Abstract: A positive photoresist WITHuniform reactivity for use in a thick film lithography process, includes thermal curing during soft-baking and photo dissociation through UV exposure. The positive photoresist comprises a phenolic resin, a resin with acid labile groups, a photoacid generator (PAG), and a reactive monomer with vinyl ether or epoxy group. First, the resins react with the reactive monomer to perform a thermal curing step by soft-baking to form network polymers. In the UV lithography process, the exposed network polymers perform both deprotection and depolymerization simultaneously and are rendered alkali-soluble. The resulting photoresist patterns have a high aspect ratio and resolution profile, due to the good alkali dissolution contrast and uniform reactivity.

Abstract: An epoxy resin composition containing (A) at least two kinds of epoxy resins, wherein the epoxy resin represented by Formula (I) is in an amount of 10 to 90% by weight based on the total amount of the epoxy resins, (B) a hardener and (C) a hardening accelerator is proposed: 1

Abstract: The present invention relates to a flame retarded epoxy resin composition, which is characterized by that said flame retarded epoxy resin composition comprising: (A) at least one type of epoxy resin; (B) a phosphorus-and-nitrogen-containing heterocyclic compound, said compound having a moiety which can react with the epoxy group of the epoxy resin, usedful as a hardening agent, and having a structure as shown by formula (I): wherein m is an integer of from 0 to 2, n is an integer of from 3 to 7, but at least one m is not 2. The epoxy resin composition consisting of the above components (A) and (B) has improved flame retarded property and thus is suitably used as the flame retarded material required for the parts of composite material, laminated plates, printed circuit boards, electronic products, electrical products, and the like.

Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): 1

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): 1

Abstract: This invention relates to a negative photoresist composition with multi-reaction models. When the photoresist composition according to the present invention is used in photolithography processes employing UV light to produce cross-link reactions and multi-reactions including radical polymerization and cationic polymerization also occur. The photoresist composition can be used to control light reaction efficiency and increase reaction thoroughness, thus obtaining a high resolution pattern.

Abstract: A phosphorus-containing compound represented by formula (I) and a preparation method thereof are provided. An addition reaction is performed for an organic cyclic phosphorus compound with an aryl aldehyde compound, and then a condensation reaction is performed with an aryl compound having active hydrogen in the use of an organic acid as a catalyst to obtain the proposed phosphorus-containing compound. This phosphorus-containing compound can be used as a hardener for resin, and improves flame retardant properties and thermal resistance for a flame retardant epoxy resin composition, thereby suitably applied to resin compositions used for manufacturing printed circuit boards and laminated circuit boards in electronic or electric products.

Abstract: Disclosed is a flame retarding resin composition comprising (A) one or more epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of the component B is a phosphorus-containing compound represented by the following formula (I): 1

Abstract: Disclosed is an azaoxa heterocyclic compound represented by the following formula (I): 1

Abstract: The present invention discloses a phosphorus- and nitrogen-containing resin hardener, which has a structure represented by the following formula: 1

Abstract: The present invention relates to a flame retarded epoxy resin composition, which is characterized by that said flame retarded epoxy resin composition comprising:

Abstract: The present invention relates to a flame retarded epoxy resin composition, which is characterized by that said flame retarded epoxy resin composition comprising: (A) at least one type of epoxy resin; (B) a phosphorus-and-nitrogen-containing heterocyclic compound, said compound having a moiety which can react with the epoxy group of the epoxy resin, usedful as a hardening agent, and having a structure as shown by formula (I):  wherein m is an integer of from 0 to 2, n is an integer of from 3 to 7, but at least one m is not 2. The epoxy resin composition consisting of the above components (A) and (B) has improved flame retarded property and thus is suitably used as the flame retarded material required for the parts of composite material, laminated plates, printed circuit boards, electronic products, electrical products, and the like.

Abstract: The present invention relates to a nitrogen-containing epoxy resin of the following formula: wherein R's are the same or different and each represents a hydrogen atom or —R13—C6-10 aryl-(OR14)p, and the aryl group is optionally substituted with C1-6 alkyl group, in which R13 represents a C1-6 alkylene group or a phenylene —CH2— group optionally substituted with a hydroxy group, R14 represents a glycidyl group, and p is an integer of 1 or 2, provided that at least one R group is not a hydrogen atom; R1 represents a phenyl group or —N(R)2 group in which R is defined as above. The resin is produced from sequentially reacting melamine derivatives with aldehydes, phenolic compounds, and epihalohydrin.

Abstract: The present invention discloses a phosphorus- and nitrogen-containing resin hardener, which has a structure represented by the following formula: wherein R2 represents a hydrogen atom or a group represented by the following formula: wherein n is an integer of from 0 to 20, and R represents phenylene, naphthylene or a group represented by the following formula: wherein A represents —O—, —S—, —SO2—, —CO—, —CH2—, —C(CH3)2— or a group represented by the following formula: provided that at least one R2 is not a hydrogen atom; and R1 represents NHR2, C1-6alkyl or phenyl; in the above groups represented by R and A, the aromatic group can be substituted by one or more substituents selected from the group consisting of hydroxy, amino, carboxy and C1-6alkyl. The present invention also discloses a flame retarding composition containing said hardener.

Abstract: The present invention relates to a phosphorous-containing flame retarding epoxy resin and their composition comprising the nitrogen-containing flame retarding epoxy resin. More specifically, the present invention relates to a flame retarding epoxy resin having a pendent phosphorous-containing functional group and their composition comprising the nitrogen-containing flame retarding epoxy resin. The flame retarding phosphorous-containing epoxy resin and the epoxy resin composition containing the same of the present invention possess excellent flame retarding property and heat resistance without containing halogen and diantimony trioxide. Therefore they are useful as an encapsulating material in the semiconductor industry and the cured article prepared from the composition exhibits excellent molding ability and excellent reliance.

Abstract: The present invention relates to a nitrogen-containing epoxy resin of the following formula: 1

Abstract: A phosphorus-containing resin and a flame retardant resin composition containing the same are proposed. The flame retardant resin composition includes a phosphorus-containing resin, a nitrogen-containing resin hardener and a hardening promoter. Since the flame retardant resin composition has an excellent flame retardant property and heat resistance with no halogens contained and no additional flame retardant additives added therein, it can be used for producing prepregs, composite materials, laminates, printed circuit boards, copper foil adhesives, and packaging materials for semiconductors.

Abstract: This invention discloses a novel phosphorus-containing polymer having phenolic units.

Abstract: A phosphorus-containing polymer having phenolic units and an epoxy rein composition are provided. The epoxy resin composition suitably comprises an epoxy resin and a hardener, wherein the epoxy resin may be obtained by reacting the polymer with epihalohydrin, and the polymer may further act as the hardener.

Abstract: The present invention relates to a flame retarded epoxy resin composition, which is characterized by that said flame retarded epoxy resin composition comprising: