Abstract: Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.

Abstract: Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.

Abstract: A semiconductor pick and place apparatus comprises: a pick arm having a main body, and a conduit incorporated in the main body for permitting fluid flow through the main body via the conduit, the conduit further defining a holding orifice which is operative in use to secure a semiconductor die, the conduit being configured to convey light received from one side of the pick arm through the holding orifice and an alignment window located on the main body to an opposite side of the pick arm.

Abstract: A semiconductor pick and place apparatus comprises: a pick arm having a main body, and a conduit incorporated in the main body for permitting fluid flow through the main body via the conduit, the conduit further defining a holding orifice which is operative in use to secure a semiconductor die, the conduit being configured to convey light received from one side of the pick arm through the holding orifice and an alignment window located on the main body to an opposite side of the pick arm.

Abstract: A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.

Abstract: A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

Abstract: The invention provides an apparatus for determining a bonding position of a die. The apparatus includes a bond head for picking up and bonding the die. The apparatus further includes a plurality of cameras positioned and configured for capturing at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. Further, the invention provides a method of determining a bonding position of a die. The method captures at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. The method further determines a bonding position of the die based on the captured images.

Abstract: The invention provides an apparatus for determining a bonding position of a die. The apparatus includes a bond head for picking up and bonding the die. The apparatus further includes a plurality of cameras positioned and configured for capturing at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. Further, the invention provides a method of determining a bonding position of a die. The method captures at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. The method further determines a bonding position of the die based on the captured images.

Abstract: A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. The light reflecting module is operable to reflect an image of the reference feature to an image capturing module such that the reference feature appears to the light reflecting module to be in focus at a virtual position that is equivalent to a position at the pick-up location and/or the placement location.

Abstract: A die tester comprising a testing table on which a plurality of dice arranged in an array are mountable, and a first probe and a second probe that are adjustable to a fixed position with a fixed separation distance between the first probe and the second probe. The fixed position corresponds to predetermined test points on the plurality of dice, and the testing table and the first and second probes are movable relative to each other so as to position test points of a first die of the plurality of dice to the first probe and the second probe for testing the first die. The die tester further comprises movable third and fourth probes that are movable relative to each other and positionable to test points on a second die of the plurality of dice for testing the second die.

Abstract: A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.

Abstract: A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. The light reflecting module is operable to reflect an image of the reference feature to an image capturing module such that the reference feature appears to the light reflecting module to be in focus at a virtual position that is equivalent to a position at the pick-up location and/or the placement location.

Abstract: A die tester comprising a testing table on which a plurality of dice arranged in an array are mountable, and a first probe and a second probe that are adjustable to a fixed position with a fixed separation distance between the first probe and the second probe. The fixed position corresponds to predetermined test points on the plurality of dice, and the testing table and the first and second probes are movable relative to each other so as to position test points of a first die of the plurality of dice to the first probe and the second probe for testing the first die. The die tester further comprises movable third and fourth probes that are movable relative to each other and positionable to test points on a second die of the plurality of dice for testing the second die.

Abstract: A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

Abstract: Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.

Abstract: Disclosed is a bonding apparatus, comprising: i) a supporting device for supporting a supply of electronic devices; ii) an ejecting device for ejecting an electronic device from the supply of electronic devices; iii) a plurality of delivery devices, each delivery device being for delivering a substrate for bonding the electronic devices thereto; and iv) a plurality of transfer devices, each transfer device having a rotary transfer arm operable to transfer the electronic devices from the supply of electronic devices at one or more pick locations to a respective one of the substrates for bonding thereto, upon the electronic devices being ejected by the ejecting device from the supply of electronic devices at the one or more pick locations. A method of bonding electronic devices to substrates is also disclosed.

Abstract: Disclosed is an optical apparatus for locating a plurality of placement positions on a carrier object. The optical apparatus comprises: i) an imaging device having a plurality of imaging sensors, each imaging sensor being operative to capture an image of a part of a selected row of placement positions on the carrier object and the plurality of imaging sensors defining a combined field of view that includes all the selected row of placement positions; ii) a positioning device coupled to the imaging device, the positioning device being operative to position the imaging device relative to successive rows of placement positions on the carrier object; and iii) a processor connected to the imaging device and which is configured to receive the images captured by the plurality of imaging sensors for image processing in order to identify exact locations of the placement positions comprised in the selected row of placement positions.

Abstract: Disclosed is an optical apparatus for locating a plurality of placement positions on a carrier object. The optical apparatus comprises: i) an imaging device having a plurality of imaging sensors, each imaging sensor being operative to capture an image of a part of a selected row of placement positions on the carrier object and the plurality of imaging sensors defining a combined field of view that includes all the selected row of placement positions; ii) a positioning device coupled to the imaging device, the positioning device being operative to position the imaging device relative to successive rows of placement positions on the carrier object; and iii) a processor connected to the imaging device and which is configured to receive the images captured by the plurality of imaging sensors for image processing in order to identify exact locations of the placement positions comprised in the selected row of placement positions.

Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

Abstract: Method and apparatus for fabricating a light-emitting diode package Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.