation reaction is performed with an aryl compound having active hydrogen in the use of an organic acid as a catalyst to obtain the proposed phosphorus-containing compound. This phosphorus-containing compound can be used as a hardener for resin, and improves flame retardant properties and thermal resistance for a flame retardant epoxy resin composition, thereby suitably applied to resin compositions used for manufacturing printed circuit boards and laminated circuit boards in electronic or electric products.

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

Abstract: Disclosed is an azaoxa heterocyclic compound represented by the following formula (I): (wherein, each symbol is defined the same as in the specification) and a method for preparing the same. This compound of the present invention is prepared by the reaction of a phenolic compound, an aromatic diamine compound and an aldehyde compound. The azaoxa heterocyclic compound of the present invention can be used as a hardening resin or a hardener for an epoxy resin, polyether and a resin containing active hydrogen atoms, wherein the composition formed by the azaoxa heterocyclic compound and the epoxy resin is useful in the application of laminates, adhesive, semiconductor packaging materials and phenolic resin forming materials.